JPH01161341U - - Google Patents
Info
- Publication number
- JPH01161341U JPH01161341U JP5710488U JP5710488U JPH01161341U JP H01161341 U JPH01161341 U JP H01161341U JP 5710488 U JP5710488 U JP 5710488U JP 5710488 U JP5710488 U JP 5710488U JP H01161341 U JPH01161341 U JP H01161341U
- Authority
- JP
- Japan
- Prior art keywords
- transistor
- emitter
- chip
- directly fixed
- metal base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4911—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain
- H01L2224/49111—Disposition the connectors being bonded to at least one common bonding area, e.g. daisy chain the connectors connecting two common bonding areas, e.g. Litz or braid wires
Landscapes
- Bipolar Transistors (AREA)
Description
第1図は、この考案によるトランジスタモジユ
ールの一実施例の内部構造を示すもので、第1図
aは平面図、第1図bは側面図である。第2図は
第1図に示したトランジスタモジユールの等価回
路図である。第3図は第2図に示した等価回路の
トランジスタモジユールの従来例の内部構造を示
すもので、第3図aは平面図、第3図bは側面図
である。第4図は、この考案によるトランジスタ
モジユールの異なる実施例の内部構造を示す平面
図である。
1……トランジスタチツプ、2……ダイオード
チツプ、3……金属ベース、4……エミツタ用引
出し導体、5……ベース用引出し導体、6……絶
縁板、7……ワイヤー。
FIG. 1 shows the internal structure of an embodiment of a transistor module according to this invention, with FIG. 1a being a plan view and FIG. 1b being a side view. FIG. 2 is an equivalent circuit diagram of the transistor module shown in FIG. 1. FIG. 3 shows the internal structure of a conventional example of the transistor module of the equivalent circuit shown in FIG. 2, with FIG. 3a being a plan view and FIG. 3b being a side view. FIG. 4 is a plan view showing the internal structure of a different embodiment of the transistor module according to this invention. DESCRIPTION OF SYMBOLS 1... Transistor chip, 2... Diode chip, 3... Metal base, 4... Outgoing conductor for emitter, 5... Outgoing conductor for base, 6... Insulating plate, 7... Wire.
Claims (1)
着されたトランジスタチツプと、このトランジス
タチツプのコレクタとエミツタとの間に接続され
たフライホイール用ダイオードチツプと、前記ト
ランジスタチツプのエミツタに接続されたエミツ
タ用引出し導体とがそれぞれ備えられたトランジ
スタモジユールにおいて、金属ベースの前記トラ
ンジスタチツプとは異なる位置に前記ダイオード
チツプがそのカソード側を下にして直接固着され
、対向するそのアノード側にはエミツタ用引出し
導体が載置されて直接固着されていることを特徴
とするトランジスタモジユール。 A transistor chip directly fixed onto a metal base with the collector side facing down, a flywheel diode chip connected between the collector and emitter of this transistor chip, and an emitter connected to the emitter of the transistor chip. In the transistor module, the diode chip is directly fixed with its cathode side down in a position different from the transistor chip on the metal base, and an emitter drawer is provided on the opposite anode side of the transistor module. A transistor module characterized in that a conductor is mounted and directly fixed.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5710488U JPH01161341U (en) | 1988-04-27 | 1988-04-27 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP5710488U JPH01161341U (en) | 1988-04-27 | 1988-04-27 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01161341U true JPH01161341U (en) | 1989-11-09 |
Family
ID=31282959
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP5710488U Pending JPH01161341U (en) | 1988-04-27 | 1988-04-27 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01161341U (en) |
-
1988
- 1988-04-27 JP JP5710488U patent/JPH01161341U/ja active Pending
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