JPH0116012B2 - - Google Patents

Info

Publication number
JPH0116012B2
JPH0116012B2 JP24274486A JP24274486A JPH0116012B2 JP H0116012 B2 JPH0116012 B2 JP H0116012B2 JP 24274486 A JP24274486 A JP 24274486A JP 24274486 A JP24274486 A JP 24274486A JP H0116012 B2 JPH0116012 B2 JP H0116012B2
Authority
JP
Japan
Prior art keywords
protective film
wafer
moving plate
protruding blade
movable plate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP24274486A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6396907A (ja
Inventor
Ryoji Wakabayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP61242744A priority Critical patent/JPS6396907A/ja
Publication of JPS6396907A publication Critical patent/JPS6396907A/ja
Publication of JPH0116012B2 publication Critical patent/JPH0116012B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61242744A 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置 Granted JPS6396907A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61242744A JPS6396907A (ja) 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61242744A JPS6396907A (ja) 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置

Publications (2)

Publication Number Publication Date
JPS6396907A JPS6396907A (ja) 1988-04-27
JPH0116012B2 true JPH0116012B2 (enExample) 1989-03-22

Family

ID=17093611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61242744A Granted JPS6396907A (ja) 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置

Country Status (1)

Country Link
JP (1) JPS6396907A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080838A (ja) * 2008-09-29 2010-04-08 Lintec Corp シート貼付装置及び貼付方法

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852241B2 (en) 2001-08-14 2005-02-08 Lexmark International, Inc. Method for making ink jet printheads
JP4840333B2 (ja) * 2007-11-12 2011-12-21 株式会社デンソー テープ貼り付け装置及びテープ貼り付け方法
JP2009212173A (ja) * 2008-03-03 2009-09-17 Csun Mfg Ltd ウエハフィルム裁断装置
KR100918485B1 (ko) 2009-03-10 2009-09-24 김중섭 테이프 부착장치
JP5126986B2 (ja) * 2009-08-01 2013-01-23 昌己 浦 シート貼付装置
JP5011364B2 (ja) * 2009-10-20 2012-08-29 志聖工業股▲ふん▼有限公司 ウェハーラミネートダイシングソー
US8069893B2 (en) * 2010-02-03 2011-12-06 Lai Chin-Sen Cutting mechanism for dry film laminator
CN107200301B (zh) * 2017-05-23 2019-02-12 中国科学院微电子研究所 一种mems晶片的贴膜对准装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080838A (ja) * 2008-09-29 2010-04-08 Lintec Corp シート貼付装置及び貼付方法

Also Published As

Publication number Publication date
JPS6396907A (ja) 1988-04-27

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