JPS6396907A - 半導体ウエ−ハの保護膜の自動打抜き装置 - Google Patents

半導体ウエ−ハの保護膜の自動打抜き装置

Info

Publication number
JPS6396907A
JPS6396907A JP61242744A JP24274486A JPS6396907A JP S6396907 A JPS6396907 A JP S6396907A JP 61242744 A JP61242744 A JP 61242744A JP 24274486 A JP24274486 A JP 24274486A JP S6396907 A JPS6396907 A JP S6396907A
Authority
JP
Japan
Prior art keywords
protective film
wafer
cylinder
moving plate
semiconductor wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP61242744A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0116012B2 (enExample
Inventor
Ryoji Wakabayashi
若林　良治
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP61242744A priority Critical patent/JPS6396907A/ja
Publication of JPS6396907A publication Critical patent/JPS6396907A/ja
Publication of JPH0116012B2 publication Critical patent/JPH0116012B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Dicing (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
JP61242744A 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置 Granted JPS6396907A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP61242744A JPS6396907A (ja) 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61242744A JPS6396907A (ja) 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置

Publications (2)

Publication Number Publication Date
JPS6396907A true JPS6396907A (ja) 1988-04-27
JPH0116012B2 JPH0116012B2 (enExample) 1989-03-22

Family

ID=17093611

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61242744A Granted JPS6396907A (ja) 1986-10-13 1986-10-13 半導体ウエ−ハの保護膜の自動打抜き装置

Country Status (1)

Country Link
JP (1) JPS6396907A (enExample)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852241B2 (en) 2001-08-14 2005-02-08 Lexmark International, Inc. Method for making ink jet printheads
JP2009123784A (ja) * 2007-11-12 2009-06-04 Denso Corp テープ貼り付け装置及びテープ貼り付け方法
JP2009212173A (ja) * 2008-03-03 2009-09-17 Csun Mfg Ltd ウエハフィルム裁断装置
KR100918485B1 (ko) 2009-03-10 2009-09-24 김중섭 테이프 부착장치
JP2011035174A (ja) * 2009-08-01 2011-02-17 Masaki Ura シート貼付装置及びシート貼付方法
JP2011091118A (ja) * 2009-10-20 2011-05-06 Csun Mfg Ltd ウェハーラミネートダイシングソー
CN102189736A (zh) * 2010-02-03 2011-09-21 志圣工业股份有限公司 晶圆压膜机切膜机构
CN107200301A (zh) * 2017-05-23 2017-09-26 中国科学院微电子研究所 一种mems晶片的贴膜对准装置

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2010080838A (ja) * 2008-09-29 2010-04-08 Lintec Corp シート貼付装置及び貼付方法

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6852241B2 (en) 2001-08-14 2005-02-08 Lexmark International, Inc. Method for making ink jet printheads
JP2009123784A (ja) * 2007-11-12 2009-06-04 Denso Corp テープ貼り付け装置及びテープ貼り付け方法
JP2009212173A (ja) * 2008-03-03 2009-09-17 Csun Mfg Ltd ウエハフィルム裁断装置
KR100918485B1 (ko) 2009-03-10 2009-09-24 김중섭 테이프 부착장치
JP2011035174A (ja) * 2009-08-01 2011-02-17 Masaki Ura シート貼付装置及びシート貼付方法
JP2011091118A (ja) * 2009-10-20 2011-05-06 Csun Mfg Ltd ウェハーラミネートダイシングソー
CN102189736A (zh) * 2010-02-03 2011-09-21 志圣工业股份有限公司 晶圆压膜机切膜机构
CN107200301A (zh) * 2017-05-23 2017-09-26 中国科学院微电子研究所 一种mems晶片的贴膜对准装置

Also Published As

Publication number Publication date
JPH0116012B2 (enExample) 1989-03-22

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