CA2020424A1

CA2020424A1 - Device to adhere a heat sealing film

Info

Publication number: CA2020424A1
Application number: CA002020424A
Authority: CA
Inventors: Gregor Antes; Joseph Johannes Donders
Original assignee: Landis and Gyr Betriebs AG
Current assignee: Electrowatt Technology Innovation AG
Priority date: 1989-07-19
Filing date: 1990-07-04
Publication date: 1991-01-20
Also published as: AU635939B2; HU904547D0; FI903628A0; CS9003577A2; EP0408896B1; NO177343C; DE59000837D1; JPH0356227A; FI92034B; NO903200L; AU5772890A; ATE85284T1; CZ280538B6; NO903200D0; EP0408896A1; HU210289B; ES2038469T3; PT94718A; HUT58599A; FI92034C

Abstract

ABSTRACT OF THE INVENTION
A device for adhering labels formed from a heat-sealing film on a substrate with the application of heat and pressure comprises a heated plate having a plane base area and a stamp for moving the heated plate to both punch out a label from the heat sealing film and to apply heat and pressure to attach the label to the substrate. The plate includes a border with a cutting edge for punching out a label from a heat sealing film.

Description

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DEVICE TO ADHERE A HEAT SEALING FILN

; Backaround of the Invention ~ he present inv~ntion relates to a device for the adhering o~ labels formed from a heat-sealing film.

Backaround of the_Invention Such a device is suitable to adhere labels, e.g. in form of authenticity elements on doouments or securities of all types.
In EP 210 619, the composition of a heat-sealing film compri~ing of a multilay~red bonded assemblage is desaribed. An extremely thin decorative layer which could contain information, for example, is provided with a heat-activated adhesive layer on one side while the other side is attached by means of a separation layer to a paper or plastic support band ensuring tensile strength that is sufficient for the proce~s.
Devices known from DE-OS 27 33 286, DE-OS 30 44 456 etc. for the adhering of a decorative layer of such a heat-sealing film on a substrate comprise a stamp with a plane base area of predetermined ~orm which is brought to a predetermined temperature. This stamp presses the adhesive layer of the heat-sealing film on the substrate and heats the adhesive layer through the support band and the decorative layer until the bonding agent is softened and develops sufficient adhesion on the substrate. Upon removal of the stamp, the support is lifted off the æubstrate, whereby a surface of the decorative layer which corresponds to the base area of the stamp is torn off, since it "

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is firmly bonded to the substrate. This separation process limits the thickness and strength of the information-containing layer.
DE-AS 28 oO 635 discloses that layers which are attached according to this process are not very resistant to scratching and abra~ion.
In US patent 4,826,213, the manufacture of a multilayered bonded assemblage for labels with a protective layer is described. Adhering from the multilayered bonded assemblage directly to the eubstrate is no longer possible because of the tQughness of the protectiva layer. A cutting stamp with a projecting Xnife is used to first separate the labels out of this multilayered bonded assemblage, with the labels then being stored until they are used in a predetermined order on a support band in such manner as to be easily detached.
It is the ob;ect of the instant invention to provide a device hy means of which a label provided with a protective layer can be adhered directly onto a substrate at low cost from a film coated on one side with heat 6ealant.

Summary of the Invention In a preferred embodiment, the present invention is directed to a device for adhering labels formed from a heat-sealing film on a substrate with the application of heat and pressure. The device comprises a heated plate having a plane base area and a stamp for moving the heated plate to both punch out a label from - 2B20 ~
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the heat sealing film and to apply heat and pressure to attach the label to the ~ubstrate. The plate includes a border with a cutting edge for punching out a label from a heat sealing film.

Brief_~escription of the Drawina ~ ig. 1 shows a device for adhering a label formed from a heat-sealing film in accordance with an illustrative embodiment of the present invention.
Fig. 2 show6 the device of Fig. 1 as a label is being punched out.
Fig. 3 show6 the device of Fig. 1 as a label is adhered to a substrate.
Fig. 4 shows the substrate with the attached label.
Fig. 5 shows a second device for adhering a label formed from a heat-sealing film, in accordance with a second illustrative embodiment of the present invention.

Detailed Description of the_Invention In Fig. 1, the reference numeral 1 refers to a supply roll for a band ~omprising a heat-sealing film 2. The supply roll 1 is installed next to a device for the adhering of labels formed from the heat-sealing film 2.
The heat-sealing film 2 is a film coated on one side with a heat sealant. The heat-sealing film 2 can be made in the form of a multilayered bonded assemblage of layers, one surface of which may comprise a transparent, resistant protective layer 3, for ' 2~2~2~
example. The other, opposite surface comprises a cement layer 4 capable of being activated by heat, i.e. the heat-sealant.
Between the layers 3 and 4, a~ in~ormation-bearing layer comprising at least one ply i6 embedded, containing for example information in the form of motifs located in predetermined motif intervals. The heat-sealing film 2 distinguishes itself from known heat-sealing films through the additional protective layer 3 which is firmly integrated into the multilayered bonded assemblage.
The device comprises a ~tamp 5 capable of being shifted along its longitudinal axis, a punch die 6 and a support 7 as well as drive and control elements (not shown here). One end of the stamp 5 i8 mounted in a gulde 8 which makes it possible to displace the stamp 5 perpendicular to the punch die 6 or to a lS work surface 9 of the support 7. The guide 8 contains a drive ~not shown here) for the displacement of the stamp 5. The other end of the stamp 5 bears a heatable plate 10 with a plane base area 11. The base area 11 may be round or oval in shape or of any other shape and i8 adapted in ~ize and form to the motifs of the heat-sealing film 2.
The punch die 6 and the plate 10 are removable so that the device may be quickly adapted to a different form or size of the motifs.
The punch die 6 is attached to the work surface 9 and slightly raised above it by means o~ a spacer 12 and is provided with a punch opening 13 which is adapted to the form of the base . .' . '~ '- - - . : -.
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L 't, area 1I while taking into account the different temperatures of the punch die 6 and of the plate 10. The elements 6 and 10 constitute a cutting tool which is known in machine construction.
When the stamp 5 is displaced in the direction of the work surface 9, the plate 10 enters the punch opening 13, whereby a scissor action is created between the punch die 6 and the border of base area 11 which is made in form of a cutting edge 14 as the base area 11 goes through the punch opening 13. The scissor action serves to cut the film clamped between the plate 10 and the punch die 6. When the stamp 5 is in its rest position, the plate 10 is raised sufficiently from the punch die 6 so that the heat-sealing film 2 can be pulled forward between the base area 11 and the punch die 6.
A predetermined interval below the punch die 6, de~ined by the spacer 12, ~erves to advantage for the seating of a substrate 15 which lies on the work surface 9 during the transfer process.
The substrate 15 is preferably held in place on the work surface 9 by means of electrostatic or mechanical forces. For example, the substrate 15 can be fixed by the action of evacuated suction channel~ 16 which go through the wor~ surface 9 and the support 7. The paths of the heat-sealing film 2 and of the substrate 15 cross each other, for example at an angle of 90, as is shown only for the sake of clarity in Fig. 1.
The substrate 15 can be a document, an identity paper, a banknote or in general a flat surface made of plastic, paper, etc. onto which a label 17 (Fig. 2) is to be adhered at least at ' .

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one predetermined location on the surface of substrate 15 which faces away from the work surface 9.
The substrate 15 can also be fed to the work surface 9 from a roll (not shown) in form of a band to be cut into a predetermined shape by means which are not shown here only after the label 17 has been adhered at the predetermined locations.
At the start of the transfer process, the heat-sealing film 2 is pulled off with slight pre-tension from the supply roll 1 and is guided in a plane positioned beneath plate 10 and over the punch die 6. A control device (not shown) effects the advance of the heat-sealing film 2, always by one motif interval, so that the next motif may be positioned in a predetermined manner over the punch opening 13.
At a command of the control device, the substrate 15 is khen fed by means which are not shown here to the work surface 9 and is held in position.

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At a further command, the guide 8 displaces the stamp 5 from its re~t position ahown in Fig. 1 in the direction of the work surface 9. The heat-sealing film 2 is clamped between the punch die 6 and the plate 10. As the base area 11 goes through the punch opening 13, the cutting edge 14 cuts a label 17 (Fig. 2) with a motif out of the heat-sealing film 2 in a shape and size determined by the base area 11.
The stamp 5 (Fig. 3) presses the punched-out label 17 on the predetermined location of the substrate 15 by means of the plate 10. The heated plate 10 transfers heat energy to the label 17, ' 6 .
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whereby the heat penetrates as far as the adhesive layer 4. The bonding agent melts and combines with the substrate 15. After a predetermined period of time the ~tamp 5 is pulled back into its rest position. The same stamp 5 is used for bsth work phases, the punching~out phase and the adhering phase.
When the bonding agent has cooled, the label 17 (Fig. 4) is firmly bonded to the substrate 15. The substrate 15 on which the label 17 is adhered is removed from the work surface 9 by means of a device which is not shown here.
In contrast with the prior art, the device described combines a punch-out process to be carried out immediately before adhering the label 17 with the adhering of the label 17.
Since the labels 17 need not be adhered individually, one after the other, on a support band serving as an intermediate support as de~cribed in US patent 4,826,213 but are adhered directly from the heat-sealing fllm onto the substrate, much more precise positioning of the label 17 on the substrate 15 results and the handling of the label 17, which is delicate before being adhered, i~ gentler. Since no expensive silicon-treated support band 18 needed, the supply roll 1 is smaller, lighter and less expensive for the same number of labels 17.
To ensure that the labels 17 develop a uniform, predetermined bonding force on the substrate 15, the heat transfer to the plate 10 (Fig. 1) is advantageously controlled by means of a regulating instrument which is not shown here. The regulating instrument is connected to a temperature detector 18 2~2~
which scans the temperature of plate 10 and transmits to the regulating instrument possible deviations from a desired temperature of the plate 10 which is determined by the nature of the adhesive layer 4 and which can be set on the regulating instrument. The regulating instrument raises or lowers the heat transfer so that these deviations tend towards a minimum Yalue.
The band of the heat-sealing film 2 from which the labels are punched out can be wound up on a mandril (not shown) and be removed as waste.
The stamp 5 and the plate 10 are advantageously provided with at least one air channel 19. As 800n as the base area 11 is lowered on the heat-sealing film 2 an atmospheric under (i.e.
negative) pressure is produced in the air channels 19 by means whiah are not shown here so that the punched-out label 17 (Fig.
2) may not fall off the plate 10 and onto the substrate 15, to be then adhered on the substrate 15 in an uncontrollable position.
Shortly before the lifting of plate 10 from the attached label 17, the pressure in the air channels 19 (Fig. 1) i6 again brought to environmental pressure. A slight overpressure in the air channels 19 will advantageously assist a separation of the base area 11 from the protective layer 3.
In the embodiment according to Fig. 5, the stamp 5 and the plate 10 are again capable of displacement perpendicular to the wor~ surface 9 of the support 7. A knife 20 delimits at least the base area 11 of the plate 10 and is provided with a cutting edge 14 on the side facing towards the heat-sealing film 2. The ..

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cutting edge 14 pro;ects preferably beyond the base area 11 to a predetermined extent which ~s at the most e~ual to the thickness o~ the heat-sealing film 2 so that the label 17 (Yig. 4) is punched out in the process of adhering the heat-sealing film 2 without damaging the substrate 15.
The heat-sealing film 2 is stretched directly over the substrate 15 on which the label is to be adhered, which substrate lies in a predetermined position on the work surface 9. The control device (not shown here) aligns each individual motif over the predetermined location of the substrate 15 on which the adher~ng i~ to be ef~ected.
As soon as the knife 20 has been lowered on the heat-sealing film, the cutting edge 14 penetrates through the protective surface 3 and at most into the adhesive layer 4 so that the substrate 15 is not damaged and punches out the label 17 (Fig. 4) to be adhered on the substrate 15. The base area 11 (Fig. 5) now comes into heat contact with the protective layer 3 of the punched-out heat-sealing ~ilm 2 and pres~es it until the bonding agent i8 melted onto the substrate 15.
The knife 20 with the cutting edge 14 can be made in one piece with the stamp 5 or with the plate 10. A Xnife 20 which can be removed from the stamp 5 is more advantageous, e.g. in form of a cylinder as shown in Fig. 5 which can be displaced so that the height of the cutting edge 14 can be adjusted to project to a predetermined extent beyond the base area 11.

It is advantageous to mount the knife 20 so that it is capable o~ displacement in relation to the stamp 5 and is pushed forward by means which are not shown here at a command of the control device into its working position in the direction of the work surface 9, whereby the cutting edge 14 projects to the predetermined extent beyond the base area 11.
During the bonding process the stamp 5 presses the surface of the heat-sealing film 2 determined by the base area 11 on the substrate 15. During heating of the adhesive layer, the knife 20 is brought into its working position and punches out the label 14 (Fig. 4). The stamp 5 and the knife 20 are then brought back into their rest position.
It is advantageous to provide a hold-down device 21 which surrounds the plate 10 at a su~ficient distance and is capable of being lowered on the heat-sealing film 2. The hold-down device 21 presses the heat-sealing fllm 2 on the punch die 6 or substrate 15 immediately before the stamp 5 i8 lowered on the punch die 6 or on the substrate 15, ensures wrinkl~-free contact of the heat-sealing film 2 and holds the heat-sealing film 2 in its position for a predetermined period of time until bonding is completed. The hold-down device 21, together with the ~tamp 5, is then brought back into its rest position. The drives tnot shown here) which are re~uired for this are synchronized by the control device with the movements of the stamp 5.
The stamp 5 (Fig~ 2) and the plate 10 are advantageously capable of lateral displacement so that the path of the substrate .. . .

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15 need not be guided under the band of the heat-sealing fllm 2.
Immediately following the punching out of the label 17 the stamp 5 with the label 17 is pulled back over the plane of the heat-sealing film 2 so that the label 17 can be aligned with a predetermined location of a substrate 15' (Fig. 1) without being impeded by the heat-sealing film 2, said substrate 15' being held in the predetermined position outside tha punch out device on a table 22 serving as the support 7.
The guide 8 can for example be secured on a sliding rail in form of an arm 23 which is capable of lateral displacement. A
drive (not shown here) displaces the stamp 5 in its rest position in guide 8 on the arm 23 between at least two predetermined positions. In the first position which can be defined by an adjusting ring 24, for example, serving as a stop, the stamp 5 is aligned for punching with the punch opening 13. In another predetermined position, the stamp 5 is aligned for bonding with a predstermined loaation of the substrate 15'. If only one such position i8 provided for bonding, it may be set by means of a clamping ring 25 serving as a stop.
In another embodiment of the device, a bonding device which comprises the parts 5, 6, 8 and 10 or 5, 8, 10 and 20 (Fig. 5), the supply roll and the elements, not shown here, for the guidance of the heat-sealing ilm 2 is advantageously fixed on the arm 23 which is capable of being swiveled in all directions.
Controlled driyes (not shown here) align the bonding device with a predetermined location, oriented in any desired direction in .
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space of the plane substrate 15' which is held in place on the support 22.
It is possible to adhere labels 17 which are plane surface elements of a body on the substrate 15 (Fig. 4) by means of this bonding device.
The hold-down device 21 is used advantageously with these bonding devices so that the heat-sealing film 2 may be spread out smoothly and without wrinkles over the substrate 15 or over the punch die 6 (Fig. 1) in any position of said bonding device.
The bonding device can be made in form of a manually operated, portable device which is used advantageously to adhere small labels 17 if the label 17 need not be adhered on the substrate 15 with great precision or if a small number of identical substrates 15 are to be provided with labels.
A dri~e with electronic step~by-step control can also be u6ed for displacement. The drive runs in each case to one of the predetermined positions by counting off the steps through which it has gone and through comparison with a predetsrmined number of steps.
Finally, the above-described embodiments of the invention are intended to be illustrative only. Numerous alternative embodiments may be devised by those skilled in the art without departing from the spirit and scope of the following claims.

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Claims

1. A device for the adhering of labels formed from a heat sealing film on a substrate with the application of heat and pressure, said device comprising, a heated plate having a plane base area, a stamp for moving said heated plate to both punch out a label from said heat-sealing film and to apply heat and pressure to said label to attach said label to said substrate, said plate including a border with a cutting edge for punching out a label from said heat-sealing film.

2. Device as in claim 1 wherein the stamp is equipped with at least one air channel letting out into the base area of said plate and wherein negative pressure is applied in the air channel at least from the time of punching out the label to the time of application of the stamp on the substrate.

3. Device as in claim 1 or 2 wherein said cutting edge is formed by a knife which delimits the base area of the plate and wherein the cutting edge projects beyond the base area while the label is being punched out to a predetermined extent which is equal to at most the thickness of the heat-sealing film which is to be cut.

4. Device as in claim 3 wherein the knife is integrated with the stamp.

5. Device as in claim 3 wherein the stamp includes means for displacing the knife along the stamp and in that the cutting edge projects beyond the base area of the plate to the predetermined extent only during the punching out of the label.

6. Device as in claim 1 or 2 wherein a punch die is located under the heat-sealing film, wherein the punch die and the plate together form a cutting tool, wherein the base area of the plate is delimited all around by the cutting edge and wherein the label is punched out of the heat-sealing film when the base area passes through a punch opening of the punch die.

7. Device as in claim 6 wherein a substrate is installed under the punch die, wherein the stamp can be moved only along its axis perpendicular to the punch die, and wherein the stamp is made to descend through the punch opening to the substrate.

8. Device as in claim 6 wherein the stamp can be displaced perpendicular to its longitudinal axis and has at least two positions, whereby the stamp is aligned in the first position to punch out the label and in the other position to adhere the label on a predetermined location of the substrate.

9. Device as in claim 1, wherein said plate and stamp can be aligned with respect to a support for said substrate for the bonding of the label to a predetermined location on the substrate.

10. Device of claim 1 wherein the stamp is provided with a temperature detector to regulate the surface temperature of the base area.