JPH0116012B2 - - Google Patents
Info
- Publication number
- JPH0116012B2 JPH0116012B2 JP24274486A JP24274486A JPH0116012B2 JP H0116012 B2 JPH0116012 B2 JP H0116012B2 JP 24274486 A JP24274486 A JP 24274486A JP 24274486 A JP24274486 A JP 24274486A JP H0116012 B2 JPH0116012 B2 JP H0116012B2
- Authority
- JP
- Japan
- Prior art keywords
- protective film
- wafer
- moving plate
- protruding blade
- movable plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000010408 film Substances 0.000 claims description 51
- 230000001681 protective effect Effects 0.000 claims description 51
- 239000004065 semiconductor Substances 0.000 claims description 28
- 238000003825 pressing Methods 0.000 claims description 6
- 238000004080 punching Methods 0.000 claims description 6
- 239000010409 thin film Substances 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 description 61
- 238000010586 diagram Methods 0.000 description 4
- 230000006378 damage Effects 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 229920002554 vinyl polymer Polymers 0.000 description 1
Landscapes
- Dicing (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61242744A JPS6396907A (ja) | 1986-10-13 | 1986-10-13 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP61242744A JPS6396907A (ja) | 1986-10-13 | 1986-10-13 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6396907A JPS6396907A (ja) | 1988-04-27 |
| JPH0116012B2 true JPH0116012B2 (enrdf_load_stackoverflow) | 1989-03-22 |
Family
ID=17093611
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61242744A Granted JPS6396907A (ja) | 1986-10-13 | 1986-10-13 | 半導体ウエ−ハの保護膜の自動打抜き装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6396907A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080838A (ja) * | 2008-09-29 | 2010-04-08 | Lintec Corp | シート貼付装置及び貼付方法 |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6852241B2 (en) | 2001-08-14 | 2005-02-08 | Lexmark International, Inc. | Method for making ink jet printheads |
| JP4840333B2 (ja) * | 2007-11-12 | 2011-12-21 | 株式会社デンソー | テープ貼り付け装置及びテープ貼り付け方法 |
| JP2009212173A (ja) * | 2008-03-03 | 2009-09-17 | Csun Mfg Ltd | ウエハフィルム裁断装置 |
| KR100918485B1 (ko) | 2009-03-10 | 2009-09-24 | 김중섭 | 테이프 부착장치 |
| JP5126986B2 (ja) * | 2009-08-01 | 2013-01-23 | 昌己 浦 | シート貼付装置 |
| JP5011364B2 (ja) * | 2009-10-20 | 2012-08-29 | 志聖工業股▲ふん▼有限公司 | ウェハーラミネートダイシングソー |
| US8069893B2 (en) * | 2010-02-03 | 2011-12-06 | Lai Chin-Sen | Cutting mechanism for dry film laminator |
| CN107200301B (zh) * | 2017-05-23 | 2019-02-12 | 中国科学院微电子研究所 | 一种mems晶片的贴膜对准装置 |
-
1986
- 1986-10-13 JP JP61242744A patent/JPS6396907A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010080838A (ja) * | 2008-09-29 | 2010-04-08 | Lintec Corp | シート貼付装置及び貼付方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6396907A (ja) | 1988-04-27 |
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