JPH01151239A - Method and apparatus for resin-seal molding of semiconductor device - Google Patents

Abstract

PURPOSE:To prevent a void or a defective part from being produced in a molded body by a method wherein a process to resin-seal a semiconductor on one face of a lead frame and a process to mold a thin resin on the other face are executed separately. CONSTITUTION:A molding process of a resin molded body 20a for resin-sealing a semiconductor device attached to one face of a lead frame 18 and a molding process of a required thin resin molded body 20b on the other face of the lead frame 18 are executed separately. Especially during the molding process of the thin resin molded body 20b, an air discharge action inside a cavity 13 for molding use is carried out efficiently; an air inhalation action by a molten resin material 212 can be prevented surely; accordingly, when the required thin resin molded body 20b is to be fixed to the other face of the lead frame 16, an unfilled state of the resin material inside the cavity 13 is eliminated; it is possible to surely prevent a void or a defective part from being produced in the shaped thin resin molded body 20b.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a method for sealing and molding a semiconductor element with a resin material, and to improvements in a molding apparatus for the same.

(Prior Art) A transfer resin encapsulation molding apparatus has been conventionally used as an apparatus for encapsulating a semiconductor element with a resin material.

For example, as shown in FIG. 10, this device includes a fixed upper mold 1 and a movable lower mold 2 arranged opposite each other, and
(Parting line) The cavities 3 and 4 for resin molding provided opposite to each other, the pot 5 for supplying resin material provided on the upper mold 1 side, and the pot 5 and the inside of the cavity (A) are communicated with each other. A passage 6 for transferring the molten resin material is provided. In addition, the reference numeral 7 in the same figure is a groove for fitting and setting the lead frame 8 provided on the 21st surface of the lower mold 2, the same reference numeral 8a is a semiconductor element mounted on one side of the lead frame, and the same reference numeral 9 is a pot. The plungers for pressurizing the resin material 10 supplied into the chamber 5 are respectively shown. Further, the rotating device is shown in which the inside of the cavity for fitting the semiconductor element 8a and sealing it with resin is disposed on the lower mold 2 side. In addition, in order to efficiently dissipate heat when using the resin molded product (product), the thickness of the resin molded body that covers the lead frame surface on the side where the semiconductor element 8a is not mounted is increased as much as possible. Cavity (3) for molding to make it thinner
The case is shown in which the upper die 1 is provided.

Resin molding using the conventional equipment described above begins with both molds (1 and 2).
) is opened, then the Gq lead frame 8 is fitted and set at a predetermined position in the groove 7 of the lower mold 2, and then both molds (1
- 2) is again clamped, and then the resin material 10 is melted by heating and injected under pressure into the cavities 3 and 4 of both the upper and lower molds through the transfer passage 6.

Therefore, in this case, the resin-sealed molded body molded to correspond to the shape of each cavity 3 and 4 is fixed to one side of the lead frame 8 on which the semiconductor element 8a is mounted, as shown in FIG. a thick resin molded body 10a for sealing the semiconductor device; and a thin resin molded body 10b for covering the lead frame surface, which is fixed to the other surface of the lead frame 8 corresponding to the thick resin molded body. It will be formed from.

(Problems to be Solved by the Invention) By the way, in the conventional method described above, the thin resin molded body 10b molded by the upper mold cavity 3 and the thick resin molded body 10a molded by the lower mold cavity 4 are separated. Although there is an advantage in that the entire shape of the resin-sealed molded body of the semiconductor element 8a can be simultaneously primary-molded, on the other hand, when using blow molding, it has the following serious drawbacks. .

That is, as shown in FIG. 11, the thick resin molded body 10
a is set to have a wall thickness T necessary for resin-sealing the semiconductor element 8a, and the thin resin molded body 10b is set to have a wall thickness t as thin as possible in consideration of heat dissipation effect. It is set to have.

However, when using the above-mentioned conventional method, the molten resin material injected under pressure into the cavities (3 and 4) is inside the lower mold cavity (a) of the thick resin molded body 10a, which has a large capacity. There is a tendency that the inside of the upper mold cavity (3), which is difficult to fill, is difficult to be filled into the upper mold cavity (3) of the thin resin molded body 10b, which has a small volume. Air tends to remain inside the cavity due to its poor discharge efficiency, and furthermore, the molten resin material injected into the lower mold cavity 4) crosses the lead frame 8 and flows into the upper mold cavity (3).
In particular, the upper mold cavity (3
), a state in which the resin material is not filled occurs, and voids (bubbles) and a defective portion 10c as shown in the figure are formed in the thin resin molded body 10b.

Therefore, the coating and sealing of the lead frame surface becomes incomplete, resulting in a lack of moisture resistance, which poses a serious problem in that the high quality and high reliability of this type of product are significantly reduced.

The present invention reliably solves the above-mentioned conventional problems by providing a resin encapsulation molding method and apparatus for a semiconductor element that can reliably mold the thin resin molded body that covers the lead frame surface. The purpose is to eliminate the problem.

(Means for Solving the Problems) In order to solve the above-mentioned conventional problems, the resin encapsulation molding method of the present invention seals a semiconductor element on one side of a lead frame on which the semiconductor element is mounted. A resin molding process in which a resin molded body of a required thickness is fixed together, and a required thin resin molded body is fixed to the other side of the lead frame corresponding to the fixing position of the resin molded body for sealing the semiconductor element. This method is characterized in that each process is performed separately from the resin molding process of fixing the parts together.

In addition, another resin sealing molding method according to the present invention includes a first method in which a resin molded body having a required thickness for sealing a semiconductor element is integrally fixed to one side of a lead frame on which a semiconductor element is mounted. The next resin molding process is performed, and then the required thin resin molded body is integrally fixed to the other side of the lead frame corresponding to the fixed position of the resin molded body molded in the above first resin molding process. This method is characterized by performing a second resin molding step.

Further, in another resin encapsulation molding method according to the present invention, a semiconductor element <181 ), and a step of closely joining the first mold for resin molding (A) to the other side of the lead frame (18) set in the first mold (A). A clamping step of the first and second molds (A-B) in which the second mold for resin molding (B) provided with the surface (22) is fitted; After mold clamping of A-B), a molten resin material is injected and filled into the cavity (14) in the first mold (A), and the semiconductor element (tgt
), and after the completion of the first resin molding process, the first and second molds (A-
B) After the mold opening process of the two molds (A-B) to separate them, and the mold opening process of the first and second molds, or simultaneously with the mold opening process, the molten resin in the two molds is removed. After the completion of the first ejection step of releasing the resin molded body molded in the material transfer passageway (161) and the first ejection step, the first mold for resin molding (A) and the first mold (A
) and a third mold for resin molding (C) having a cavity (13) for molding a required thin resin molded body corresponding to the position of the cavity (14) of the first and third molds. (A-C> mold clamping process and the first and third molds (A-
After the mold clamping in C), a molten resin material is injected and filled into the cavity (13) in the third mold (C), and the lead frame (18 ) a second resin molding step in which a required thin resin molded body is fixed to the other side of the mold, and after the above-mentioned second resin molding step is completed, the first and third molds (A-C) are separated. into the cavity (14) of the first mold (A) after or simultaneously with the mold opening process of both the molds and the mold opening process of the first and third molds. The resin molded body and the lead frame (18) molded in the above-mentioned molds, and the second ejection process in which the molded resin molded body is released from the mold in the passage (162) for transferring the molten resin material in both molds. It is characterized by consisting of the following.

Moreover, the resin encapsulation molding apparatus of the present invention for carrying out the above-described method includes a first mold for resin molding (A), and the first mold (A).
A second mold (B) and third mold (C) for resin molding are clamped against A), and the first and second molds (A-B) and the first and third molds ( At the time of each mold clamping of A-C), the pots (15, 152) for supplying resin material disposed on either side of them, and the respective pots (151, 15
2) plungers (191, 192) for pressurizing the resin materials (201, 20□) fitted into the respective parts, and the bogs (bottoms) formed when the first and second molds (A-B) are clamped. 15
1) and the cavity (14), a passageway (161) for transferring molten resin material, and the first and third molds (A
- A passageway (162) for transferring the molten resin material that communicates the pot (152) and the cavity (13) formed during mold clamping in C), and the resin molded in each of the passageways (161 and 162). The first mold (A) is provided with a molded body protrusion mechanism (21), and a cavity (14) for resin-sealing molding of a semiconductor element (181) mounted on one side of a lead frame. In addition, the second mold (B) is provided with the lead frame (
18) A joint surface (22) is formed to be closely joined to the other surface side, and the third mold (C) is further provided with a joint surface (22) that is closely joined to the other surface side, and the third mold (C) is further provided with the first mold (A) when the mold is clamped with the first mold (A). The cavity (14) for molding the required thin-walled resin molding corresponding to the position of the cavity (14) in (A)
13).

(Function) According to the method and structure of the present invention, there is a step of molding a resin molded body for resin-sealing a semiconductor element mounted on one side of a lead frame, and a process of forming a necessary thin resin molded body on the other side of the lead frame. The molding steps are performed separately.

Therefore, especially in the process of molding thin-walled resin moldings, the air in the molding cavity is efficiently discharged, and air entrainment by the molten resin material is reliably prevented. When fixing the molded body to the other side of the lead frame, ensure that the unfilled state of resin material in the cavity is eliminated and that voids and missing parts are not formed in the thin resin molded body. It is something that can be prevented.

(Example) Next, the present invention will be explained based on the example diagrams shown in FIGS. 1 to 9.

FIG. 1 schematically shows the entire molding apparatus according to the present invention, FIGS. 2 and 3 show the molding mold in a clamped state, and FIGS. 4 and 5 6 and 7 illustrate the main parts in the mold clamping and mold opening states.

As shown in the figures, this device includes a first mold A for resin molding, a second mold B and a third mold C for resin molding that are clamped to the first mold A, The second and second molds (Δ・B
) and at the time of each mold clamping of the first and third molds (A-C),
Either side of them (on the concave side, the second mold B
and pots 151 and 152 for supplying resin material disposed in the third mold C), and plungers 191 and 191 for pressurizing the resin material (20, 202) fitted in each pot, respectively.
192, a passage 161 for transferring molten resin material that communicates between the pot 151 and the cavity (14) formed when the first and second molds (A-B) are clamped, and the first and third molds (A-B). Pot 15 configured when molds (A and C) are clamped
2 and the cavity (13), and a protruding mechanism 21 for the resin molded body molded in each of the passages (161 and 162). The mold A is provided with a cavity 14 for resin-sealing molding of the semiconductor element 181 mounted on one side of the lead frame 18, and the second mold B is provided with a mold clamping mechanism for molding the semiconductor element 181 mounted on one side of the lead frame 18. A bonding surface 22 is formed in the third mold C to be tightly joined to the other surface of the lead frame 18, and the third mold C has a cavity of the first mold A when the mold is clamped with the first mold A. It is constructed by disposing cavities 13 for molding a required thin resin molded body corresponding to 14 positions. In addition, the reference numeral 17 in the figure is a groove for fitting and setting the lead frame 18 provided on the 21st surface of the first mold A, and the same reference numeral 23 is a resin molded body molded within the cavity 14 of the first mold A. This is the ejection mechanism. In addition, the same reference numeral 24 is a positioning bin for the lead frame 18 provided on the first mold A side, and the same reference numeral 251 and 25
Reference numeral 2 denotes a bottle hole drilled in the second mold B and third mold C sides corresponding to the position of the bottle 24.

Furthermore, as shown in FIG. 1, the above-mentioned second mold B and third mold C are arranged side by side on the left and right horizontal positions of the upper fixed platen 26 of the device frame, and therefore each has a fixed upper mold. It consists of Further, the first mold A is disposed below the second mold B and is arranged to move vertically and reciprocally by a vertical drive machine 127 provided at the bottom of the second mold B. Therefore, the first mold A is movable. It makes up the lower mold. Moreover, the protruding mechanisms 21 and 23 of the resin molded body in the first mold A are as follows:
By moving up the protruding bars 211 and 231 provided at the lower part, the protruding plates 21s and 233 having protruding pins 21□ and 23□ provided at the upper part thereof are individually moved upward. Therefore, each of the protruding bars 21t.2
By upward movement of 31゛, the respective protruding pins 212 and 232 are
The resin molded body molded within the cavity 14 of the first mold A and the resin molded body molded within the passages 161 and 162 can be released from the mold A separately. Furthermore, the first mold A can be alternately and arbitrarily moved to a position below the second mold B and the third mold C, respectively, via a suitable turntable mechanism 28 or the like,
Therefore, the first mold A, the second mold B, and the first mold A
The vertical positioning of the third mold C and the third mold C, and the clamping and opening operations of both molds, which are a combination thereof, can be performed as desired.

Hereinafter, a resin sealing molding method using a molding apparatus having the configuration of the above embodiment will be explained.

First, as shown in FIG. 8 (1), a lead frame 18 is placed in the cavity 14 portion of the first mold A for resin molding.
A step of fitting and setting the semiconductor element 181 mounted on one side of the is performed. In this case, by fitting the positioning pin 24 provided in the first mold A into the pin hole 182 bored in the lead frame, the lead frame 18 is inserted into the groove 17 in the first mold A. It can be fitted and set in a predetermined position.

Next, as shown in FIG. 2 (2), the first mold A for resin molding and the joint surface 22 closely joined to the other surface of the lead frame 18 set in the first mold A. A mold clamping process is performed for the first and second molds (A-B) to match the second mold B for resin molding provided with the resin, and the resin supplied to the pot 15w of the second mold B is By heating the material (20) and pressurizing it with the plunger 191, the molten resin material is injected and filled into the cavity 14 in the first mold A through the passage 161, and the semiconductor element 181 in the cavity 14 is molded. A first resin molding step is performed to seal and mold the inside of the thick resin molded body 20a.

Next, as shown in the same figure (3), the first and second molds (
Performing a mold opening process for both molds to separate A-B),
After or simultaneously with the mold opening process of the first and second molds (A-B), the protrusion mechanism 21 causes the protrusion bar 211 , protrusion plate 213 , protrusion pin 21
2 is moved upward to perform a first ejection step in which only the unnecessary resin molded body molded in the molten resin material transfer passage 161 in both molds is released and removed from the mold. The unnecessary resin moldings in the passage (gate) provided on the mold B side are the resin moldings in the passage (cull part) provided on the first mold A side and the thick resin molding in the cavity 14. Since it is attached to the body 20a, it is released downward during the mold opening process.

Next, the first mold A is rotated laterally by the turntable mechanism 28 so that the first mold A for resin molding corresponds to the position of its cavity 14, as shown in FIG. At the same time, performing a mold clamping process of the first and third molds (A-C) to match the third mold C for resin molding in which the cavity 13 for molding the required thin resin molded body is arranged. By heating the resin material (202) supplied to the pot 15□ of the third mold C and pressurizing it with the plunger 192,
Cavity 1 in the third mold C through passage 162
A secondary resin is injected and filled into 3 to fix a desired thin resin molded body 20b on the other side of the lead frame 18 corresponding to the fixing position of the resin-sealed molded body of the semiconductor element. Perform the molding process.

Next, as shown in the same figure (9), the first and third molds (A
-C), and at the same time, after the mold opening process of the first and third molds (A-C), or simultaneously with the mold opening process, both protruding mechanisms 21 and 23, the protruding bars 2h and 23t, the protruding plate 213,
23s ・Move the protruding pins 212 and 232 upward respectively,
A second mold for releasing the thick resin molded body 20a and the lead frame 18 molded in the cavity 14 of the first mold A and the unnecessary resin molded body molded in the passage 162 in both molds. The third mold C is used for the next ejection process.
The thin resin molded body 20b and unnecessary resin molded body molded in the cavity 13 and the passage (gate), respectively, are
Because they are attached to the thick resin molded body 20a molded in the cavity 14 and the passage (cull part) on the first mold A side, and to the unnecessary resin molded body, the lower part is removed during the mold opening process. It is released from the mold. Further, by appropriately cutting off these unnecessary resin molded bodies, a molded product as shown in FIG. 9 can be obtained.

As described above, according to the method and structure of the embodiment, the ninth
As shown in the figure, a process of forming a resin molded body 20a for resin-sealing a semiconductor element 181 mounted on one side of the lead frame 18, and a process of forming a necessary thin resin molded body 20b on the other side of the lead frame 18. Each step will be performed separately.

Further, when performing the molding process of the thin resin molded body 2015, the resin molded body 20a has already been molded in the cavity 14 of the first mold A. Therefore, the air inside the molding cavity 13 in the molding process is sequentially pumped outward from the 21 sides of the first and third molds (A-C) by the molten resin material injected into the cavity 13. and,
It will definitely be ejected. Furthermore, since the air discharging action is performed efficiently and smoothly in this manner, it is possible to reliably prevent the air from being entrained by the molten resin material that has been injected and filled. Therefore, when a desired thin resin molded body is coated and fixed on the other side of the lead frame, the state where the resin material is not filled in the molding cavity 13 is eliminated, so that the molded thin resin molded body 20b It is possible to reliably prevent the formation of voids and defects in the structure.

(Other Examples) Regarding the arrangement of the above-mentioned molds (A-B-C), as shown in the example diagram, in addition to arranging them in the vertical direction, for example, using them upside down Alternatively, they may be arranged in the left and right horizontal directions, and the arrangement position can be arbitrarily selected.

In addition, the setting grooves (17
), the lead frame (18) may be fitted and set, for example, so that the semiconductor element (tSt) mounted on the lead frame faces upward;
In this case, a cavity (14) for resin-sealing the semiconductor element may be provided on the P and L surfaces of the upper die which face each other. In addition, when the P and L surfaces of both types are arranged in the vertical direction, the aspect of the above-mentioned lead frame (18) fitting set may be either leftward or rightward.
Also, a cavity (14) for resin sealing of the semiconductor element.
may be provided on the side of the mold 21 opposite to this.

In addition, the first and second molds (A-B) and the first and third molds (
In the combinations A-C), it is possible to arbitrarily select which side is the fixed side or the movable side.

Also, pots (151, 152) and plungers (19
1.192), the installation position is opposite to that in the example diagram.
They may be arranged on the lower mold side, and furthermore, they can be arbitrarily selected to be arranged on either the fixed side or the movable side.

In addition, each of the second and third molds (B-C) is dedicated for releasing the unnecessary resin molded body in the passage (gate) and the thin resin molded body (20b) in the cavity (13). A protruding mechanism may also be provided.

Further, the resin encapsulation molding method for a semiconductor element according to the present invention includes:
First, a primary resin molding process is performed to integrally fix a resin molded body of a required thickness to seal the semiconductor element to one side of the lead frame on which the semiconductor element is mounted, and then,
A second resin molding step of integrally covering and fixing the required thin resin molding onto the other side of the lead frame corresponding to the fixing position of the resin molding molded in the first resin molding step; This feature makes it possible to obtain the same effects as those of the above-mentioned embodiments.

However, in the method for resin-sealing and molding a semiconductor element according to the present invention, in short, a resin molded body having a required thickness for sealing the semiconductor element is fixed integrally to one side of a lead frame on which the semiconductor element is mounted. and a resin molding step of integrally covering and fixing the required thin resin molding to the other side of the lead frame corresponding to the fixing position of the resin molding for sealing the semiconductor element. This method is characterized in that each step is performed separately, and thereby the same effects as those of the above-mentioned embodiments can be obtained.

Therefore, there is no problem in adopting the opposite method, such as first performing the resin molding process for the thin resin molding described above, and then performing the resin molding process for the thick resin molding. It is possible to obtain the same effects as those of the embodiment.

Further, for the purpose of more securely integrating the thick resin molded body (20a) and the thin resin molded body (20b), for example, at least one side thereof is provided with irregularities or other suitable engagement surfaces. It is also possible to adopt a method and structure in which the .

Further, the thick resin molded body (20a) and the thin resin molded body (20b) may be molded from different resin materials. That is, since the thin resin molded body is formed for the purpose of efficiently dissipating heat, the thick resin molded body uses a usual resin material for semiconductor encapsulation, and the thin resin molded body As the resin material for molding, for the purpose of further improving the heat dissipation effect, for example,
A sealing resin material that does not contain a filler such as silica or has a small content thereof, or another sealing resin material that has excellent heat dissipation properties may be used.

(Effects of the Invention) According to the method and configuration of the present invention, the process of molding a resin molded body for resin-sealing a semiconductor element mounted on one side of a lead frame, and the process of molding a resin molded body for resin-sealing a semiconductor element mounted on one side of a lead frame, and forming a thin resin body on the other side of the lead frame. Since the molding process of each molded body is performed separately, it is possible to efficiently and smoothly discharge air from the molding cavity, especially in the molding process of a thin resin molded body, and to remove air from the molten resin material. This is a conflict that reliably prevents the entrainment of the lead frame, so when the required thin resin molded body is coated and fixed on the other side of the lead frame, the state where the resin material is not filled in the cavity is eliminated, It is possible to reliably prevent voids and missing portions from being formed in the thin resin molded body.

Therefore, according to the method and configuration of the present invention, it is possible to provide a resin encapsulation molding method and apparatus for a semiconductor element that can reliably mold a thin resin molded body that covers the surface of a lead frame, and This has an excellent effect of reliably solving the above-mentioned conventional problems.

In particular, in the molding cavity of a thin resin molded body whose purpose is to efficiently dissipate heat, an unfilled state of resin material does not occur as in the conventional case, so there are no voids or missing parts in the thin resin molded body. is not formed,
Therefore, the intended purpose of ensuring heat dissipation and covering and sealing the lead frame surface can be completely achieved, and the high quality and reliability of this type of product can be improved. It has excellent effects.

[Brief explanation of the drawing]

FIG. 1 is a partially cutaway front view schematically showing the entire resin sealing molding apparatus for semiconductor elements according to the present invention. FIGS. 2 and 3 are partially cutaway enlarged front views showing the molding die in a clamped state. FIGS. 4 and 5 are partially cutaway enlarged longitudinal sectional front views showing the main parts of the mold for molding in a clamped state. FIGS. 6 and 7 are partially cutaway enlarged longitudinal sectional front views showing the main parts of the molding die in an open state. FIG. 8 is an explanatory diagram of each step of the method of the present invention. FIG. 9 is a longitudinal sectional front view showing the main parts of a molded product molded by the method of the present invention. FIGS. 10 and 11 are longitudinal sectional front views showing the clamping state of the main parts of the molding die in a conventional resin encapsulation molding apparatus for semiconductor devices, and the main parts of a molded product molded by the conventional apparatus. FIG. (Explanation of symbols) A: First mold B: Second mold C: Third mold 13: Cavity 14: Cavity 151: Pot 152: Pot 161 ... Passage 162 ... Passage 17 ... Groove portion 18 ... Lead frame 181 ... Semiconductor element 182 ... Pin hole 191 ... Plunger 192 ... Plunger 201 ... Resin material 202... Resin material 20a... Thick resin molded body 20b... Thin resin molded body 21... Protrusion mechanism 211... Protrusion bar 212... Protrusion bottle 213... Protrusion plate 22... - Joint surface 23... Protrusion mechanism 231... Protrusion bar 232... Protrusion bottle 233... Protrusion plate 24... Positioning pin 251... Pin hole 252... Pin hole 26... Fixed plate 27... Vertical drive mechanism 28... Turntable mechanism

Claims (4)

[Claims] (1) A resin molding step of integrally fixing a resin molded body of a required thickness for sealing the semiconductor element to one side of the lead frame on which the semiconductor element is mounted, and resin molding for sealing the semiconductor element. Resin encapsulation of a semiconductor element, characterized in that each process including a resin molding process of integrally fixing a required thin resin molded body to the other side of a lead frame corresponding to the fixing position of the body is performed separately. Molding method. (2) A primary resin molding process is performed to integrally fix a resin molded body of a required thickness to seal the semiconductor element to one side of the lead frame on which the semiconductor element is mounted, and then,
Performing a second resin molding process to integrally fix a required thin resin molded body to the other side of the lead frame corresponding to the fixing position of the resin molded body molded in the first resin molding process. A resin encapsulation molding method for a semiconductor element, characterized by: (3) a step of fitting and setting the semiconductor element mounted on one side of the lead frame into the cavity part of the first mold for resin molding; a mold clamping step of the first and second molds for mold matching with a second mold for resin molding provided with a bonding surface closely bonded to the other surface of the lead frame; a first resin molding step of injecting and filling a molten resin material into a cavity in the first mold to seal and mold a semiconductor element in the cavity with resin after the mold is clamped; After the completion of the molding process, a mold opening process for separating the first and second molds, and after the mold opening process for the first and second molds, or simultaneously with the mold opening process. , a first ejection step in which the molded resin body is released from the mold in the passage for transferring the molten resin material in both molds, and after the completion of the first ejection step, the first molding metal for resin molding. The molds of the first and third molds are matched with a third mold for resin molding, which is provided with a cavity for molding a required thin resin molded body corresponding to the cavity position of the first mold. A tightening step: After the first and third molds are clamped, a molten resin material is injected and filled into the cavity of the third mold to correspond to the fixing position of the resin-sealed molded body of the semiconductor element. a second resin molding step in which a required thin resin molded body is fixed to the other side of the lead frame; and after the completion of the second resin molding step, the first and third molds are separated from each other. and a resin molded body and a lead frame molded in the cavity of the first mold after or simultaneously with the mold opening process of the first and third molds. and a second ejection step of releasing the molded resin body in the passageway for transferring molten resin material in both molds. (4) A first mold for resin molding, second and third molds for resin molding that are clamped to the first mold, the first mold, the second mold, and the first mold. pots for supplying resin material disposed on either side of the mold and the third mold when the molds are clamped, and plungers for pressurizing the resin material fitted into each pot, respectively; A passage for transferring molten resin material that communicates the pot and the cavity formed when the first and second molds are clamped, and a passage that is configured when the first and third molds are clamped. A resin encapsulation molding apparatus for a semiconductor element, comprising a passage for transferring a molten resin material that communicates a pot and a cavity, and a protrusion mechanism for a resin molded body molded in each of the passages, the apparatus comprising: The mold is provided with a cavity for resin sealing molding of the semiconductor element mounted on one side of the lead frame, and the second mold is provided with a cavity for molding the lead frame when the mold is clamped with the first mold. A joint surface is formed to be tightly joined to the other surface side, and the third mold has a required thin resin molding corresponding to the cavity position of the first mold when the mold is clamped with the first mold. A resin encapsulation molding apparatus for a semiconductor element, characterized in that it is configured by disposing a cavity for body molding.