JP7134930B2 - Mold, resin molding apparatus, and method for manufacturing resin molded product - Google Patents

Description

The present invention relates to a mold, a resin molding apparatus, and a method of manufacturing a resin molded product.

A lead frame, a substrate on which a chip is mounted, or the like is generally used as an electronic component by being resin-sealed. 2. Description of the Related Art Conventionally, as a resin molding apparatus for resin-sealing a substrate or the like, one equipped with a mold for transfer molding for manufacturing a semiconductor package such as MAP (molded array packaging) is known (for example, Patent Document 1 2).

The mold described in Patent Document 1 includes a mold composed of an upper mold and a lower mold, the upper mold having a cavity, and the lower mold having a concave portion for placing a substrate. formed. Also, the lower mold is provided with a pot to which the resin tablet is supplied, and the upper mold is provided with a cull block including runners and gates for flowing the molten resin from the pot toward the cavity. In the mold described in Patent Document 1, chips are arranged at resin supply positions of a plurality of gates formed in the cull block, thereby dispersing the flow of the molten resin.

The mold described in Patent Document 2 includes a mold for molding composed of an upper mold and a lower mold. A cavity is formed in which the frame is placed. In addition, a pot filled with resin is provided in the lower mold, a cull block (upper mold cavity block) that flows the molten resin from the pot to the cavity in the upper mold, and a gate that temporarily stores the molten resin from the cull block and The gate is formed as a gap along the long side of the cavity with a length substantially equal to that of the cavity, and the molten resin is simultaneously supplied to the cavity from the entire long side of the gate.

JP 2014-204082 A JP-A-2000-12578

However, even if the molten resin is made to collide with the chips and diverted, as in the mold described in Patent Document 1, the chips are arranged in the side areas of the substrate where the chips are not arranged. The flow velocity of the molten resin is higher than that in the chip existing area, and due to this velocity difference, the molten resin flows from the side area into the chip existing area and surrounds the air (including the gas generated from the molten resin). , voids are likely to occur. Similarly, in the mold described in Patent Document 2, even if the molten resin is supplied from the entire long side of the cavity, the molten resin flows from the lateral region of the substrate into the chip existing region, causing air (generated from the molten resin). (including gas), voids are likely to occur. As a result, there is a possibility that the molding accuracy of the resin molded product is lowered.

Therefore, a molding die, a resin molding apparatus, and a method of manufacturing a resin molded product that improve molding accuracy are desired.

A molding die according to the present invention is characterized in that it includes a molding die body having a rectangular cavity that holds a molding object and is supplied with a resin material, and the molding die body is a pot filled with the resin material. a cull block having a plurality of runners for causing the resin material to flow from the pot toward the cavity; and the resin material provided along one side of the cavity in plan view and supplied from the plurality of runners . and a merging block for merging before supply to the cavity, wherein the merging block and the one side of the cavity are, in the plan view, cut off at both ends of the one side by blocking walls and at the center of the one side. a channel concentrating mechanism for causing the resin material on both end sides of the one side of the confluence block to flow toward the center of the one side and to supply the resin material from the center to the cavity. at the point.

A characteristic configuration of the resin molding apparatus according to the present invention is that the molding die and a mold clamping mechanism for clamping the molding die are provided.

The characteristic configuration of the method for manufacturing a resin molded product according to the present invention includes a supply step of supplying the molding object and the resin material to the mold, and a mold for clamping the mold while the resin material is heated. and a molding step of resin-molding the object to be molded by causing the resin material to flow from the cull block to the cavity through the confluence block, wherein the molding step comprises: A concentration mechanism causes the resin material on both end sides of the one side of the confluence block to flow toward the center of the one side and is supplied from the center to the cavity.

Advantageous Effects of Invention According to the present invention, it is possible to provide a molding die, a resin molding apparatus, and a method of manufacturing a resin molded product that improve molding accuracy.

It is a schematic diagram which shows a resin molding apparatus. Fig. 3 is a schematic diagram of a molding module; It is a top view of the side which opposes a lower mold|type of an upper mold|type. It is a perspective view of the side which opposes the lower mold|type of an upper mold|type. FIG. 4 is a cross-sectional view taken along the line VV in the vertical direction of FIG. 3; FIG. 4 is a sectional view taken along the line VI-VI in the vertical direction of FIG. 3; It is a conceptual diagram showing a resin flow. It is a top view which shows the board|substrate after resin sealing. It is a top view of the side which opposes the lower mold|type of the upper mold|type in another embodiment.

EMBODIMENT OF THE INVENTION Below, embodiment of the shaping|molding die which concerns on this invention, a resin molding apparatus, and the manufacturing method of a resin molding is described based on drawing. However, without being limited to the following embodiments, various modifications are possible without departing from the scope of the invention.

[Device configuration]
Molding objects such as substrates on which lead frames and chips are mounted are used as electronic components by being resin-sealed. As one of techniques for resin-sealing an object to be molded, there is a transfer method for manufacturing a semiconductor package by resin-sealing a substrate such as a BGA (ball grid array) or a QFN (quad flat non-lead). In this transfer method, a substrate with a chip mounted thereon is housed in a cavity of a molding die, and a resin tablet obtained by solidifying a powdery resin is supplied to a pot of the molding die, heated and melted, and then the molding die is placed. In this method, the resin tablet is melted while the mold is clamped, and the molten resin is supplied to the cavity and hardened, and then the mold is opened to manufacture the resin molded product.

In the conventional transfer method, air vents are provided in the mold because voids (air bubbles) generated in the resin molded product cause molding defects. However, for example, when manufacturing a semiconductor package such as MAP (molded array packaging) that collectively seals a board on which multiple chips are mounted and wired with resin, in order to prevent voids, depending on the type of board and chip Therefore, it is necessary to design the position of the air vent etc. to the optimum. In addition, even if an optimal air vent is provided, the flow rate of the molten resin in the lateral area of the substrate where the chip is not arranged is relatively higher than that in the chip existing area where the chip is arranged, and this speed Due to the difference, the molten resin flows from the side area into the chip existing area and surrounds the air (including the gas generated from the molten resin), so voids are likely to occur. As a result, there is a problem that molding defects of the resin molded product occur.

Therefore, the present embodiment provides a molding die C, a resin molding apparatus D, and a method of manufacturing a resin molded product that improve molding accuracy. In the following, the substrate S on which a semiconductor chip is mounted will be described as an example of the object to be molded, and the direction of gravity will be referred to as the bottom, and the direction opposite to the direction of gravity will be referred to as the top.

FIG. 1 shows a schematic diagram of a resin molding apparatus D. As shown in FIG. A resin molding apparatus D in this embodiment includes a molding module 3, a supply module 4, a control section 6, and a transport mechanism. The molding module 3 includes a molding die C for resin-sealing a substrate S on which a semiconductor chip is mounted with a powdery resin or a liquid resin. The control unit 6 is composed of a program stored in hardware such as an HDD or memory as software for controlling the operation of the resin molding apparatus D, and is executed by the CPU of the computer. That is, the control section 6 controls the operations of the forming module 3, the supply module 4 and the transport mechanism.

It should be noted that the powdery resin includes not only powdery resin but also resin tablets formed of solid resin obtained by pressing powdery resin. It becomes a molten resin. This powdery resin may be either a thermoplastic resin or a thermosetting resin. When the thermosetting resin is heated, its viscosity decreases, and when it is further heated, it polymerizes and hardens to become a cured resin. The powdered or granular resin in the present embodiment is preferably a resin tablet formed of a solid resin for ease of handling.

The molding module 3 molds a pre-resin-sealed substrate Sa (an example of a molding object) with resin to mold a resin-sealed substrate Sb (an example of a resin-molded product). A plurality of molding modules 3 (three in this embodiment) are provided, and each molding module 3 can be attached or detached independently. Details of the molding module 3 will be described later.

The supply module 4 includes a substrate supply mechanism 43, a substrate alignment mechanism 44, a resin supply mechanism 45, and a substrate accommodation section 46, and serves as a standby position for the loader 41 and unloader 42 included in the transport mechanism. The substrate supply mechanism 43 transfers the stock pre-resin sealing substrates Sa to the substrate alignment mechanism 44 . A plurality of semiconductor chips are mounted in alignment in the vertical and horizontal directions on the substrate Sa before resin encapsulation. The substrate alignment mechanism 44 puts the pre-resin-sealed substrate Sa delivered from the substrate supply mechanism 43 into a state suitable for transportation. The resin supply mechanism 45 stocks resin tablets T (an example of a resin material), and arranges the resin tablets T in a state suitable for transportation.

The transport mechanism includes a loader 41 for transporting the pre-resin sealing substrate Sa on which the semiconductor chip before resin sealing is mounted and the resin tablet T, and an unloader 42 for transporting the resin-sealed substrate Sb after resin sealing. contains. The loader 41 receives a plurality of (two in this embodiment) pre-resin-sealing substrates Sa from the substrate alignment mechanism 44, and receives a plurality of (nine in this embodiment) resin tablets T from the resin supply mechanism 45. Then, it is possible to move from the supply module 4 to each molding module 3 on the rail, and deliver the pre-resin-sealing substrate Sa and the resin tablet T to each molding module 3 . The unloader 42 can take out the resin-sealed substrates Sb from the molding modules 3, move on the rails from each molding module 3 to the substrate storage section 46, and store the resin-sealed substrates Sb in the substrate storage section 46. can. In the resin-sealed substrate Sb, the semiconductor chip is sealed with a cured resin obtained by solidifying a molten resin.

The molding module 3 will be described in detail below.

As shown in FIG. 2, the forming module 3 has tie bars 32 erected at the four corners of a lower stationary platen 31 that is rectangular in plan view, and an upper stationary platen 33 that is rectangular in plan view near the upper end of the tie bar 32 . is provided. A movable platen 34 having a rectangular shape in plan view is provided between the lower stationary platen 31 and the upper stationary platen 33 . The movable platen 34 is provided with holes through which the tie bars 32 pass at its four corners, and can move up and down along the tie bars 32 . A mold clamping mechanism 35 that is a device for moving the movable platen 34 up and down is provided on the lower stationary platen 31 . The mold clamping mechanism 35 can clamp the mold C by moving the movable platen 34 upward, and can open the mold C by moving the movable platen 34 downward. Although the drive source of the mold clamping mechanism 35 is not particularly limited, for example, an electric motor such as a servomotor can be used.

The mold C includes a mold body M having an upper mold UM and a lower mold LM. The upper mold UM and the lower mold LM are composed of molds and the like arranged to face each other. The upper mold UM is formed with a rectangular cavity MC in plan view into which molten resin is supplied. The lower die LM is formed with a substrate setting portion on which the substrate Sa before resin encapsulation is placed with the surface on which the semiconductor chip or the like is mounted facing up. An upper heater 37 and a lower heater 36 are built in the upper mold UM and the lower mold LM, respectively.

The mold main body M will be described in detail with reference to FIGS. 3 to 6. FIG. 3 and 4 show a plan view and a perspective view of the side of the upper die UM facing the lower die LM. 5 and 6 are cross-sectional views taken along line VV and line VI-VI in a direction (vertical direction) perpendicular to the paper surface of FIG.

The upper mold UM includes an upper mold cavity block 1 in which a cavity MC is formed, a cull portion 22 that receives molten resin injected from a pot 21 (described later) of the lower mold LM, and a cull portion 22 directed toward the cavity MC. A cull block 2 having a plurality of runners 22d (an example of a resin flow path) for flowing molten resin, and a cavity MC (or a resin sealing and a confluence block 7 for merging along one side of the front substrate Sa).

The upper die cavity block 1, the cull block 2 and the merging block 7 are fixed to the upper die holder base UHB (see FIG. 5). The upper mold cavity block 1, the cull block 2, and the merging block 7 may all be constructed as separate members, or the upper mold cavity block 1 or the cull block 2 and the merging block 7 may be constructed as an integral member.

As shown in FIG. 3, two upper mold cavity blocks 1 are arranged with a cull block 2 interposed therebetween, and a confluence block 7 is arranged between the upper mold cavity block 1 and the cull block 2 . In this embodiment, one upper die cavity block 1 has two cavities MC, which are recesses having a rectangular shape in plan view. The confluence block 7 is formed with one channel concentrating mechanism R (described later) for one cavity MC. In the cull block 2 of the present embodiment, nine cull portions 22 each having a circular concave shape in a plan view are formed. is formed (see also FIG. 8). A plurality of runners 22d are arranged in parallel along one side of the cavity MC, and in this embodiment, nine runners 22d extend for one cavity MC.

As shown in FIGS. 4 and 5, the runner 22d is formed to have the same depth as the cull portion 22 on the side of the cull portion 22, and is formed so that the depth gradually decreases toward the confluence block 7 side. . As described above, since the flow path narrows from the cull portion 22 toward the tip of the runner 22d, the molten resin injected from the pot 21 (described later) flows through the plurality of runners 22d (from (Molten resin) is supplied to the confluence block 7 where the molten resin merges. Note that the number of cavities MC, the number of culls 22, the number of runners 22d, and the like can be appropriately changed according to the object to be molded (substrate Sa before resin encapsulation), and are not limited to the number and number of the present embodiment. For example, when there is one cavity MC, one flow channel concentration mechanism R (described later) is formed in the confluence block 7 . At this time, the number of cull portions 22 is appropriately set according to the size of the cavity MC, and the number of runners 22d is also appropriately set.

As shown in FIG. 3 , the confluence block 7 is formed by a long block in plan view along one side of the upper die cavity block 1 between the cull block 2 and the upper die cavity block 1 . In this embodiment, since two upper mold cavity blocks 1 are arranged with the cull block 2 interposed therebetween, two joining blocks 7 are also arranged. In one joining block 7, recesses having a rectangular shape in plan view and having a depth substantially equal to the depth of the tip of the runner 22d are formed in the same number as the cavities MC (that is, two). , communicates with a plurality of (nine in this embodiment) runners 22d, and communicates with the cavity MC only on the center side on the cavity MC side. Specifically, as shown in FIGS. 4 and 5, the recess of the confluence block 7 includes a central groove 71 communicating with the cavity MC and a cavity MC between one cavity MC and nine runners 22d. Extending grooves 72 extending along the one side from both ends of the central groove 71 in a state retreated from the side toward the runner 22d side (the cull block side) are grooves integrally formed along one side of the cavity MC. ing. In this embodiment, the recess of the confluence block 7 is formed so as to gradually become shallower from the cull block 2 side to the upper mold cavity block 1 side, and the entire length of one side of the cavity MC is closer to the center along the cavity MC. It is slightly longer than the sum of the lengths of the groove 71 and the extension groove 72 (that is, the length of the long side of the recess). The central groove 71 communicates with the cavity MC on the upper mold cavity block 1 side and communicates with the runner 22d on the cull block 2 side. The extending groove 72 communicates only with the runners 22d located at both ends of the cavity MC on the cull block 2 side, and does not communicate with the cavity MC on the upper mold cavity block 1 side. A portion of the central groove 71 that communicates with the cavity MC serves as a gate 23 (an example of the central portion) that is an entrance through which the resin material (molten resin) flows into the cavity MC. That is, the confluence block 7 and one side of the cavity MC communicate only at the gate 23 at the center.

The confluence block 7 (particularly, the extension groove 72) has a channel concentrating mechanism R that causes the resin material (molten resin) present on both end sides of the confluence block 7 to flow toward the center and to be supplied from the gate 23 to the cavity MC. constitutes In other words, in the channel concentrating mechanism R, a blocking wall 73 that blocks the flow of the molten resin from the extending groove 72 to the cavity MC is provided at the boundary between the extending groove 72 and the cavity MC. As a result, the resin material is not directly supplied from both ends of the confluence block 7 to the cavity MC. In this way, since the confluence block 7 communicates with the cavity MC only at the gate 23, which is the central portion, the molten resin flows on both end sides of the pre-resin-sealing substrate Sa arranged in one cavity MC. This cuts off the direct supply from the runner 22d to the cavity MC (see also FIG. 7).

As shown in FIGS. 5 and 6, the lower mold LM includes a lower mold cavity block 8 having a substrate setting portion and a pot block 9. These lower mold cavity block 8 and pot block 9 are connected to the lower mold holder base. Fixed at LHB. A cylindrical pot 21 filled with a resin tablet T is fixed to the pot block 9 by shrink fitting or the like. The number of pots 21 corresponding to the cull portion 22 (nine in this embodiment) is provided. A plunger 25 driven by an electric motor (not shown) such as a servomotor is inserted below the cylindrical space of the pot 21 so as to be vertically movable. The resin tablet T accommodated in the shaped space is injected toward the cavity MC of the upper mold UM.

[Method for manufacturing resin molded product]
A method for manufacturing a resin molded product will be described with reference to FIGS. 1 to 8. FIG.

As shown in FIG. 1, the loader 41 is heated in advance with the housing space for the resin tablet T insulated. Also, the heaters 36 and 37 are energized in advance to heat the mold main body M. As shown in FIG. Then, a plurality of (two in this embodiment) pre-resin sealing substrates Sa taken out from the substrate supply mechanism 43 are placed on the loader 41 . Further, the nine resin tablets T aligned by the resin supply mechanism 45 are stored in the resin tablet T storage space of the loader 41 . Then, the loader 41 transports the pre-resin-sealing substrate Sa to the molding module 3, and places the pre-resin-sealing substrate Sa on the substrate setting portion of the lower mold LM with the semiconductor chip mounted side facing upward. At the same time, the resin tablet T is accommodated in the pot 21 (supply step, see FIGS. 5 and 6).

Next, the movable platen 34 is moved upward by the mold clamping mechanism 35 to relatively move the lower mold LM toward the upper mold UM, thereby clamping the mold C (mold clamping process, see FIG. 2). ). At this time, air is forcibly sucked and discharged from the cavity MC by an air vent (not shown). Next, a lower heater 36 built into the lower mold LM heats and melts the resin tablet T housed in the pot 21, and heats the pre-resin sealing substrate Sa fixed to the lower mold LM (molding). process, see FIGS. 5-6).

Next, when the resin tablet T melts and becomes a molten resin, the plunger 25 is moved upward to flow the molten resin from the pot 21 to the merging block 7 via the cull portion 22 and the runner 22d (molding). process, see FIGS. 3 and 4). The molten resin is temporarily stored in the confluence block 7 and then supplied to the cavity MC through the gate 23 . By being heated by the heaters 36 and 37, the molten resin in the cavity MC is cured, and the pre-resin-sealing substrate Sa is resin-sealed to form a resin-sealed substrate Sb (resin molded product) (molding). process, see FIGS. 7-8). In this molding process, the molten resin flows from the extension grooves 72 of the merging block 7 toward the central groove 71 on both end sides of the pre-resin-sealing substrate Sa, and flows toward the central groove 71 on the central side of the pre-resin-sealing substrate Sa. is supplied into the cavity MC through the gate 23 of . That is, on both end sides of the pre-resin sealing substrate Sa, the molten resin is supplied to the cavity MC after flowing from both end sides toward the center. As a result, as shown in FIG. 7, at the start of the flow of the molten resin in the cavity MC, the molten resin first flows inward of the cavity MC, and gradually flows outward of the cavity MC. . As a result, as indicated by the dashed arrow in FIG. 7, the leading portion of the molten resin on the inner side of the cavity MC is closer to the end of the flow than the leading portion of the molten resin on the outer side of the cavity MC on the side closer to the flow start end. However, since the semiconductor chip is not mounted on the pre-resin sealing substrate Sa on the outer side of the cavity MC in the pre-resin sealing substrate Sa, the melted resin on the inner side of the cavity MC where the semiconductor chip is mounted does not flow. The flow speed of the molten resin on the outer side of the cavity MC is faster than the flow speed. Therefore, as shown by solid line arrows in FIG. 7, as the flow end of the molten resin in the cavity MC approaches, the leading portion of the molten resin on the outer side of the cavity MC becomes the leading portion of the molten resin on the inner side of the cavity MC. After catching up, the leading portion of the molten resin becomes substantially parallel to one side of the cavity MC at the end of the flow. This prevents the molten resin from flowing from the outside to the inside at the end of the flow and surrounding the air. As a result, voids do not occur in the resin-sealed substrate Sb, and molding accuracy can be improved.

After an appropriate curing time, the mold C is opened by moving the movable platen 34 downward, and the resin-encapsulated substrate Sb is released from the cavity MC. This resin-sealed substrate Sb is accommodated in the substrate accommodating portion 46 by the unloader 42 (accommodating step, see also FIG. 1). Before the accommodation step, unnecessary resin (cull K shown in FIG. 8) formed on the cull portion 22 and the runner 22d may be removed by a gate break mechanism (not shown). After that, the resin-sealed substrate Sb is chipped (divided into pieces) by a cutting mechanism (not shown) to manufacture a plurality of electronic components.

[Another embodiment]
Hereinafter, members similar to those of the above-described embodiment will be described using the same terms and symbols for easy understanding.

<1> As shown in FIG. 9, the cull block 2 has a first cull portion 22A located on both end sides of the cavity MC and a second cull portion 22B located on the center side of the cavity MC. Therefore, the first cull portion 22A may have fewer runners 22d than the second cull portion 22B. If the number of runners 22d positioned at both ends of one side of the cavity MC is reduced in this way, the molten resin tends to preferentially flow toward the inside of the cavity MC at the beginning of the flow of the molten resin in the cavity MC.

Also, the first cull portion 22A and the second cull portion 22B are arranged in parallel along one side of the cavity MC, and the first cull portion 22A between the two second cull portions 22B is the runner 22d. , and a communication path 5 communicating with the second cull portion 22B may be formed. In this way, if the runner 22d is not provided in the first cull portion 22A at the boundary of the plurality of cavities MC, the molten resin preferentially moves inward of the cavity MC at the beginning of the flow of the molten resin in the cavity MC. It becomes easy to flow to. That is, in the present embodiment, the flow channel concentration mechanism R is composed of the first cull portion 22A. Moreover, if the first cull portion 22A is formed with the communication path 5 that communicates with the second cull portion 22B, the molten resin filled in the pot 21 facing the first cull portion 22A can also be used. , lean.

<2> In the above-described embodiment, a plurality of pots 21 are provided. Also, the number of runners 22d is not particularly limited as long as there are at least two runners at both ends and one runner in the center. Furthermore, the number of cavities MC formed in one upper mold cavity block 1 is not particularly limited, and is appropriately designed according to the size of the substrate, the arrangement of the semiconductor chips mounted on the substrate, the type of resin, and the like. For example, it may be one, two, or six.

<3> The shape of the confluence block 7 is not limited to the shape in the above-described embodiment, as long as it is configured to partially block the flow of the molten resin from the confluence block 7 to the cavity MC at both end sides of one side of the cavity MC. It is not particularly limited. For example, a blocking block may be built inside a rectangular parallelepiped block. Further, when there are three or more runners 22d branched from the cull portion 22 to the merging block 7 side, the molten resin in the cavity MC may be displaced by, for example, providing an extension groove 72 of the merging block 7 communicating with the two runners 22d. An optimum extending groove 72 may be provided by simulating the flow. Also, the confluence block 7 may be formed as one block for each groove (flow path concentrating mechanism R) composed of the central groove 71 and the extending grooves 72 positioned at both ends thereof.

<4> A blocking wall 73 as a channel concentration mechanism R may be provided on the cavity MC side. In this case, since there is a space in which no chips are mounted around the substrate Sa before resin encapsulation, it is possible to effectively utilize the space.

<5> A cavity MC may also be provided in the lower mold LM, and both sides of the object to be molded may be resin-sealed. Alternatively, a release film may be adsorbed on the inner surface of the cavity MC, and the resin material may be supplied onto this release film.

<6> The lower die cavity block 8, pot block 9, upper die cavity block 1, cull block 2 and merging block 7 may be provided in either the upper die UM or the lower die LM.

<7>
In the above embodiment, the face-up transfer method has been described, but as a face-down transfer method, the molding object such as the substrate S may be fixed to the upper mold UM and the cavity MC may be provided in the lower mold LM.

[Outline of the above embodiment]
The outline of the mold C, the resin molding apparatus D, and the method of manufacturing the resin molded product described in the above embodiment will be described below.

(1) The characteristic structure of the molding die C is provided with a molding die main body M having a rectangular cavity MC that holds the substrate Sa (molding object) before resin encapsulation and is supplied with a resin tablet T (resin material). , the mold main body M has a pot 21 filled with a resin tablet T (resin material) and a plurality of runners 22d (resin flow paths) through which molten resin (resin material) flows from the pot 21 toward the cavity MC. Cull block 2 and confluence block 7 provided along one side of cavity MC for merging molten resin (resin material) supplied from a plurality of runners 22d (resin flow paths) before supplying to cavity MC. The junction block 7 and one side of the cavity MC communicate only at the gate 23 (central portion) on one side, and the resin material on both end sides of one side of the junction block 7 flows toward the center of the one side. It is provided with a flow channel concentrating mechanism R for supplying from the gate 23 (central portion) to the cavity MC.

If the confluence block 7 is provided along one side of the cavity MC as in this configuration, the resin can be evenly supplied to the cavity MC compared to the case where the molten resin is supplied to the cavity MC from each of the plurality of runners 22d. can. At this time, if a chip or the like that acts as a flow resistance for the molten resin is mounted on the substrate Sa before resin encapsulation, the flow rate of the molten resin on the outer side of the cavity MC where the chip does not exist is the same as the cavity MC where the chip exists. becomes larger than the flow rate of the molten resin on the inner side of the As a result, at the end of the flow of the molten resin in the cavity MC, the molten resin flows from the outer side to the inner side to surround the air (including the gas generated from the molten resin), and the void is formed at the central portion of the flow end side. becomes more likely to occur. In the case of a BGA substrate in which a chip is mounted on the substrate by means of bumps, this air intrusion is particularly conspicuous.

Therefore, in this configuration, a channel concentrating mechanism R is provided that causes the resin material to flow toward the center of one side of the cavity MC at both ends of one side of the cavity MC by the confluence block 7, and supplies the resin material from the gate 23 to the cavity MC. there is Therefore, at the beginning of the flow of the molten resin in the cavity MC, the molten resin first flows toward the inside of the cavity MC, and gradually flows toward the outside of the cavity MC. At the flow end of the molten resin in the cavity MC, the leading portions of the molten resin on the outer side of the cavity MC and the inner side of the cavity MC approach each other, and the molten resin flows from the outer side to the inner side to surround the air. is prevented. Therefore, voids are less likely to occur in the resin-sealed substrate Sb (resin molded product), and molding accuracy can be improved.

(2) The channel concentrating mechanism R includes a central groove 71 along one side of the cavity MC and an extension extending from both ends of the central groove 71 along the one side in a retracted state toward the runner 22d (resin channel). The confluence block 7 may be formed integrally with the outlet groove 72 .

As in this configuration, if the confluence block 7 as the flow channel concentrating mechanism R is composed of the central groove 71 and the extension grooves 72 extending from both ends of the central groove 71 in a retracted state toward the runner 22d, , only by changing the junction block 7 without changing the cull block 2, the cut-off between the runner 22d located on both end sides of one side of the cavity MC and the cavity MC (the gate 23 between the junction block 7 and the cavity MC ( communication of only the central part) can be realized.

(3) A characteristic configuration of the resin molding apparatus D is that it includes the molding die C described in any one of (1) to (2) above and a mold clamping mechanism 35 for clamping the molding die C. .

In this configuration, since the molding die C described above is used for clamping, the molding accuracy can be improved.

(4) The method for manufacturing a resin molded product is characterized by the method for manufacturing a resin-sealed substrate Sb (resin molded product) using the resin molding apparatus D of (3) above, wherein the molding die C is resin-sealed. A supply step of supplying the front substrate Sa (molding object) and the resin tablet T (resin material), a mold clamping step of clamping the mold C with the resin tablet T (resin material) heated, and a cull block 2. a molding step of resin-molding the pre-resin-encapsulated substrate Sa (molding object) by flowing molten resin (resin material) into the cavity MC through the confluence block 7 ; The point is that the path concentration mechanism R causes the resin material on both end sides of the merging block 7 to flow toward the center side of one side and is supplied to the cavity MC from the gate 23 (central portion).

In this method, in the molding process, the molten resin supplied from both ends of the merging block 7 to the cavity MC flows from both ends toward the center of the pre-resin-sealing substrate Sa, and then flows toward both ends. As a result, at the flow end of the molten resin in the cavity MC, the leading portions of the molten resin on the outer side of the cavity MC and the inner side of the cavity MC approach each other, and the molten resin flows from the outer side to the inner side. Surrounding air is prevented. Therefore, voids are less likely to occur in the resin-sealed substrate Sb, and molding accuracy can be improved.

It should be noted that the configurations disclosed in the above-described embodiments (including other embodiments, the same shall apply hereinafter) can be applied in combination with configurations disclosed in other embodiments unless there is a contradiction. Moreover, the embodiments disclosed in this specification are merely examples, and the embodiments of the present invention are not limited thereto, and can be modified as appropriate without departing from the scope of the present invention.

INDUSTRIAL APPLICABILITY The present invention can be used for a mold, a resin molding apparatus, and a method for manufacturing a resin molded product. In particular, it is effective in manufacturing BGA and QFN (DFN) MAP.

2: cull block 7: confluence block 21: pot 22: cull portion 22d: runner (resin flow path)
23: Gate (central part)
35: Mold clamping mechanism 71: Central groove 72: Extending groove C: Mold D: Resin molding apparatus M: Mold main body MC: Cavity R: Flow channel concentration mechanism Sa: Substrate before resin sealing (molding object)
Sb: resin-encapsulated substrate (resin molded product)
T: resin tablet (resin material)

Claims (4)

Equipped with a mold body having a rectangular cavity that holds a molding object and is supplied with a resin material,
The mold body includes a pot filled with the resin material, a cull block having a plurality of runners for causing the resin material to flow from the pot toward the cavity, and provided along one side of the cavity in plan view. a confluence block for merging the resin material supplied from the plurality of runners before supplying the resin material to the cavity;
The confluence block and the one side of the cavity communicate with each other only at the central portion of the one side with blocking walls blocking both ends of the one side in the plan view ,
A molding die comprising a channel concentrating mechanism for causing the resin material on both end sides of the one side of the confluence block to flow toward the center of the one side and to supply the resin material from the center portion to the cavity. Equipped with a mold body having a rectangular cavity that holds a molding object and is supplied with a resin material,
The mold body includes a pot filled with the resin material, a cull block having a plurality of resin channels for allowing the resin material to flow from the pot toward the cavity, and provided along one side of the cavity. and a confluence block for merging the resin material supplied from the plurality of resin flow paths before supplying the resin material to the cavity,
the confluence block and the one side of the cavity are in communication only at a central portion of the one side;
a channel concentrating mechanism for causing the resin material on both end sides of the one side of the confluence block to flow toward the center of the one side and to supply the resin material from the center to the cavity;
The flow channel concentrating mechanism includes a central groove along the one side and extension grooves extending along the one side from both ends of the central groove in a state of retreating toward the resin flow channel. A mold configured by the confluence block. A mold according to claim 1 or 2;
and a mold clamping mechanism for clamping the mold. A method for manufacturing a resin molded product using the resin molding apparatus according to claim 3,
a supply step of supplying the molding object and the resin material to the mold;
a mold clamping step of clamping the mold while the resin material is heated;
a molding step of resin-molding the object to be molded by causing the resin material to flow from the cull block to the cavity through the confluence block;
In the molding step, the resin material on both end sides of the one side of the confluence block is caused to flow toward the center of the one side by the flow channel concentration mechanism, and the resin material is supplied from the center to the cavity. method of manufacturing the product.

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