JPH0114696B2 - - Google Patents

Info

Publication number
JPH0114696B2
JPH0114696B2 JP57203964A JP20396482A JPH0114696B2 JP H0114696 B2 JPH0114696 B2 JP H0114696B2 JP 57203964 A JP57203964 A JP 57203964A JP 20396482 A JP20396482 A JP 20396482A JP H0114696 B2 JPH0114696 B2 JP H0114696B2
Authority
JP
Japan
Prior art keywords
alignment
value
deviation
predetermined
wafer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP57203964A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5994419A (ja
Inventor
Masao Kosugi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Inc
Original Assignee
Canon Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Inc filed Critical Canon Inc
Priority to JP57203964A priority Critical patent/JPS5994419A/ja
Priority to US06/550,034 priority patent/US4627010A/en
Priority to GB08330194A priority patent/GB2131205B/en
Priority to DE19833341747 priority patent/DE3341747A1/de
Publication of JPS5994419A publication Critical patent/JPS5994419A/ja
Publication of JPH0114696B2 publication Critical patent/JPH0114696B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • G03F9/7096—Arrangement, mounting, housing, environment, cleaning or maintenance of apparatus
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70425—Imaging strategies, e.g. for increasing throughput or resolution, printing product fields larger than the image field or compensating lithography- or non-lithography errors, e.g. proximity correction, mix-and-match, stitching or double patterning
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
    • G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Projection-Type Copiers In General (AREA)
  • Control Of Position Or Direction (AREA)
JP57203964A 1982-11-19 1982-11-19 分割焼付け装置におけるアライメント方法 Granted JPS5994419A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP57203964A JPS5994419A (ja) 1982-11-19 1982-11-19 分割焼付け装置におけるアライメント方法
US06/550,034 US4627010A (en) 1982-11-19 1983-11-08 Method and device for discriminating stillness of a step exposure apparatus
GB08330194A GB2131205B (en) 1982-11-19 1983-11-11 Aligning masks and wafers in the manufacture of semiconductor devices
DE19833341747 DE3341747A1 (de) 1982-11-19 1983-11-18 Verfahren und vorrichtung zum herabsetzen der ruhezeit einer schrittweise arbeitenden belichtungsvorrichtung

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP57203964A JPS5994419A (ja) 1982-11-19 1982-11-19 分割焼付け装置におけるアライメント方法

Publications (2)

Publication Number Publication Date
JPS5994419A JPS5994419A (ja) 1984-05-31
JPH0114696B2 true JPH0114696B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1989-03-14

Family

ID=16482557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP57203964A Granted JPS5994419A (ja) 1982-11-19 1982-11-19 分割焼付け装置におけるアライメント方法

Country Status (4)

Country Link
US (1) US4627010A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JP (1) JPS5994419A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
DE (1) DE3341747A1 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
GB (1) GB2131205B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4843563A (en) * 1985-03-25 1989-06-27 Canon Kabushiki Kaisha Step-and-repeat alignment and exposure method and apparatus
US4803524A (en) * 1985-08-03 1989-02-07 Nikon Corporation Method of and apparatus for detecting the accuracy of superposition exposure in an exposure apparatus
JP2661015B2 (ja) * 1986-06-11 1997-10-08 株式会社ニコン 位置合わせ方法
US4864227A (en) * 1987-02-27 1989-09-05 Canon Kabushiki Kaisha Wafer prober
JPS63232319A (ja) * 1987-03-20 1988-09-28 Fujitsu Ltd ウエハの位置合わせ処理方法
JP2734004B2 (ja) * 1988-09-30 1998-03-30 キヤノン株式会社 位置合わせ装置
US5206820A (en) * 1990-08-31 1993-04-27 At&T Bell Laboratories Metrology system for analyzing panel misregistration in a panel manufacturing process and providing appropriate information for adjusting panel manufacturing processes
KR950034648A (ko) * 1994-05-25 1995-12-28 김광호 반도체장치의 제조방법
US5760878A (en) * 1995-08-30 1998-06-02 Canon Kabushiki Kaisha Exposure apparatus and alignment discrimination method
US5796468A (en) * 1995-11-02 1998-08-18 Lg Semicon Co., Ltd. Apparatus used to align and mark wafers
KR0179855B1 (ko) * 1995-11-02 1999-03-20 문정환 마킹장치가 구비된 얼라이너
JP3548428B2 (ja) * 1998-07-03 2004-07-28 キヤノン株式会社 位置計測装置及びそれを用いたデバイスの製造方法
DE202005016654U1 (de) * 2005-10-21 2007-03-01 Integrated Dynamics Engineering Gmbh Vorrichtung zur Überwachung der Relativposition mehrerer Einrichtungen
FR3000698B1 (fr) * 2013-01-09 2015-02-06 Phidias Technologies Fabrication d'un objet en volume par lithographie, a resolution spatiale amelioree

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4052603A (en) * 1974-12-23 1977-10-04 International Business Machines Corporation Object positioning process and apparatus
JPS5369063A (en) * 1976-12-01 1978-06-20 Hitachi Ltd Detector of position alignment patterns
JPS53121471A (en) * 1977-03-31 1978-10-23 Nippon Chemical Ind Automatic position matching device
US4218142A (en) * 1978-03-08 1980-08-19 Aerodyne Research, Inc. Mask analysis
DE2905636C2 (de) * 1979-02-14 1985-06-20 Censor Patent- Und Versuchs-Anstalt, Vaduz Verfahren zum Kopieren von Masken auf ein Werkstück
FR2472209A1 (fr) * 1979-12-18 1981-06-26 Thomson Csf Systeme optique d'alignement automatique de deux motifs comportant des reperes s'alignement du type reseaux, notamment en photo-repetition directe sur silicium
US4385839A (en) * 1980-07-31 1983-05-31 Baird Corporation Automatic alignment system
JPS57102017A (en) * 1980-12-17 1982-06-24 Hitachi Ltd Pattern detector
JPS5872945A (ja) * 1981-10-28 1983-05-02 Canon Inc アライメントマ−ク検出方法

Also Published As

Publication number Publication date
DE3341747C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1992-06-17
JPS5994419A (ja) 1984-05-31
GB8330194D0 (en) 1983-12-21
US4627010A (en) 1986-12-02
GB2131205B (en) 1986-11-12
DE3341747A1 (de) 1984-05-24
GB2131205A (en) 1984-06-13

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