JPH01146530U - - Google Patents
Info
- Publication number
- JPH01146530U JPH01146530U JP4348688U JP4348688U JPH01146530U JP H01146530 U JPH01146530 U JP H01146530U JP 4348688 U JP4348688 U JP 4348688U JP 4348688 U JP4348688 U JP 4348688U JP H01146530 U JPH01146530 U JP H01146530U
- Authority
- JP
- Japan
- Prior art keywords
- circuit conductor
- printed
- circuit
- thick film
- film integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004020 conductor Substances 0.000 claims description 9
- 239000011521 glass Substances 0.000 claims description 2
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 2
- 238000005476 soldering Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例の厚膜集積回路を示
す斜視図、第２図及び第３図は従来の厚膜集積回
路を示す斜視図である。 １…絶縁基板、２…チツプ部品、３…回路導体
、５…ボンデイングワイヤー、６…ハンダ、７…
金属小片、８…絶縁ガラス、９…第１の回路導体
、１０…第２の回路導体。
す斜視図、第２図及び第３図は従来の厚膜集積回
路を示す斜視図である。 １…絶縁基板、２…チツプ部品、３…回路導体
、５…ボンデイングワイヤー、６…ハンダ、７…
金属小片、８…絶縁ガラス、９…第１の回路導体
、１０…第２の回路導体。
Claims (1)
- 絶縁基板上に第１の回路導体が印刷してあり、
前記絶縁基板上にチツプ部品が実装してある厚膜
集積回路において、ボンデイングワイヤーをハン
ダ付けするための微少な第２の回路導体が前記第
１の回路導体上に印刷してあり、溶融ハンダをせ
き止める絶縁ガラスが前記チツプ部品と前記第２
の回路導体との間に印刷により設けてあることを
特徴とする厚膜集積回路。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4348688U JPH01146530U (ja) | 1988-03-31 | 1988-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4348688U JPH01146530U (ja) | 1988-03-31 | 1988-03-31 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01146530U true JPH01146530U (ja) | 1989-10-09 |
Family
ID=31269881
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4348688U Pending JPH01146530U (ja) | 1988-03-31 | 1988-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01146530U (ja) |
-
1988
- 1988-03-31 JP JP4348688U patent/JPH01146530U/ja active Pending
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