JPS62199955U - - Google Patents
Info
- Publication number
- JPS62199955U JPS62199955U JP8792286U JP8792286U JPS62199955U JP S62199955 U JPS62199955 U JP S62199955U JP 8792286 U JP8792286 U JP 8792286U JP 8792286 U JP8792286 U JP 8792286U JP S62199955 U JPS62199955 U JP S62199955U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- electronic
- rough surface
- soldering
- around
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 3
- 239000004020 conductor Substances 0.000 claims description 2
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Description
図は、本考案に係る電子回路装置の縦断面図で
ある。 １……絶縁基板、２……粗面、３……導体、４
，７……電子部品、６……半田。
ある。 １……絶縁基板、２……粗面、３……導体、４
，７……電子部品、６……半田。
Claims (1)
- 絶縁基板に形成された導体に、電子部品を、半
田付けすることにより取付けるようにした電子回
路装置において、前記絶縁基板の、少なくとも電
子部品取付位置周辺を粗面にしたことを特徴とす
る電子回路装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8792286U JPS62199955U (ja) | 1986-06-10 | 1986-06-10 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8792286U JPS62199955U (ja) | 1986-06-10 | 1986-06-10 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62199955U true JPS62199955U (ja) | 1987-12-19 |
Family
ID=30945575
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8792286U Pending JPS62199955U (ja) | 1986-06-10 | 1986-06-10 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62199955U (ja) |
-
1986
- 1986-06-10 JP JP8792286U patent/JPS62199955U/ja active Pending