JPH01145131U - - Google Patents

Info

Publication number
JPH01145131U
JPH01145131U JP4139788U JP4139788U JPH01145131U JP H01145131 U JPH01145131 U JP H01145131U JP 4139788 U JP4139788 U JP 4139788U JP 4139788 U JP4139788 U JP 4139788U JP H01145131 U JPH01145131 U JP H01145131U
Authority
JP
Japan
Prior art keywords
panel display
flat panel
plan
view
display driver
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP4139788U
Other languages
English (en)
Japanese (ja)
Other versions
JPH085552Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988041397U priority Critical patent/JPH085552Y2/ja
Publication of JPH01145131U publication Critical patent/JPH01145131U/ja
Application granted granted Critical
Publication of JPH085552Y2 publication Critical patent/JPH085552Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/02—Bonding areas ; Manufacturing methods related thereto
    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L24/06—Structure, shape, material or disposition of the bonding areas prior to the connecting process of a plurality of bonding areas
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/02—Bonding areas; Manufacturing methods related thereto
    • H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
    • H01L2224/05—Structure, shape, material or disposition of the bonding areas prior to the connecting process of an individual bonding area
    • H01L2224/0554—External layer
    • H01L2224/0555—Shape
    • H01L2224/05552—Shape in top view
    • H01L2224/05554—Shape in top view being square

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Wire Bonding (AREA)
JP1988041397U 1988-03-29 1988-03-29 フラットパネルディスプレイ Expired - Lifetime JPH085552Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988041397U JPH085552Y2 (ja) 1988-03-29 1988-03-29 フラットパネルディスプレイ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988041397U JPH085552Y2 (ja) 1988-03-29 1988-03-29 フラットパネルディスプレイ

Publications (2)

Publication Number Publication Date
JPH01145131U true JPH01145131U (enExample) 1989-10-05
JPH085552Y2 JPH085552Y2 (ja) 1996-02-14

Family

ID=31267832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988041397U Expired - Lifetime JPH085552Y2 (ja) 1988-03-29 1988-03-29 フラットパネルディスプレイ

Country Status (1)

Country Link
JP (1) JPH085552Y2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517623U (ja) * 1991-08-22 1993-03-05 三洋電機株式会社 液晶表示装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294970A (ja) * 1985-10-21 1987-05-01 Sharp Corp フイルムキヤリアｌｓｉ

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6294970A (ja) * 1985-10-21 1987-05-01 Sharp Corp フイルムキヤリアｌｓｉ

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0517623U (ja) * 1991-08-22 1993-03-05 三洋電機株式会社 液晶表示装置

Also Published As

Publication number Publication date
JPH085552Y2 (ja) 1996-02-14

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