JPH01143120U - - Google Patents

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Publication number
JPH01143120U
JPH01143120U JP3917188U JP3917188U JPH01143120U JP H01143120 U JPH01143120 U JP H01143120U JP 3917188 U JP3917188 U JP 3917188U JP 3917188 U JP3917188 U JP 3917188U JP H01143120 U JPH01143120 U JP H01143120U
Authority
JP
Japan
Prior art keywords
resistor
diode
contact opening
hole contact
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3917188U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP3917188U priority Critical patent/JPH01143120U/ja
Publication of JPH01143120U publication Critical patent/JPH01143120U/ja
Pending legal-status Critical Current

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  • Electrodes Of Semiconductors (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案の一実施例を示すスルーホール
・コンタクト開孔部近傍の断面図、第2図は従来
の半導体装置のスルーホール・コンタクト開孔部
近傍の断面図である。 1…シリコン半導体基板、2…フイールド熱酸
化シリコン膜、3…窒化シリコン膜、4…絶縁保
護膜、5…スルーホール・コンタクト開孔部、6
…アルミ配線。
FIG. 1 is a cross-sectional view of the vicinity of a through-hole contact opening showing an embodiment of the present invention, and FIG. 2 is a cross-sectional view of the vicinity of a through-hole contact opening of a conventional semiconductor device. DESCRIPTION OF SYMBOLS 1...Silicon semiconductor substrate, 2...Field thermal oxidation silicon film, 3...Silicon nitride film, 4...Insulating protection film, 5...Through hole contact opening, 6
...Aluminum wiring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 抵抗及びダイオード等を内蔵する半導体装置に
おいて、前記抵抗及びダイオードの絶縁保護膜が
スルーホール・コンタクト開孔部の外縁にとどめ
られてパターン形成されることを特徴とする半導
体装置。
1. A semiconductor device incorporating a resistor, a diode, etc., characterized in that the insulating protective film of the resistor and diode is patterned so as to remain at the outer edge of a through-hole contact opening.
JP3917188U 1988-03-24 1988-03-24 Pending JPH01143120U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3917188U JPH01143120U (en) 1988-03-24 1988-03-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3917188U JPH01143120U (en) 1988-03-24 1988-03-24

Publications (1)

Publication Number Publication Date
JPH01143120U true JPH01143120U (en) 1989-10-02

Family

ID=31265684

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3917188U Pending JPH01143120U (en) 1988-03-24 1988-03-24

Country Status (1)

Country Link
JP (1) JPH01143120U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60192330A (en) * 1984-03-14 1985-09-30 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS61141130A (en) * 1984-12-13 1986-06-28 Nippon Precision Saakitsutsu Kk Manufacture of semiconductor device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60192330A (en) * 1984-03-14 1985-09-30 Oki Electric Ind Co Ltd Manufacture of semiconductor device
JPS61141130A (en) * 1984-12-13 1986-06-28 Nippon Precision Saakitsutsu Kk Manufacture of semiconductor device

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