JPS6413125U - - Google Patents
Info
- Publication number
- JPS6413125U JPS6413125U JP10781587U JP10781587U JPS6413125U JP S6413125 U JPS6413125 U JP S6413125U JP 10781587 U JP10781587 U JP 10781587U JP 10781587 U JP10781587 U JP 10781587U JP S6413125 U JPS6413125 U JP S6413125U
- Authority
- JP
- Japan
- Prior art keywords
- wiring pattern
- laminated
- semiconductor device
- covered
- protective film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 2
- 229910052581 Si3N4 Inorganic materials 0.000 claims 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
- 229910052710 silicon Inorganic materials 0.000 claims 1
- 239000010703 silicon Substances 0.000 claims 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
Landscapes
- Formation Of Insulating Films (AREA)
Description
第１図は本考案半導体装置の一実施例を示す要
部拡大断面図である。
１……半導体基板、２……ポリシリコン、４…
…配線パターン、５……表面保護膜、６……Ｓｉ
ＯＮ層、７……ＳｉＮ層。
FIG. 1 is an enlarged sectional view of essential parts of an embodiment of the semiconductor device of the present invention. 1... Semiconductor substrate, 2... Polysilicon, 4...
...Wiring pattern, 5...Surface protection film, 6...Si
ON layer, 7...SiN layer.
Claims (1)
リコンオキシナイトライド層とシリコンナイトラ
イド層を少なくともこの順序で積層した表面保護
膜で覆つたことを特徴とする半導体装置。 A semiconductor device characterized in that a wiring pattern on a surface of a semiconductor substrate is covered with a surface protective film in which a plasma silicon oxynitride layer and a silicon nitride layer are laminated in at least this order.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10781587U JPS6413125U (en) | 1987-07-14 | 1987-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10781587U JPS6413125U (en) | 1987-07-14 | 1987-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS6413125U true JPS6413125U (en) | 1989-01-24 |
Family
ID=31342564
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10781587U Pending JPS6413125U (en) | 1987-07-14 | 1987-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6413125U (en) |
-
1987
- 1987-07-14 JP JP10781587U patent/JPS6413125U/ja active Pending