JPS62166638U - - Google Patents

Info

Publication number
JPS62166638U
JPS62166638U JP5370086U JP5370086U JPS62166638U JP S62166638 U JPS62166638 U JP S62166638U JP 5370086 U JP5370086 U JP 5370086U JP 5370086 U JP5370086 U JP 5370086U JP S62166638 U JPS62166638 U JP S62166638U
Authority
JP
Japan
Prior art keywords
oxide film
film
silicon oxide
semiconductor device
silicon
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5370086U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5370086U priority Critical patent/JPS62166638U/ja
Publication of JPS62166638U publication Critical patent/JPS62166638U/ja
Pending legal-status Critical Current

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  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本考案に係る半導体装置の一実施例の
要部拡大断面図、第2図は従来の半導体装置の要
部拡大断面図である。 1:シリコン基板、2:シリコン酸化膜、3:
シリコン窒化膜、4:ノンドープCVDシリコン
酸化膜、5:ポリイミド系樹脂。
FIG. 1 is an enlarged sectional view of a main part of an embodiment of a semiconductor device according to the present invention, and FIG. 2 is an enlarged sectional view of a main part of a conventional semiconductor device. 1: Silicon substrate, 2: Silicon oxide film, 3:
Silicon nitride film, 4: Non-doped CVD silicon oxide film, 5: Polyimide resin.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] シリコン基板上に、シリコン酸化膜、シリコン
窒化膜及びノンドープCVDシリコン酸化膜を順
次形成し、さらにその表面に保護膜としてポリイ
ミド系樹脂をコートしてなる半導体装置において
、前記ポリイミド系樹脂を、上記シリコン酸化膜
、シリコン窒化膜及びノンドープCVDシリコン
酸化膜の各端部が全て露出するように形成したこ
とを特徴とする半導体装置。
In a semiconductor device in which a silicon oxide film, a silicon nitride film, and a non-doped CVD silicon oxide film are sequentially formed on a silicon substrate, and the surface thereof is further coated with a polyimide resin as a protective film, the polyimide resin is A semiconductor device characterized in that each end of an oxide film, a silicon nitride film, and a non-doped CVD silicon oxide film are all exposed.
JP5370086U 1986-04-09 1986-04-09 Pending JPS62166638U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5370086U JPS62166638U (en) 1986-04-09 1986-04-09

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5370086U JPS62166638U (en) 1986-04-09 1986-04-09

Publications (1)

Publication Number Publication Date
JPS62166638U true JPS62166638U (en) 1987-10-22

Family

ID=30880006

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5370086U Pending JPS62166638U (en) 1986-04-09 1986-04-09

Country Status (1)

Country Link
JP (1) JPS62166638U (en)

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