JPH01140835U - - Google Patents
Info
- Publication number
- JPH01140835U JPH01140835U JP3809588U JP3809588U JPH01140835U JP H01140835 U JPH01140835 U JP H01140835U JP 3809588 U JP3809588 U JP 3809588U JP 3809588 U JP3809588 U JP 3809588U JP H01140835 U JPH01140835 U JP H01140835U
- Authority
- JP
- Japan
- Prior art keywords
- pair
- elements
- bonding pad
- circuit device
- wired
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Design And Manufacture Of Integrated Circuits (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Description
第１図は実施例の回路装置を示す上面透視図、
第２図は一般的な回路図、第３図は従来の技術の
回路装置を示す上面透視図である。
１，２…素子、３…プツシユプル回路、４…制
御回路、５，５１，５２…ボンデイングパツド、
６…スルーホール、７…クロスアンダ配線、８１
，８２，９１…共通線。
FIG. 1 is a top perspective view showing the circuit device of the embodiment;
FIG. 2 is a general circuit diagram, and FIG. 3 is a top perspective view showing a conventional circuit device. 1, 2... Element, 3... Push-pull circuit, 4... Control circuit, 5, 51, 52... Bonding pad,
6...Through hole, 7...Cross under wiring, 81
, 82, 91... common line.
Claims (1)
配線し、前記一対の素子を複数対配置した各素子
のソースを各チヤンネル毎に一対の共通線に配線
してなるものにおいて、前記ボンデイングパツド
を前記一対の素子の間に配置し、前記一対の共通
線をそれぞれ前記一対の素子の外側に配置するこ
とを特徴とするＣ―ＭＯＳ ＦＥＴ集積回路装置
。 Both drains of a pair of elements are wired to a bonding pad, and the source of each element in which a plurality of pairs of the pair of elements are arranged is wired to a pair of common lines for each channel, wherein the bonding pad is connected to the bonding pad. A C-MOS FET integrated circuit device, wherein the C-MOS FET integrated circuit device is disposed between a pair of elements, and the pair of common lines are respectively disposed outside the pair of elements.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3809588U JPH01140835U (en) | 1988-03-23 | 1988-03-23 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3809588U JPH01140835U (en) | 1988-03-23 | 1988-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01140835U true JPH01140835U (en) | 1989-09-27 |
Family
ID=31264667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3809588U Pending JPH01140835U (en) | 1988-03-23 | 1988-03-23 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01140835U (en) |
-
1988
- 1988-03-23 JP JP3809588U patent/JPH01140835U/ja active Pending