JPH01134882A - Hybrid ic board device - Google Patents

Abstract

PURPOSE:To enhance connection reliability by connecting a connection end to a lead via a solder pipe formed at least at one of the connection end and the end of the lead on a circuit board. CONSTITUTION:A solder pipe 40 is formed at least at one of a connection end 22 and the end 31 of a lead 30 on a circuit board 20. Then, each of the connection end 22 and the end 31 of the lead 30 is arranged at the predetermined positions. Subsequent thereto, the solder pipe 40 at either position is melted, thereby connecting the board 20 to the lead 30. In this case, a hole is formed at the side of the connection end 22 of a conductor circuit 21 wherein no solder pipe 40 is provided. According to the aforesaid construction, melted solder flows into the hole when each lead 30 is connected to the connection end 22, thereby enhancing the reliability of connection.

Description

[Detailed description of the invention] (Industrial application field) The present invention relates to a substrate device, and particularly to electronic components.

This invention relates to a hybrid IC board device having a circuit board on which it is mounted and a lead for connecting the electronic component to the outside.

(Prior art) In a board device in which electronic components are mounted on a board, LSI
Hybrid IC composed of a combination of chip resistors, etc.
Circuits have traditionally been fabricated using ceramic circuit boards formed using thick film or eight film formation techniques. Roughly speaking, in order to turn a hybrid C circuit created like this into a component, it is necessary to add an outer lead and connect it to one circuit.

Typical examples of outer leads include lead bin insertion (Fig. 14) and F clip (Fig. 15).

On the other hand, the mounting density of electronic components has progressed further in recent years.
As circuit wiring patterns have become finer, holes have become smaller in diameter. In addition, outer leads for electronic components have progressed from insertion type to surface mount type.

In line with this trend, there is a gradual shift in circuit boards from conventional ceramic to chip-on-board (hereinafter abbreviated as COB) using resin substrates.

A conventional technology that has achieved high-density packaging using this COB is the "hybrid IC circuit device δ" proposed in, for example, Japanese Patent Application Laid-open No. 194553/1983. As shown in FIGS. 16 and 17, "A circuit board made of a material selected from silicone, polyimide, alumina, epoxy, and glass epoxy is adhered to the island portion of a metal base ribbon with adhesive, and the circuit board is Mount the circuit elements on board 1 and seal them with resin +), L/ta.
It is something.

(Problems to be Solved by the Invention) Such conventional circuit devices have the following problems that must be solved. Namely.

(0) In this conventional circuit device, the circuit board on which electronic components are mounted must be adhered to the island portion through an adhesive layer, as shown in Figure 17. This also necessitates a process for adhesion, leading to an increase in the cost of the entire circuit device.

■Generally, the circuit board is fixed to one side of the island at the same position as the beam via an adhesive layer, so the thickness is increased only on one side of the island, and of course the thickness is thicker due to the adhesive and the island. This makes it difficult to meet recent demands for thinner circuit boards.

■Generally, conductor circuits on a circuit board and leads are connected by bonding wires, but heat is applied when making this connection. This heat changes the adhesive between the island portion and the circuit board, so extreme care must be taken in this regard when wire bonding with high connection reliability is to be performed.

Therefore, the inventors of the present invention have conducted intensive research in order to solve the problems in view of the above-mentioned actual situation in this type of board device in which electronic parts are connected to M and leads are protruding from the outside. The present invention was completed based on the new finding that direct electrical connection between the circuit board side and each lead side using solder produces good results.

It is an object of the present invention to provide a board device with a simple configuration that has excellent connection reliability between electronic components and leads, can reduce the overall thickness, and can reduce manufacturing costs. It is provided by.

(Means for solving the problems) The means taken by the present invention to solve the above problems are as follows:
The following is an explanation of FIGS. 1 to 13 corresponding to the embodiment.

“Electronic components (■) and circuit boards (2) on which these are subjected to NSa
0) and a lead (0) for connecting the electronic component (10) to the outside, the circuit board (20)-
Connection end i'1 (22) of h or end f of lead (30)
The solder hump (40) formed on at least one of the li (:11) connects the connecting end (22) and the lead (30), and also connects the circuit board (20).
, electronic component (10) and circuit board of each lead (30) (
Hybrid I characterized in that the overlapping portion with 20) is sealed.
C substrate device (100) J.

That is, the hybrid IC board device (+00) according to the present invention has, as its basic configuration, an electronic component (IO), a circuit board (20) on which this is mounted, and a lead (10) that connects the electronic component (10) to the outside. 30), but each lead (30) and the circuit board (20) on which the electronic component (lO) is mounted are directly electrically connected by solder. circuit board (20
) #F on top? The electrical connection between the electronic component (10) side that is allowed and each lead (30) that is fixed to the circuit board (20) by M1 resin (50) etc. is different from the conventional one. This is the result.

In other words, the IC board device (10) according to the present invention
0), for example, the first stage electrical connection of each electronic component (10) is first made to the conductor circuit (21) on the circuit board (20) using a bonding wire (1), etc. As a second step, the connecting end (22) electrically connected to this conductor circuit (2t) and each lead (30) connected to the outside are formed with solder on either side. Electrical connection is made using a bump (40). Thereafter, the parts of the circuit board (20), electronic components (10), and each lead (30) that overlap with the circuit board (20) are sealed with a sealing resin (50), thereby forming the hybrid IC board assembly 21 ( +00) is - formed within the body.

Further, this hybrid IC substrate device (+00) can also be formed by performing a second stage before the first stage.

That is, before electrically connecting the conductor circuit (21) of the board (20) to each electronic component (lO) with a bonding wire (11) or the like, a filler bump (40) is used.
and each lead (30) may be connected.

(Actions of the Invention) By adopting the above-described measures, the present invention has the following effects. This effect will be explained according to a specific example shown in the drawings.

(2) In conventional circuit devices, the circuit board on which electronic components are mounted had to be adhered to the island portion through an adhesive layer, as shown in FIG. For this reason,
An adhesive and a process for adhesion using the adhesive are required, leading to an increase in the overall cost of the circuit device.

In this regard, in the hybrid IC board device (1 port 0) according to the present invention, either the connecting end (22) of the circuit board (20) or the end (3'') of the lead (30) Since the connecting end (22) and the lead (30) are connected by the solder bump (40) formed on at least one side of the solder bump (40), not only is there no need for an island part or an adhesive layer that was previously necessary. The connection between the circuit board & (2G) and each lead (30) is reliable from the viewpoint of electrical reliability and the rigidity required for an electronic component.

■In conventional circuit devices, the circuit board is fixed to one side of the island part at the same position as the REIT via an adhesive layer, so the thickness may be thicker only on one side of the island part. Also, of course, the thickness of the adhesive and the island increased, making it impossible to meet recent demands for thinner circuit boards.

In this regard, in the hybrid IC board device (100) according to the present invention, the electrical connection between each electronic component (lO) and each lead (30) is first performed, for example, as a first step. A conductor circuit (10) formed on a circuit board (20)
21), and as a second step, conductor circuit (2I
) and the connecting end (22) connected to each leat (30
) was performed using a solder bump (40) which had been formed in accordance with actual measurements. Therefore, in this mixed I&IC7&' board device (100), not only is there no need for an island part or an adhesive layer that was previously necessary, but also each lead (30) can be connected directly to the circuit board (20). Since it is connected directly, the overall thickness is reduced by the amount of the island part and adhesive layer that were required in the past.

In addition, each lead (3) of this hybrid IC board device (100)
0), when the circuit board (20) is positively positioned on the side opposite to the side on which each electronic component (!0) is mounted,
Each lead (30) is connected to this hybrid IC board device fi (10G
), and if it is then sealed with resin, its rigidity will be extremely high.

■In conventional circuit devices, the conductor circuit on the circuit board and the leads are connected by bonding wires.
Heat is applied when making this connection. This heat changes the adhesive between the island and the circuit board, so
When trying to perform wire bonding with high connection reliability.

This required a great deal of attention.

In this regard, in the hybrid IC board device (100) according to the present invention, for example, each electronic component (100)
) and each lead (30) is electrically connected to each electronic component (
10) formed on a circuit board (20).
), and then solder the connecting end (22) connected to the conductor circuit (21) and each lead (30) with a solder hump (40) formed in advance on either one of these.
). For this reason, electronic components (10)
Electrical connections from one circuit board (2u) to other parts using bonding wires (11), etc.
), so it does not require extreme care, but can be done with just a little attention. Further, in the hybrid IC board device (100) according to the present invention, the circuit board (20)
) side conductor circuit (21) to the bonding wire (11)
), the reliability of the electrical connection is extremely high.

■The hole (24) or (32) is formed on the connection end (z2) side of the conductor circuit (21) or on the end (31) side of the lead (30),
), each lead (30) and conductor circuit (
When the two connecting ends (22) are connected by melting the solder bump (40), the molten solder flows into the hole (24) or (32), so it is difficult to connect the lead to the circuit board (20). In addition to increasing the rigidity of the solder connection with the end (31) of (30), excess solder is removed from the 6 holes (24).
Otherwise, the solder is absorbed by (32), and the solder does not come into contact with the circuit near the connection part and cause a short circuit. That is, 8 hybrid IC, T, G plate devices (100
), the reliability of the electrical connection between each lead (30) and the connecting end (22) of the conductor circuit (21) is further increased by the presence of these holes (24) or (2). Become something.

(Example) Next, the present invention will be described in detail according to each example shown in the drawings.

Embodiment 1 tjS1 to FIG. 9 show a hybrid IC board assembly fi (10G) according to a first embodiment of the present invention.

Hybrid IC board device "f(100)" according to this first embodiment
As shown in Figure 1, first the circuit board (2
0) in which a conductor circuit (21) is formed only on one surface by a predetermined method. A connection end (2z) to be electrically connected to the conductor circuit (21) is formed as shown in any one of FIGS. 2 to 5.

In order to form the hybrid IC board device C100) according to the first embodiment, first, the connection end (20) of the circuit board (20)
22) A solder bump (40) is formed on at least one of the ends (3I) of the lead (30), and each connection end (22) and the end (31 )
After placing the two in a predetermined position, the solder bumps (40) provided on either side are melted. This establishes a physical and electrical connection between the circuit board (20) and the leads (30).

In this case, the solder bump (40) is the connection end connected to the conductor circuit (2) as shown in FIG.
22), or it may be formed on the end ff1 (:11) side of the lead (30) as shown in FIG. ) and the lead (30). In addition, as shown in the fourth [51], the solder bump (40
) is not provided at the connection end (22) of the conductor circuit (21)
It may also be implemented by forming a hole (24) on the side. In this case, each lead (30) is connected to the connecting end (2
2), the molten solder flows into this hole (24) as shown in Figure 6, so the valley lead (3)
The reliability of the connection between the connecting end (22) and the connecting end (22) is extremely high. Similarly, as shown in No. 5U54, when a hole (32) is formed at the end (31) of LE)' (:IO), the molten solder in this hole (32) is Since it flows as shown in Fig. 7, each lead (30) and the connection end ff1 (zz)
The reliability of the electrical connection with the No. 81:4 is a hybrid IC board device (100) by forming a solder bump (40) on the end (31) side of each lead (30).
An example is shown in which a solder hump (40
) is shown as an example in which a hybrid TC substrate assembly 2t (too) is formed in one step.

Finally, the circuit board (20), the electronic component (10), and each board (30) with each connection completed as described above are assembled.
) overlapping the circuit board (20) with 1M adhesive resin (50
) by sealing +1-, the substrate device (+00
).

Figures 10 and 11 show a hybrid IC board 5 according to a second embodiment of the present invention. It indicates whether ta (too) or not.

In the hybrid TC board device (100) according to the second embodiment, as shown in FIG. 10, the leads (30) and the circuit board (20) are placed in the same position, (20) all connection terminals (22) t') - t(3
0) and the end (31) are connected by solder. In the circuit board (20) in this case, by leaving a - section of the through hole (25) as shown in FIG. 11 on the end surface thereof and forming this as a so-called side through hole, A connection end (22) continuous with the conductor circuit (21)
) Toshishita. A solder bump (4υ) is formed on the end (3I) side of the lead (30) facing the side through hole (25), and by melting this solder, this mixture can be removed; 100) is
The circuit board (20) and each REIT (]0) are connected by solder through side through holes (25) which are connection ends (22). The rest is the same as the first embodiment, so details will be omitted.

Implementation g! 43 FIGS. 12 and 13 show a hybrid IC board device (100) according to a third embodiment of the present invention. In the case of the third embodiment and the second embodiment, the electronic component (10) is mounted on one side of the circuit board (20), but the hybrid IC board device (100 ), electronic components (10) are arranged on both the front and back surfaces of a circuit board (20). In this case, a hybrid IC board device (+00
), but FIG. 13 shows a hybrid IC board: S+a (100) in which chip components are arranged below the circuit board (20). Since the other configurations are substantially the same as those of the embodiments described in L, the details thereof will be omitted.

(Effects of the Invention) As described in detail below, in the present invention, as exemplified in each embodiment described above, "the connection end (22) on the circuit board (20) or the connection end (22) on the circuit board (20) The connection end (22) and the lead (30) are connected by a solder bump (=10) formed on at least one of the ends (3I) of the circuit board (20). , electronic components (1 unit) and each lead (30
), which overlaps with the circuit board (20), is characterized by its structure.This allows for superior connection reliability between electronic components and the REIT, and allows for a thinner overall thickness. Moreover, it is possible to provide a substrate device with a simple configuration that can reduce manufacturing costs.

That is, the hybrid IC board device (jull) according to the present invention
This has the following specific effects.

■In the hybrid TC board device (100) according to the present invention, a 1 / solder bump (40) connects the connecting end (2).
2) and the leads (30), not only is there no need for the island part or adhesive layer that was previously required, but the connection between the circuit board (20) and each lead (311) is This makes it reliable both in terms of electrical reliability and the rigidity required as an electronic component.

■In the hybrid IC board device (100) according to the present invention, the electrical connection between each electronic component (10) and each lead (30) is first made by connecting each electronic component (1◎) as a first step. The conductive circuit (2I) formed on the circuit board (20)) is then connected to the connecting end (22) connected to the conductive circuit (21) and each lead (30) in the second step. - Solder bump (40) previously formed on the mountain side
It is done by. Or the second stage before the first stage.
went through the stages. Therefore, this hybrid IC board assembly 22 (t
oo) not only eliminates the need for the island part and adhesive layer that were conventionally required, but also allows each lead (30) to be directly connected to the circuit board (20).
The overall thickness can be reduced at least by the amount of the island portion and adhesive layer that were conventionally required.

■As mentioned above, in the hybrid IC board device (10G) according to the present invention, each electronic component (1 port) and each lead (3
For example, the electrical connection with each electronic component (10)
After performing this on the conductor circuit (21) formed on the circuit board (20), the connection end (22) connected to the conductor circuit (21) and each lead (30) are connected to either of these. This is done by means of solder bumps (40) previously formed in the example. Therefore, electrical connections from the electronic component (10) to other parts using bonding wires (II) etc. can be made to the conductor circuit (21) on one circuit board (20). It is something that can be done with caution. Further, the hybrid tC according to the present invention
In the case of the board mounting 2i (+00), it is sufficient to electrically connect the conductor circuit (21) on the circuit board (20) side with the bonding wire (11) as shown below. This makes it possible to make the reliability of the system extremely high.

■Furthermore, a hole (24) is provided on the connection end (22) side of the conductor circuit (21) or on the end (1) side of the lead (30).
Or (32) is formed to form the hybrid IC substrate device (10
0), each lead (30) and the connection end (22) of the conductor circuit (21) are connected with a solder bump (40).
When the molten solder is melted and connected, the molten solder flows into the hole (24) or (3z).
) and the connection end (22) can be made even more reliable.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view of the plate device according to the first embodiment of the present invention, and FIGS. 2 to 5 each show a method of connecting the connecting end and the lead using solder bumps. A partial perspective view, FIG. 6 is a partially enlarged cross-sectional view of the connecting end when the connection is made using the method shown in FIG. 4, and FIG. FIG. 8 is a partially enlarged cross-sectional view of the connector as viewed from the center of the hole on the connection end side, and each of FIGS. 8 and 9 is a cross-sectional view showing a state in which the solder bumps are formed at different locations and are connected. 10 and 11 are a longitudinal sectional view and a perspective view of a side through hole of a substrate device according to a second embodiment of the present invention. Furthermore, each of FIGS. 12 and 13 [g is a longitudinal sectional view showing a third embodiment according to the present invention. In addition, each of FIG. 14 to FIG. 16 is a conventional hybrid IC.
A perspective view and a vertical sectional view for showing the type of the board device, 1st
) is a perspective view showing the manufacturing state of the hybrid integrated circuit device shown in FIG. 16. Explanation of symbols 100--Hybrid IC board device, 5θ--Side through hole, 10--Electronic component, 11--Bonding wire, 20--Circuit board, 21--Conductor circuit, 22--Connection end. 24...hole, 25...through hole, 30-...
Lead,: 11-... end, 32-... hole, 40...
Solder bump, 41...Solder, 50-...Sealing resin. -L

Claims (1)

[Claims] 1). In a board device having an electronic component, a circuit board on which the electronic component is mounted, and a lead for connecting the electronic component to the outside, the wire is formed on at least one of a connecting end on the circuit board or an end of the lead. A hybrid IC board device, characterized in that the connection ends and the leads are connected by solder bumps, and the circuit board, electronic components, and portions of the leads that overlap with the circuit board are sealed. 2). 2. The hybrid IC board device according to claim 1, wherein holes are formed at connection ends on the circuit board, into which the solder of the solder bumps flows. 3). 2. The hybrid IC board device according to claim 1, wherein holes are formed in the leads corresponding to connection ends on the circuit board, into which the solder of the solder bumps flows. 4). Any one of claims 1 to 3, wherein the connection end on the circuit board is formed on the opposite side of the circuit board to the side on which the electronic component is mounted. A hybrid IC substrate device according to claim 1.