JPH01132067U - - Google Patents
Info
- Publication number
- JPH01132067U JPH01132067U JP2751288U JP2751288U JPH01132067U JP H01132067 U JPH01132067 U JP H01132067U JP 2751288 U JP2751288 U JP 2751288U JP 2751288 U JP2751288 U JP 2751288U JP H01132067 U JPH01132067 U JP H01132067U
- Authority
- JP
- Japan
- Prior art keywords
- conductive circuit
- insulating substrate
- terminal
- fixing hole
- connection terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims 2
- 238000010304 firing Methods 0.000 claims 1
- 238000009413 insulation Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Manufacturing Of Electrical Connectors (AREA)
- Multi-Conductor Connections (AREA)
Description
第１図ａは本考案の導電回路の接続端子構造の
一実施例を示す斜視図、ｂはａのＡ―Ａ断面図、
ｃはａのＢ―Ｂ断面図、第２図ａは本考案の他の
実施例を示す斜視図、ｂはａのＡ―Ａ断面図であ
り、第３図ａは従来の接続端子構造を示す斜視図
、ｂはａのＡ―Ａ断面図である。
１……絶縁基板、２……端子固定孔、３ａ，３
ｂ……接続端子、４……導電回路、６……半田、
９……補強絶縁片。
FIG. 1a is a perspective view showing an embodiment of the connection terminal structure of the conductive circuit of the present invention, and FIG.
c is a sectional view taken along line B-B of a, FIG. 2 a is a perspective view showing another embodiment of the present invention, b is a cross-sectional view taken along A-A of a, and FIG. The perspective view shown in FIG. 1...Insulating board, 2...Terminal fixing hole, 3a, 3
b... Connection terminal, 4... Conductive circuit, 6... Solder,
9...Reinforcement insulation piece.
Claims (1)
端面を該絶縁基板上に露出した接続端子に、導電
回路が被覆して形成された状態で、焼成処理が施
され、該接続端子が該導電回路の硬化により接着
されて成ることを特徴とする、導電回路の接続端
子構造。 The connecting terminal is inserted into the terminal fixing hole drilled in the insulating substrate and has one end surface exposed on the insulating substrate, and is coated with a conductive circuit and is then subjected to a firing treatment. A connection terminal structure for a conductive circuit, characterized in that the conductive circuit is bonded by curing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2751288U JPH01132067U (en) | 1988-03-03 | 1988-03-03 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2751288U JPH01132067U (en) | 1988-03-03 | 1988-03-03 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01132067U true JPH01132067U (en) | 1989-09-07 |
Family
ID=31250068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2751288U Pending JPH01132067U (en) | 1988-03-03 | 1988-03-03 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01132067U (en) |
-
1988
- 1988-03-03 JP JP2751288U patent/JPH01132067U/ja active Pending
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