JPH0295266U - - Google Patents
Info
- Publication number
- JPH0295266U JPH0295266U JP420189U JP420189U JPH0295266U JP H0295266 U JPH0295266 U JP H0295266U JP 420189 U JP420189 U JP 420189U JP 420189 U JP420189 U JP 420189U JP H0295266 U JPH0295266 U JP H0295266U
- Authority
- JP
- Japan
- Prior art keywords
- tip
- inclined surface
- circuit board
- conductor pattern
- lead pin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000002184 metal Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000001070 adhesive effect Effects 0.000 claims description 2
- 239000005394 sealing glass Substances 0.000 claims description 2
- 239000000758 substrate Substances 0.000 claims 1
Landscapes
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Structure Of Printed Boards (AREA)
- Mounting Of Printed Circuit Boards And The Like (AREA)
Description
第１図ａ，ｂは本考案による一実施例の側断面
図及びそのＡ部拡大図、第２図は第１図の金属ブ
ツシユの斜視図、第３図は本考案による他の実施
例の一部破断を含む要部斜視図、第４図は本考案
による更に他の実施例の側断面図、第５図は従来
技術による側断面図である。
図において、１は金属ケース、２は回路基板、
２ａは導体パターン、２ｂは傾斜面、３は金属ブ
ツシユ、３ａ−１は傾斜面、３ｃは封着ガラス、
３ｄはリードピン、４は導電性接着剤、５は導線
を示す。
Figures 1a and b are side sectional views and enlarged views of part A of one embodiment of the invention, Figure 2 is a perspective view of the metal bushing in Figure 1, and Figure 3 is another embodiment of the invention. FIG. 4 is a side sectional view of still another embodiment of the present invention, and FIG. 5 is a side sectional view of the prior art. In the figure, 1 is a metal case, 2 is a circuit board,
2a is a conductor pattern, 2b is an inclined surface, 3 is a metal bushing, 3a-1 is an inclined surface, 3c is a sealing glass,
3d is a lead pin, 4 is a conductive adhesive, and 5 is a conducting wire.
Claims (1)
以下程度に突出させ且つ先端高さを回路基板２の
導体パターン２ａ面とほぼ面一にし他端を外部に
貫通して封着ガラス３ｃでリードピン３ｄを絶縁
植設した傾斜面３ａ―１を有する金属ブツシユ３
を固着し、該金属ブツシユ３と近接する端面を前
記傾斜面３ａ―１と平行する傾斜面２ｂに形成し
た回路基板２を傾斜面同士を沿わせて導電性接着
剤４で固着し、該回路基板２の導体パターン２ａ
と前記リードピン３ｄ先端とを電気接続すること
を特徴とする回路基板の実装構造。 The tip protrudes from the mounting surface of the metal case 1 by about half or less of the pin diameter, and the height of the tip is made almost flush with the surface of the conductor pattern 2a of the circuit board 2, and the other end is penetrated to the outside and sealed with the sealing glass 3c. A metal bushing 3 having an inclined surface 3a-1 on which a lead pin 3d is insulated.
A circuit board 2 whose end surface adjacent to the metal bushing 3 is formed into an inclined surface 2b parallel to the inclined surface 3a-1 is fixed with a conductive adhesive 4 with the inclined surfaces aligned, and the circuit Conductor pattern 2a on substrate 2
and the tip of the lead pin 3d are electrically connected to each other.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP420189U JPH0623032Y2 (en) | 1989-01-17 | 1989-01-17 | Circuit board mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP420189U JPH0623032Y2 (en) | 1989-01-17 | 1989-01-17 | Circuit board mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0295266U true JPH0295266U (en) | 1990-07-30 |
| JPH0623032Y2 JPH0623032Y2 (en) | 1994-06-15 |
Family
ID=31206501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP420189U Expired - Lifetime JPH0623032Y2 (en) | 1989-01-17 | 1989-01-17 | Circuit board mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0623032Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199383A (en) * | 2009-02-26 | 2010-09-09 | Fujikura Ltd | Substrate with adhesive, and flexible printed circuit wiring board |
-
1989
- 1989-01-17 JP JP420189U patent/JPH0623032Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010199383A (en) * | 2009-02-26 | 2010-09-09 | Fujikura Ltd | Substrate with adhesive, and flexible printed circuit wiring board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0623032Y2 (en) | 1994-06-15 |
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