JPH01127251U - - Google Patents
Info
- Publication number
- JPH01127251U JPH01127251U JP1988023962U JP2396288U JPH01127251U JP H01127251 U JPH01127251 U JP H01127251U JP 1988023962 U JP1988023962 U JP 1988023962U JP 2396288 U JP2396288 U JP 2396288U JP H01127251 U JPH01127251 U JP H01127251U
- Authority
- JP
- Japan
- Prior art keywords
- base ribbon
- heat sink
- hybrid
- insulating sheet
- active
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004020 conductor Substances 0.000 claims description 2
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49517—Additional leads
- H01L23/49531—Additional leads the additional leads being a wiring board
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/13—Discrete devices, e.g. 3 terminal devices
- H01L2924/1304—Transistor
- H01L2924/1306—Field-effect transistor [FET]
- H01L2924/13091—Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Electrostatic Charge, Transfer And Separation In Electrography (AREA)
- Color Electrophotography (AREA)
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023962U JPH064595Y2 (ja) | 1988-02-24 | 1988-02-24 | ハイブリッドｉｃ |
| JP63327960A JP2763901B2 (ja) | 1988-02-05 | 1988-12-27 | 画像形成装置 |
| US07/305,636 US4905048A (en) | 1988-02-05 | 1989-02-03 | Color copying apparatus |
| DE3903273A DE3903273C2 (de) | 1988-02-24 | 1989-02-03 | Farbkopiergerät |
| EP89301496A EP0330372A3 (en) | 1988-02-24 | 1989-02-16 | Hybrid ic with heat sink |
| US07/314,503 US4949220A (en) | 1988-02-24 | 1989-02-23 | Hybrid IC with heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988023962U JPH064595Y2 (ja) | 1988-02-24 | 1988-02-24 | ハイブリッドｉｃ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01127251U true JPH01127251U (US07923587-20110412-C00022.png) | 1989-08-31 |
| JPH064595Y2 JPH064595Y2 (ja) | 1994-02-02 |
Family
ID=12125176
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988023962U Expired - Lifetime JPH064595Y2 (ja) | 1988-02-05 | 1988-02-24 | ハイブリッドｉｃ |
| JP63327960A Expired - Fee Related JP2763901B2 (ja) | 1988-02-05 | 1988-12-27 | 画像形成装置 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63327960A Expired - Fee Related JP2763901B2 (ja) | 1988-02-05 | 1988-12-27 | 画像形成装置 |
Country Status (3)
| Country | Link |
|---|---|
| US (1) | US4949220A (US07923587-20110412-C00022.png) |
| EP (1) | EP0330372A3 (US07923587-20110412-C00022.png) |
| JP (2) | JPH064595Y2 (US07923587-20110412-C00022.png) |
Families Citing this family (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0671061B2 (ja) * | 1989-05-22 | 1994-09-07 | 株式会社東芝 | 樹脂封止型半導体装置 |
| US5119266A (en) * | 1989-12-29 | 1992-06-02 | Ail Systems, Inc. (Subsidiary Of Eaton Corp.) | Electromagnetic interference filter protection circuit |
| US5153449A (en) * | 1990-08-28 | 1992-10-06 | Milwaukee Electric Tool Corporation | Heatsink bus for electronic switch |
| IT1250405B (it) * | 1991-01-31 | 1995-04-07 | Sgs Thomson Microelectronics | Piastrina metallica di dissipazione del calore di un dispositivo a semiconduttore di potenza incapsulato in resina fornita di rilievi per la saldatura dei fili di massa |
| JPH0582685A (ja) * | 1991-09-24 | 1993-04-02 | Mitsubishi Electric Corp | 混成集積部品の放熱部および端子部用構造体とその構造体を用いた混成集積部品の製造方法 |
| US5170930A (en) * | 1991-11-14 | 1992-12-15 | Microelectronics And Computer Technology Corporation | Liquid metal paste for thermal and electrical connections |
| US5328870A (en) * | 1992-01-17 | 1994-07-12 | Amkor Electronics, Inc. | Method for forming plastic molded package with heat sink for integrated circuit devices |
| JPH06120374A (ja) * | 1992-03-31 | 1994-04-28 | Amkor Electron Inc | 半導体パッケージ構造、半導体パッケージ方法及び半導体パッケージ用放熱板 |
| US5445308A (en) * | 1993-03-29 | 1995-08-29 | Nelson; Richard D. | Thermally conductive connection with matrix material and randomly dispersed filler containing liquid metal |
| US5328087A (en) * | 1993-03-29 | 1994-07-12 | Microelectronics And Computer Technology Corporation | Thermally and electrically conductive adhesive material and method of bonding with same |
| US5701034A (en) * | 1994-05-03 | 1997-12-23 | Amkor Electronics, Inc. | Packaged semiconductor die including heat sink with locking feature |
| EP0698922B1 (en) * | 1994-08-12 | 2001-06-06 | STMicroelectronics S.r.l. | Leadframe for supporting integrated semiconductor devices |
| JP3286106B2 (ja) * | 1995-03-01 | 2002-05-27 | 株式会社日立製作所 | スイッチング電源装置 |
| US6261867B1 (en) | 1998-03-13 | 2001-07-17 | Stratedge Corporation | Method of making a package for microelectronic devices using iron oxide as a bonding agent |
| US6469907B1 (en) | 2000-10-23 | 2002-10-22 | Team Pacific, Corporation | Packaging for power and other circuitry |
| JP3906767B2 (ja) * | 2002-09-03 | 2007-04-18 | 株式会社日立製作所 | 自動車用電子制御装置 |
| US8979353B2 (en) | 2011-08-11 | 2015-03-17 | Starlights, Inc. | Light fixture having modular accessories and method of forming same |
| JP6810279B2 (ja) * | 2017-10-26 | 2021-01-06 | 新電元工業株式会社 | 電子部品 |
Family Cites Families (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5669858A (en) * | 1979-11-13 | 1981-06-11 | Tohoku Metal Ind Ltd | Hybrid integrated circuit with power transistor and its manufacture |
| JPS56133857A (en) * | 1980-03-25 | 1981-10-20 | Fujitsu Ltd | Manufacture of hybrid ic |
| JPS5833953A (ja) * | 1981-08-18 | 1983-02-28 | Mitsubishi Electric Corp | 可変速電動工具用半導体電圧制御装置 |
| JPS5839018A (ja) * | 1981-09-02 | 1983-03-07 | Mitsubishi Electric Corp | 混成集積回路の組立方法 |
| JPS58198062A (ja) * | 1982-05-15 | 1983-11-17 | Canon Inc | カラ−複写装置 |
| DE3241509A1 (de) * | 1982-11-10 | 1984-05-10 | Brown, Boveri & Cie Ag, 6800 Mannheim | Leistungstransistor-modul |
| US4521828A (en) * | 1982-12-23 | 1985-06-04 | At&T Technologies, Inc. | Component module for piggyback mounting on a circuit package having dual-in-line leads |
| JPS60123877A (ja) * | 1983-12-09 | 1985-07-02 | Canon Inc | 画像記録装置 |
| JPS60258566A (ja) * | 1984-12-20 | 1985-12-20 | Konishiroku Photo Ind Co Ltd | 複写機 |
| JPS61170052A (ja) * | 1985-01-23 | 1986-07-31 | Toshiba Corp | 電力用樹脂封止型半導体装置 |
| JPS61218136A (ja) * | 1985-03-25 | 1986-09-27 | Hitachi Ltd | パワ−アレイの製造方法 |
| JPS62118366A (ja) * | 1985-11-18 | 1987-05-29 | Ricoh Co Ltd | 複写装置 |
-
1988
- 1988-02-24 JP JP1988023962U patent/JPH064595Y2/ja not_active Expired - Lifetime
- 1988-12-27 JP JP63327960A patent/JP2763901B2/ja not_active Expired - Fee Related
-
1989
- 1989-02-16 EP EP89301496A patent/EP0330372A3/en not_active Withdrawn
- 1989-02-23 US US07/314,503 patent/US4949220A/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2763901B2 (ja) | 1998-06-11 |
| US4949220A (en) | 1990-08-14 |
| EP0330372A3 (en) | 1990-06-13 |
| JPH064595Y2 (ja) | 1994-02-02 |
| JPH01302277A (ja) | 1989-12-06 |
| EP0330372A2 (en) | 1989-08-30 |
