JPH01120345U - - Google Patents
Info
- Publication number
- JPH01120345U JPH01120345U JP1531088U JP1531088U JPH01120345U JP H01120345 U JPH01120345 U JP H01120345U JP 1531088 U JP1531088 U JP 1531088U JP 1531088 U JP1531088 U JP 1531088U JP H01120345 U JPH01120345 U JP H01120345U
- Authority
- JP
- Japan
- Prior art keywords
- board
- case body
- semiconductor device
- electronic components
- contacts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000011347 resin Substances 0.000 claims description 2
- 229920005989 resin Polymers 0.000 claims description 2
- 210000000078 claw Anatomy 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Landscapes
- Casings For Electric Apparatus (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Description
第１図〜第３図は、この考案の第１実施例を示
した図面であり、第１図は本考案に係る半導体装
置の縦断面図である。第２図は、第１図に係る半
導体装置の構成部品を分解した斜視図である。第
３図は、第１図及び第２図に示す上部ケース体の
縦断面図である。第４図は、この考案の第２実施
例の縦断面図である。第５図は従来の技術を示し
た半導体装置の縦断面図である。第６図は、第５
図に示すリングの斜視図である。
１…基板、３…半導体チツプ等の電子部品、６
…上部ケース体、７…下部ケース体、８…筒部、
９…爪、１０…樹脂。
1 to 3 are drawings showing a first embodiment of this invention, and FIG. 1 is a longitudinal sectional view of a semiconductor device according to the invention. FIG. 2 is an exploded perspective view of the components of the semiconductor device according to FIG. 1. FIG. 3 is a longitudinal sectional view of the upper case body shown in FIGS. 1 and 2. FIG. FIG. 4 is a longitudinal sectional view of a second embodiment of this invention. FIG. 5 is a longitudinal sectional view of a semiconductor device showing a conventional technique. Figure 6 shows the fifth
FIG. 3 is a perspective view of the ring shown in the figure. 1...Substrate, 3...Electronic components such as semiconductor chips, 6
...Upper case body, 7...Lower case body, 8...Cylinder part,
9...Claw, 10...Resin.
Claims (1)
基板を収納するケース体とを備えた半導体装置に
於いて、前記ケース体の略中央には基板に当接す
ると共に樹脂を流入する筒部を一体的に突設した
ことを特徴とした半導体装置。 In a semiconductor device comprising a board on which electronic components such as semiconductor chips are mounted and a case body housing the board, a cylindrical part that contacts the board and into which resin flows is integrated approximately in the center of the case body. A semiconductor device characterized by a protruding structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1531088U JPH01120345U (en) | 1988-02-08 | 1988-02-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1531088U JPH01120345U (en) | 1988-02-08 | 1988-02-08 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01120345U true JPH01120345U (en) | 1989-08-15 |
Family
ID=31227249
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1531088U Pending JPH01120345U (en) | 1988-02-08 | 1988-02-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01120345U (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629730U (en) * | 1985-07-04 | 1987-01-21 |
-
1988
- 1988-02-08 JP JP1531088U patent/JPH01120345U/ja active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS629730U (en) * | 1985-07-04 | 1987-01-21 |