JPH01120331U - - Google Patents

Info

Publication number
JPH01120331U
JPH01120331U JP1482188U JP1482188U JPH01120331U JP H01120331 U JPH01120331 U JP H01120331U JP 1482188 U JP1482188 U JP 1482188U JP 1482188 U JP1482188 U JP 1482188U JP H01120331 U JPH01120331 U JP H01120331U
Authority
JP
Japan
Prior art keywords
pellet
hole
semiconductor
semiconductor pellet
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1482188U
Other languages
English (en)
Other versions
JPH062264Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988014821U priority Critical patent/JPH062264Y2/ja
Publication of JPH01120331U publication Critical patent/JPH01120331U/ja
Application granted granted Critical
Publication of JPH062264Y2 publication Critical patent/JPH062264Y2/ja
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
    • H01L2924/15151—Shape the die mounting substrate comprising an aperture, e.g. for underfilling, outgassing, window type wire connections

Landscapes

  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Description

【図面の簡単な説明】
第１図は本考案の一実施例にかかる半導体装置
の一部破断斜視図、第２図は同実施例のペレツト
のワイヤボンデイング時を示す横断面図、第３図
は本考案の他の実施例にかかる半導体装置の一部
破断斜視図、第４図は同実施例の要部縦断面図、
第５図は本考案の更に他の実施例にかかる半導体
装置の一部破断斜視図、第６図は従来の半導体装
置の要部断面図である。 １，１０，２０…半導体装置、２…ペレツト、
２ａ…電極、３ａ…ペレツトマウント部、３ｂ…
リード、４…透孔。

Claims (1)

    【実用新案登録請求の範囲】
  1. 透孔を有するペレツトマウント部に、前記透孔
    を閉塞する状態で半導体ペレツトを載置し、半導
    体ペレツト上の電極と、一端を半導体ペレツト近
    傍に配設したリードとを電気的に接続して樹脂モ
    ールドしたことを特徴とする半導体装置。
JP1988014821U 1988-02-05 1988-02-05 半導体装置 Expired - Lifetime JPH062264Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988014821U JPH062264Y2 (ja) 1988-02-05 1988-02-05 半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988014821U JPH062264Y2 (ja) 1988-02-05 1988-02-05 半導体装置

Publications (2)

Publication Number Publication Date
JPH01120331U true JPH01120331U (ja) 1989-08-15
JPH062264Y2 JPH062264Y2 (ja) 1994-01-19

Family

ID=31226352

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988014821U Expired - Lifetime JPH062264Y2 (ja) 1988-02-05 1988-02-05 半導体装置

Country Status (1)

Country Link
JP (1) JPH062264Y2 (ja)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583038U (ja) * 1981-06-29 1983-01-10 富士通株式会社 リ−ドフレ−ム

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS583038U (ja) * 1981-06-29 1983-01-10 富士通株式会社 リ−ドフレ−ム

Also Published As

Publication number Publication date
JPH062264Y2 (ja) 1994-01-19

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