JPH01117398A - Electronic component mounting equipment - Google Patents

Electronic component mounting equipment

Info

Publication number
JPH01117398A
JPH01117398A JP62276144A JP27614487A JPH01117398A JP H01117398 A JPH01117398 A JP H01117398A JP 62276144 A JP62276144 A JP 62276144A JP 27614487 A JP27614487 A JP 27614487A JP H01117398 A JPH01117398 A JP H01117398A
Authority
JP
Japan
Prior art keywords
tray
suction
sucking
empty
electronic component
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62276144A
Other languages
Japanese (ja)
Other versions
JPH07105625B2 (en
Inventor
Wataru Hirai
弥 平井
Shiro Oji
士朗 大路
Kunio Sakurai
邦男 櫻井
Yoshihiko Misawa
義彦 三沢
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP62276144A priority Critical patent/JPH07105625B2/en
Publication of JPH01117398A publication Critical patent/JPH01117398A/en
Publication of JPH07105625B2 publication Critical patent/JPH07105625B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Abstract

PURPOSE:To enable the disposal of all empty trays by a single sucking head even if trays of plural kinds are arranged in plural layers by a method wherein a sucking head, which sucks an empty tray and is movable up and down, is provided to a X-Y axis table, and a height detecting section which detects that the sucking head descends down and reaches the upper face of the empty tray is provided. CONSTITUTION:A sucking head 3 is made to transfer just above an empty tray 10 by X-Y axis tables 5 and 4. Then, the sucking pads, for example, 12 and 14 previously set by a program begin to suck as an air cylinder 15 starts decending. A height detector 16 starts operating when the sucking pad reaches to the upper face of the tray 10 as descending, and then the air cylinder 15 starts ascending. If a suction detector 17 is in operation when the air cylinder reaches to the upper limit, it is judged that the tray 10 is still sucked by the sucking pad. Next, the sucking head 3 is made to transfer to a position of a case 9 which encloses a waste tray through the X-Y tables 5 and 4, then the empty tray 10 is disposed.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、マトリックス状のトレイに収納された電子部
品をプリント基板に装着する電子部品装着機に関するも
のである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to an electronic component mounting machine that mounts electronic components stored in a matrix tray onto a printed circuit board.

従来の技術 従来のこの種の電子部品装着機のトレイ廃棄方法はたと
えば第4図に示すような構造になっていた。1o1は装
着ヘッドで、XYテーブル102に搭載されxY力方向
任意な位置に位置決め可能である。103はプリント基
板である。104はトVイ供給部で本図では前後針4ケ
所配置されている。105は電子部品を収納しているマ
トリックス状のトレイで、106はストックされている
トレイである。107はシャッター、108はシュート
、109は空トレイを回収する箱である。
2. Description of the Related Art A conventional tray disposal method for this type of electronic component mounting machine has a structure as shown in FIG. 4, for example. 1o1 is a mounting head which is mounted on the XY table 102 and can be positioned at any position in the xY force directions. 103 is a printed circuit board. Reference numeral 104 denotes a toy supply section, and in this figure, four needles are arranged at front and rear needles. 105 is a matrix-shaped tray that stores electronic components, and 106 is a tray that is stocked. 107 is a shutter, 108 is a chute, and 109 is a box for collecting empty trays.

動作としては、装着ヘッド101でトレイ105内の電
子部品を吸着保持し、XYテーブル102でプリント基
板103の所定位置に移動し装着する。その動作を繰シ
返して、トレイ106が空になるシャッター107が開
放され、シュート108を滑走して、箱169に回収さ
れる。次にシャッター107が閉じてストックされてい
るトレイ106から新たに一枚供給される。
In operation, the mounting head 101 sucks and holds the electronic components in the tray 105, and the XY table 102 moves them to a predetermined position on the printed circuit board 103 to mount them. By repeating this operation, the shutter 107 is opened to empty the tray 106, the tray 106 slides down the chute 108, and is collected in the box 169. Next, the shutter 107 is closed and a new sheet is supplied from the stocked tray 106.

発明が解決しようとする問題点 しかしながら上記のような構造では、トレイ供給部ごと
にトレイ廃棄機構や空トレイ回収箱が必要であり、構造
が複雑になり高価なものとなる。
Problems to be Solved by the Invention However, the above structure requires a tray disposal mechanism and an empty tray collection box for each tray supply section, making the structure complex and expensive.

又トレイ一種類に対しての機械的スペースも大きくなる
等の問題点があった。
Further, there are problems such as the mechanical space required for one type of tray becomes large.

本発明は、上記問題点を解決するもので、ひとつのトレ
イ廃棄機構で複数種のトレイの廃棄が可能で、スペース
的にも小さくできる、空トレイ廃棄装置を備えた電子部
品装着機を提供するものである。
The present invention solves the above-mentioned problems, and provides an electronic component mounting machine equipped with an empty tray disposal device that can dispose of multiple types of trays with one tray disposal mechanism and can be made smaller in terms of space. It is something.

問題点を解決するための手段 上記の問題点を解決するために、XY軸テーブルに空ト
レイを廃棄する上下動可能な吸着ヘッドを設け、この吸
着ヘッドが下降してトレイ上面に到達したことを検出す
る高さ検出部と、前記吸着ヘッド内の吸着位置がプログ
ラマブルに切替え可能な複数個の吸着回路と、トレイを
吸着したことを検出する吸着検出部で構成するものであ
る。
Means for solving the problem In order to solve the above problem, a vertically movable suction head for discarding empty trays is installed on the XY-axis table, and a system is used to detect when the suction head descends and reaches the top surface of the tray. The apparatus is composed of a height detection section for detecting a height, a plurality of suction circuits whose suction positions within the suction head can be programmably switched, and a suction detection section for detecting that a tray has been suctioned.

作  用 上記の構成により、トレイが空になった場合、そのトレ
イの位置へXYテーブルが移動し、吸着ヘッドが下降す
ると共に、予じめプログラムで指定された、吸着回路が
作動する。そして、トレイ上面に到達すると高さ検出部
が作動し吸着ヘッドは上昇する。その上昇した時にトレ
イを吸着したか否かを吸着検出部で判定する。NGの場
合、再度吸着ヘッドは下降し吸着動作を行なう。OKの
場合はXYテーブルが所定の廃棄ステージ冒ンに移動し
、吸着回路をOF’F してトレイを廃棄する。
Operation With the above configuration, when a tray becomes empty, the XY table moves to the position of the tray, the suction head descends, and the suction circuit specified in advance in the program is activated. When the suction head reaches the upper surface of the tray, the height detection section is activated and the suction head rises. The suction detection section determines whether or not the tray is suctioned when the tray is raised. In the case of NG, the suction head descends again and performs the suction operation. If OK, the XY table moves to a predetermined disposal stage, the suction circuit is turned off, and the tray is discarded.

このようにひとつのトレイ廃棄機構で複数種のトレイを
同一場所に廃棄するよう構成するものである。
In this way, a single tray disposal mechanism is configured to discard a plurality of types of trays at the same location.

実施例 以下、本発明の一実施例について第1図〜第3図に基づ
いて説明する。
EXAMPLE Hereinafter, an example of the present invention will be described based on FIGS. 1 to 3.

電子部品装着機の全体を示す第2図〜第3図において、
1はトレイを収納しているトレイ箱で複数個配列されて
いる。2は2軸テーブルで上下動して電子部品を吸着保
持する。3は吸着ヘッドで空トレイの吸着を行なう。4
はY軸テーブルで、前記2軸テーブル2及び吸着ヘッド
3をY方向に駆動スる。5はX軸テーブルで前記Y軸テ
ーブルをX方向に駆動する。6は移動治具で、前記X。
In FIGS. 2 and 3 showing the entire electronic component mounting machine,
A plurality of tray boxes 1 are arranged to store trays. 2 is a two-axis table that moves up and down to suction and hold electronic components. 3 is a suction head that suctions the empty tray. 4
is a Y-axis table, which drives the two-axis table 2 and suction head 3 in the Y direction. 5 is an X-axis table that drives the Y-axis table in the X direction. 6 is a moving jig, which is the above-mentioned X.

Y、Z軸テーブル5,4.2によシ移載された電子部品
を第1位置(図示A)から第2位置(図示B)へ搬送す
る。7は装着ヘッドで第2位置から電子部品を吸着しプ
リント基板s上に装着する。
The electronic components transferred by the Y and Z axis tables 5, 4.2 are transported from the first position (A in the figure) to the second position (B in the figure). 7 is a mounting head that picks up the electronic component from the second position and mounts it onto the printed circuit board s.

9は廃棄し九トレイを収納する箱である。9 is a box for storing the discarded 9 trays.

前記吸着ヘッド3の詳細について第1図に基づいて説明
する。吸着ヘッド3はXY軸テープA/6゜4に搭載さ
れている。
Details of the suction head 3 will be explained based on FIG. 1. The suction head 3 is mounted on the XY-axis tape A/6°4.

1oはマトリックス状のトレイで複数枚重さねて、トレ
イ箱1に収納されている。11は電子部品である。吸着
ヘッド3は、吸着パッドが12゜13.14と複数個設
けである。とれはトレイ形状によりプログラマブルに吸
着バット12 、13゜14の吸着が切替えられる。1
6は吸着ヘッド3を上下動させるエアー7リンダー、1
6は吸着ヘッド3が下降してトレイ10の上面に到達し
たことを検出する高さ検出器で−ある。17はトレイ1
゜が確実に吸着されたことを検出する吸着検出器である
A plurality of matrix-shaped trays 1o are stacked one on top of the other and stored in the tray box 1. 11 is an electronic component. The suction head 3 is provided with a plurality of suction pads measuring 12 degrees and 13.14 degrees. The suction of the suction bats 12, 13 and 14 can be switched programmably depending on the shape of the tray. 1
6 is an air cylinder 7 that moves the suction head 3 up and down, 1
A height detector 6 detects when the suction head 3 has descended and reached the upper surface of the tray 10. 17 is tray 1
This is a suction detector that detects that ゜ has been reliably suctioned.

次に、この一実施例の構成における動作について説明す
る。まず、電子部品の装着動作について1m単に説明す
る。プリント基板8に装着する順序に順って、XY軸テ
ーブル4.6はトレイ箱1内の電子部品11の位置へ移
動し続いて2軸テープA/2が下降し電子部品11を吸
着後上昇する。次KXY軸チー 7” /L15 、4
は第1位置(図示A)へ移動し、移動治具6に移載する
。そして移動治具6が第2位置(図示B)へ移動を開始
すると、XYZ軸テーブル5,4.2は次の装着すべき
電子部品を吸着にいく。電子部品を移載された前記移動
治具6は第2位置へ移動し、装着ヘッド7が下降し吸着
する。空になった移動治具6は第1位置へと戻る。次に
装着ヘッド7はプリント基板8の装着すべき位置へ移動
し、電子部品を装着する。
Next, the operation of the configuration of this embodiment will be explained. First, the mounting operation of electronic components will be briefly explained. In accordance with the order of mounting on the printed circuit board 8, the XY-axis table 4.6 moves to the position of the electronic component 11 in the tray box 1, then the two-axis tape A/2 descends, picks up the electronic component 11, and then rises. do. Next KXY axis chi 7”/L15, 4
is moved to the first position (A in the figure) and transferred to the moving jig 6. When the moving jig 6 starts moving to the second position (B in the figure), the XYZ-axis tables 5, 4.2 go to pick up the next electronic component to be mounted. The moving jig 6 on which the electronic component has been transferred moves to the second position, and the mounting head 7 descends to adsorb it. The empty moving jig 6 returns to the first position. Next, the mounting head 7 moves to the position where the printed circuit board 8 is to be mounted, and mounts the electronic component thereon.

続いて第2位置へと移動する。上記動作を繰シ返すこと
によシブリント基板8に順次電子部品を装着していく。
Then it moves to the second position. By repeating the above operations, electronic components are sequentially mounted on the print board 8.

次に空トレイの廃棄動作に’Wついて説明する。Next, the operation of discarding an empty tray will be explained.

吸着ヘッド3はXY軸テーブル6.4により、空トレイ
1oの真上に移動する。次にエアーシリンダー16が下
降を開始すると共に、予めプログラムで設定された吸着
バット(例えば12.14)が吸着を開始する。続いて
下降しトレイ1oの上面に吸着ヘッド3が到達する高さ
検出器16が作動し、エアーシリンダー16は上昇を始
める。上限に達した時に吸着検出器17が作動していれ
ば、トレイ1oを吸着していると判断する。もし吸着検
出器17が作動していなければ再度吸着ヘッド3は下降
し、吸着のりトライを行なう。次に吸着ヘッド3はXY
軸テープA15,4によシ廃棄トレイを収−納する箱e
の位置へ移動し、吸着バット(例えば12,1a)の吸
着を0FFI、空トレイの廃棄を行なう。
The suction head 3 is moved directly above the empty tray 1o by the XY-axis table 6.4. Next, the air cylinder 16 starts to descend, and the suction vat (for example, 12.14) set in advance in the program starts suction. Subsequently, the height detector 16 is activated so that the suction head 3 descends and reaches the upper surface of the tray 1o, and the air cylinder 16 begins to rise. If the suction detector 17 is activated when the upper limit is reached, it is determined that the tray 1o is being suctioned. If the suction detector 17 is not operating, the suction head 3 is lowered again and a suction adhesion trial is performed. Next, the suction head 3
Box e for storing the waste tray with shaft tape A15,4
The tray is moved to the position shown in FIG.

発明の効果 以上のように本発明は、トレイから電子部品を吸着保持
し、所定位置へ移載するXY軸テーブルと、このXY軸
テーブルに空トレイを吸着する上下動可能な吸着ヘッド
を設け、この吸着ヘッドが下降してトレイ上面に到達し
たことを検出する高さ検出部を設けているので、複数種
の複数段のトレイが配置されていても、ひとつの吸着ヘ
ッドですべて空トレイの廃棄が可能である。
Effects of the Invention As described above, the present invention includes an XY-axis table for sucking and holding electronic components from a tray and transferring them to a predetermined position, and a vertically movable suction head for sucking an empty tray to this XY-axis table. A height detection unit is installed to detect when the suction head has descended and reached the top of the tray, so even if multiple trays of multiple types are arranged, a single suction head can dispose of all empty trays. is possible.

又、吸着ヘッドの吸着位置がプログラマブルに切替えが
可能なので、トレイ形状や大きさが変わってもひとつの
吸着ヘッドで確実に空トレイの吸着ができる。
Furthermore, since the suction position of the suction head can be switched programmably, an empty tray can be reliably suctioned with one suction head even if the tray shape or size changes.

又吸着検出器を備えているので空トレイの吸着・廃棄が
確実に検出でき、信頼性の高い空トレイ廃棄装置を備え
た電子部品装着機である。
Furthermore, since it is equipped with a suction detector, suction and disposal of empty trays can be reliably detected, making it an electronic component mounting machine equipped with a highly reliable empty tray disposal device.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例における電子部品装着機のト
レイ廃棄装置の斜桃図、第2図は電子部品装着機の平面
図、第3図は第2図の全体斜視図、第4図は従来の電子
部品装着機の斜視図である。 3・・・・・・吸着ヘッド、4・・・・・・Y軸テーブ
ル、6・・・・−X軸テーブル、12,13,14・・
・・・・吸着バット、16−−−−−・高さ検出器、1
7−−−−・・吸着検出器0代理人の氏名 弁理士 中
 尾 敏 男 ほか1名第3図 第4図
FIG. 1 is a perspective view of a tray disposal device of an electronic component mounting machine according to an embodiment of the present invention, FIG. 2 is a plan view of the electronic component mounting machine, FIG. 3 is an overall perspective view of FIG. 2, and FIG. The figure is a perspective view of a conventional electronic component mounting machine. 3... Suction head, 4... Y-axis table, 6...-X-axis table, 12, 13, 14...
...Suction vat, 16----Height detector, 1
7----... Adsorption detector 0 Name of agent Patent attorney Toshio Nakao and one other person Figure 3 Figure 4

Claims (1)

【特許請求の範囲】[Claims]  マトリックス状のトレイに収納された電子部品を順次
装着する電子部品装着機において、トレイから電子部品
を吸着保持し所定位置へ移載する平面移動可能なテーブ
ルと、このテーブルに空トレイを吸着する上下動可能な
吸着ヘッドを設け、この吸着ヘッドが下降してトレイ上
面に到達したことを検出する高さ検出部と、前記吸着ヘ
ツド内の吸着位置がプログラマブルに切替えが可能な複
数個の吸着回路切替部と、トレイを吸着したことを検出
する吸着検出部とで構成した電子部品装着機。
In an electronic component mounting machine that sequentially mounts electronic components stored in a matrix-shaped tray, there is a table that can be moved on a plane to suction and hold electronic components from the tray and transfer them to a predetermined position, and a top and bottom table that suctions empty trays to this table. A movable suction head is provided, a height detection unit detects when the suction head has descended and reached the top surface of the tray, and a plurality of suction circuit switches are provided that can programmably switch suction positions within the suction head. An electronic component mounting machine comprising a suction detection section and a suction detection section that detects that a tray is suctioned.
JP62276144A 1987-10-30 1987-10-30 Electronic component mounting machine Expired - Fee Related JPH07105625B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62276144A JPH07105625B2 (en) 1987-10-30 1987-10-30 Electronic component mounting machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62276144A JPH07105625B2 (en) 1987-10-30 1987-10-30 Electronic component mounting machine

Publications (2)

Publication Number Publication Date
JPH01117398A true JPH01117398A (en) 1989-05-10
JPH07105625B2 JPH07105625B2 (en) 1995-11-13

Family

ID=17565384

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62276144A Expired - Fee Related JPH07105625B2 (en) 1987-10-30 1987-10-30 Electronic component mounting machine

Country Status (1)

Country Link
JP (1) JPH07105625B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084033A (en) * 2001-09-10 2003-03-19 Yamaha Motor Co Ltd Part tester
TWI454348B (en) * 2010-03-25 2014-10-01 Hon Hai Prec Ind Co Ltd Sucking device

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974930U (en) * 1982-11-08 1984-05-21 本田技研工業株式会社 Transfer device for flat plate materials
JPS62168700U (en) * 1986-04-17 1987-10-26

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5974930U (en) * 1982-11-08 1984-05-21 本田技研工業株式会社 Transfer device for flat plate materials
JPS62168700U (en) * 1986-04-17 1987-10-26

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003084033A (en) * 2001-09-10 2003-03-19 Yamaha Motor Co Ltd Part tester
TWI454348B (en) * 2010-03-25 2014-10-01 Hon Hai Prec Ind Co Ltd Sucking device

Also Published As

Publication number Publication date
JPH07105625B2 (en) 1995-11-13

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