JPH01110946A - Manufacture of laminated sheet - Google Patents

Manufacture of laminated sheet

Info

Publication number
JPH01110946A
JPH01110946A JP62269945A JP26994587A JPH01110946A JP H01110946 A JPH01110946 A JP H01110946A JP 62269945 A JP62269945 A JP 62269945A JP 26994587 A JP26994587 A JP 26994587A JP H01110946 A JPH01110946 A JP H01110946A
Authority
JP
Japan
Prior art keywords
prepreg
laminate
resin
temperature
laminated sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP62269945A
Other languages
Japanese (ja)
Other versions
JP2543099B2 (en
Inventor
Tetsuro Naruse
成瀬 哲朗
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62269945A priority Critical patent/JP2543099B2/en
Publication of JPH01110946A publication Critical patent/JPH01110946A/en
Application granted granted Critical
Publication of JP2543099B2 publication Critical patent/JP2543099B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Insulating Bodies (AREA)

Abstract

PURPOSE:To control a defective external appearance and a deflection of a plate thickness at the time of molding of a laminated sheet to be followed by storage of prepreg, by making use of the prepreg treated at a specific temperature for 1-2 hours under depressurization. CONSTITUTION:Prepreg 1 is put into a vacuum chamber 3 and treated at a temperature of 50+ or -2 deg.C for 1-2 hours under a depressurizing condition of 30-50Torr. A necessary number of sheets of prepreg 1, to which dehumidification treatment has been performed, and a metallic foil 4, which is arranged to the top and/or the bottom of the prepreg 1, are superposed upon each other and an obtained laminated body 5 is molded through heating and depressurization. A control effect of a defective external appearance and deflection of a plate thickness of a laminated sheet is improved drastically, in the dehumidification treatment.

Description

【発明の詳細な説明】 (技術分野) この発明は積層板の製造方法に関するものである。さら
に詳しくは、この発明は、プリプレグの樹脂流れの変化
による板厚偏差や外観異常を抑制したプリント配線板用
積層板の製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION (Technical Field) The present invention relates to a method for manufacturing a laminate. More specifically, the present invention relates to a method for manufacturing a laminate for a printed wiring board that suppresses board thickness deviations and appearance abnormalities due to changes in prepreg resin flow.

(背景技術) 従来、プリント配線板用積層板のrJI造においては、
ガラス布、ガラスシート、紙等の基材にエポキシ樹脂、
フェノール樹脂、ポリイミド樹脂等の樹脂を含浸させた
プリプレグを20℃〜25゛Cの温度、30〜40%R
H以下の条件で恒温恒湿室に保管したものを取出して積
層板の成形に用いるのが一般的であった。
(Background technology) Conventionally, in rJI construction of laminated boards for printed wiring boards,
Epoxy resin on base materials such as glass cloth, glass sheet, paper, etc.
Prepreg impregnated with resin such as phenol resin or polyimide resin is heated at a temperature of 20°C to 25°C and 30% to 40% R.
Generally, materials stored in a constant temperature and humidity chamber under conditions of H or less were taken out and used for forming laminates.

この恒温恒湿室への保管は、積層板の製造プロセスの稼
動の定常1ヒと品質の均一化のために欠かせないもので
あるが、一方では、この保管時間の相違により、吸湿や
乾燥によって積層板の樹脂の流れに差が生じて積層板の
外観異常が発生したり、板厚偏差が大きくなるという問
題が避けられなかった。
Storage in a constant temperature and humidity chamber is essential for steady operation and uniform quality in the laminate manufacturing process, but on the other hand, due to the difference in storage time, moisture absorption and dryness may occur. As a result, a difference occurs in the flow of resin in the laminate, resulting in abnormal appearance of the laminate and unavoidable problems such as an increase in thickness deviation.

このような外観不良や寸法安定性の欠如は、積層板の品
質の均一性を低下させ、製品歩留りを悪くする原因とな
っていた。このため、プリプレグの保管にともなう積層
板成形時の外観不良や板厚偏差を抑制することのできる
改善された積層板の製造方法の実現が強く望まれていた
Such poor appearance and lack of dimensional stability reduce the uniformity of the quality of the laminate and cause poor product yield. For this reason, there has been a strong desire to realize an improved method for manufacturing a laminate that can suppress appearance defects and thickness deviations during laminate forming that occur during prepreg storage.

(発明の目的) この発明は、以上の通りの事情に鑑みてなされたもので
あり、従来方法の欠点を改善し、樹脂流れの相違と、そ
れによる外観不良や板N偏差の拡大を抑制した、改良さ
れた積層板の製造方法を提供することを目的としている
(Object of the invention) This invention was made in view of the above circumstances, and it improves the drawbacks of the conventional method and suppresses the difference in resin flow and the resulting poor appearance and increase in plate N deviation. , aims to provide an improved method for manufacturing laminates.

(発明の開示) この発明の積層板の製造方法は、上記の目的を実現する
なめに、30〜50Torrの減圧下にお゛いて、50
±2℃の温度で1〜2時間処理したプリプレグを所要枚
数重ね、その上面および/または下面に金属箔を配設し
た積層体を加熱加圧成形することを特徴としている。
(Disclosure of the Invention) In order to achieve the above object, the method for producing a laminate of the present invention is to produce a laminate under reduced pressure of 30 to 50 Torr.
The method is characterized in that a required number of prepregs treated at a temperature of ±2° C. for 1 to 2 hours are piled up, and a laminate is formed by heating and pressing, in which metal foil is arranged on the upper and/or lower surfaces.

添付した図面に沿って、この発明の積層板の製造方法に
ついて説明する。
A method for manufacturing a laminate according to the present invention will be described with reference to the attached drawings.

第1図は、この発明の製造方法の一例を工程フローとし
て示したものである。この例に示したように、この発明
の製造方法においては、(a)  たとえば従来と同様
の20℃、40%RH以下、あるいは25℃、30%R
H以下の条件でプリプレグ(1)を恒温恒温室(2)に
所定時間保管し、または保管することなく、(b)  
半硬化状態に乾煉したプリプレグ(1)を真空槽、真空
タンク等の真空室(3)に入れ、30〜50’I’or
rの減圧条件下3こおいて、プリプレグ(1)を50±
2℃の温度で1〜2時afI処理する。
FIG. 1 shows a process flow of an example of the manufacturing method of the present invention. As shown in this example, in the manufacturing method of the present invention, (a) For example, 20° C. and 40% RH or less as in the conventional case, or 25° C. and 30% RH
Prepreg (1) is stored in a thermostatic chamber (2) for a predetermined period of time under conditions of H or less, or (b)
The semi-hardened prepreg (1) is put into a vacuum chamber (3) such as a vacuum tank or a vacuum tank, and heated to a temperature of 30 to 50'I'or
Prepreg (1) was heated to 50±
Treat with afI for 1-2 hours at a temperature of 2°C.

(C)  次いで、この脱湿処理したプリプレグ(1)
の所要枚数と、その上面および/または下面に配設する
金属箔(4)を重ね、 (d)  得られた積層体(5)を加熱加圧成形する。
(C) Next, this dehumidified prepreg (1)
(d) The obtained laminate (5) is heated and press-molded.

この発明の製造方法に用いるプリプレグとしては、その
種類は格別に限定的なものではなく、フェノール樹脂、
エポキシ樹脂、不飽和ポリエステル樹脂、メラミン樹脂
、ポリイミド樹脂、弗素樹脂等の合成樹脂の液状物を、
ガラス布、ポリエステル布、ポリアミド布、アラミドi
&lli維布、紙等の基材に含浸させたものを、たとえ
ば例示することができる。
The type of prepreg used in the manufacturing method of this invention is not particularly limited, and includes phenolic resin,
Liquid synthetic resins such as epoxy resins, unsaturated polyester resins, melamine resins, polyimide resins, and fluororesins,
Glass cloth, polyester cloth, polyamide cloth, aramid i
For example, a material obtained by impregnating a base material such as textile cloth or paper can be exemplified.

この樹脂含浸については、乾燥後の樹脂等が40〜60
重量%になるように含浸することが好ましく、また使用
する樹脂の液状物はほとんどはフェスであるが、弗素樹
脂についてはエマルジョンの状態で使用することになる
Regarding this resin impregnation, the resin etc. after drying is 40 to 60%
It is preferable to impregnate the resin in an amount of % by weight, and most of the liquid resins used are in the form of fess, but the fluororesin is used in the form of an emulsion.

さらに、含浸は一種類の樹脂ばかりでなく、複数種のも
のを用いてもよい、たとえば、メラミン樹脂によって一
次含浸を行い、含浸性と難燃性を向上させた後に、フェ
ノール樹脂によって二次含浸することも可能である。v
IJ脂は、最初から配合品を用いてもよいし、あるいは
桐油変性フェノール樹脂、エボ、キシ変性ポリイミド樹
脂のように変性樹脂を用いてもよい。
Furthermore, impregnation is not limited to one type of resin, but may also be performed using multiple types of resin. For example, after primary impregnation with melamine resin to improve impregnation and flame retardancy, secondary impregnation with phenolic resin. It is also possible to do so. v
As the IJ resin, a blended product may be used from the beginning, or a modified resin such as tung oil-modified phenol resin, Evo, or xy-modified polyimide resin may be used.

基材としては、一般的には、その幅が1mまたは2m、
厚さ0.03〜0.3w品を用いる。もちろんこの方法
において、この範囲は限定的ではない。
The base material generally has a width of 1 m or 2 m,
Use a product with a thickness of 0.03 to 0.3w. Of course, in this method, this range is not limited.

基材として用いるガラスまたは樹脂の布は、繊布または
不織布のいずれのものでもよく、紙には、クラフト紙、
ソンター紙、ガラスペーパー等も含まれる。
The glass or resin cloth used as the base material may be either woven fabric or non-woven fabric, and examples of paper include kraft paper,
Also includes sontar paper, glass paper, etc.

所要枚数のプリプレグの上面および/または下面に配設
する金属箔としては、その厚みが、およそ0.018〜
0.07間の別、アルミニウム、鉄、亜j1)、ニッケ
ル等の金属、またはそれらの合金、さらには亜鉛コート
鉄のような複合材の箔を用いることができる。これらの
金属箔の配設にあたっては、必要に応じて金属箔の片面
に接着剤層を設けて接着力を向上させてもよい。
The thickness of the metal foil to be placed on the upper and/or lower surfaces of the required number of prepregs is approximately 0.018~
Foils of metals such as aluminium, iron, nickel, or alloys thereof, or even composites such as zinc-coated iron can be used. When disposing these metal foils, an adhesive layer may be provided on one side of the metal foil to improve adhesive strength, if necessary.

30〜50Torrの真空減圧条件下、50上2℃の温
度での1〜2時間のプリプレグの処理は、この発明の方
法の最も重要な要件であって、減圧条件が、30TOr
r未満、48℃未満、さらには1時間未満の場合には脱
湿等の処理効果か不十分となり、50Torr 、52
℃12時間を超えると、逆に積層成形時の樹脂の流動性
が著しく低下し、成形品にカスレが発生ずるため好まし
くない。
The treatment of the prepreg at a temperature of 2° C. above 50° C. for 1 to 2 hours under vacuum conditions of 30 to 50 Torr is the most important requirement of the method of the present invention;
If the heating time is less than r, 48°C, or even less than 1 hour, the treatment effect such as dehumidification will be insufficient, and the temperature will be 50Torr, 52
If it exceeds 12 hours at °C, on the contrary, the fluidity of the resin during lamination molding will be significantly reduced and the molded product will become smeared, which is not preferable.

30〜50Torr 、50±2 ’Cの温度および1
〜2時間という制御された条件での処理かこのため必要
となる。この処理において、積層板の外観不良や板N偏
差の抑制効果は大きく向上する。
30-50Torr, temperature of 50±2'C and 1
This necessitates treatment under controlled conditions of ~2 hours. In this treatment, the effect of suppressing appearance defects of the laminate and plate N deviation is greatly improved.

次に実施例を示して、さらに詳しくこの発明の製造方法
について説明する。もちろん、この発明は、以下の実施
例によって限定されるものではない。
Next, the manufacturing method of the present invention will be explained in more detail with reference to Examples. Of course, the invention is not limited to the following examples.

実施例 厚さ0.2市のクラフト紙(1mX1m)に、乾燥後樹
脂量が50重量%となるように、樹脂含有量50重量%
のフェノール樹脂フェスを含浸させ、乾煤してプリプレ
グを得た。
Example: Kraft paper (1 m x 1 m) with a thickness of 0.2 cm was coated with a resin content of 50% by weight so that the resin amount after drying was 50% by weight.
A prepreg was obtained by impregnating a phenolic resin face and drying it.

このプリプレグ8枚を重ね、この上下の面に厚さ0.0
35 nnの片面接着剤付銅箔を配設した。得られた積
層体を100に+r/aJの圧力、160℃の温度で6
0分間加熱加圧成形した。厚さ1.6侑の両面銅張積層
板を得た。この積層板の成形において、重ね合わせたプ
リプレグとしては、真空タンク中で、40’T”orr
の減圧下に、52℃の温度で90分間処理したちのを用
いた。
Stack these 8 sheets of prepreg and apply a thickness of 0.0 on the top and bottom surfaces.
A 35 nn copper foil coated with adhesive on one side was provided. The obtained laminate was heated at a pressure of 100+r/aJ and a temperature of 160°C.
The molding was carried out under heat and pressure for 0 minutes. A double-sided copper-clad laminate having a thickness of 1.6 mm was obtained. In forming this laminate, the stacked prepregs were heated at 40'T”orr in a vacuum tank.
The sample was treated under reduced pressure at 52° C. for 90 minutes.

得られた積層板について、第2図に示した中央部(A)
および端線から5cmの位置(B)における積層成形に
ともなう板厚偏差を測定した。板厚は、 中央部(A )   1.60+tm 端部(B )   1.55++n+ であった0次に述べる比較例に比べて、その差異は極め
て小さなものであった。板厚1荷差が効果的に抑制され
ていることがわかる。
Regarding the obtained laminate, the central part (A) shown in Fig. 2
And the plate thickness deviation due to lamination molding at a position (B) 5 cm from the edge line was measured. The plate thicknesses were 1.60+tm at the center (A) and 1.55++n+ at the ends (B).The difference was extremely small compared to the comparative example described next. It can be seen that the difference in plate thickness per load is effectively suppressed.

なお、第2図において、fJ = 1 rn、t=1.
6關である。また、外観の不良もほとんど認められなか
った。
In addition, in FIG. 2, fJ = 1 rn, t = 1.
6 matters. Moreover, almost no defects in appearance were observed.

比較例 プリプレグの減圧下での処理を行うことなく、実施例と
同様にして両面銅張積層板を得た。
Comparative Example A double-sided copper-clad laminate was obtained in the same manner as in the example without treating the prepreg under reduced pressure.

板厚を測定したところ 中央部(A)    1.60市 端部(B )   1.50+n+ と、両者の差は極めて大きかった。When the plate thickness was measured Central area (A) 1.60 city End (B) 1.50+n+ The difference between the two was extremely large.

(発明の効果) この発明により、以上詳しく説明した通り、プリプレグ
の成形までの保管の間の吸湿等の程度の差によって発生
する積層成形にともなう外観異常や板厚偏差の拡大を抑
制した、品質の均一性および製品歩留りの良好な積層板
の製造が可能となる。
(Effects of the Invention) As explained in detail above, this invention has improved quality by suppressing appearance abnormalities and plate thickness deviations caused by laminated molding caused by differences in the degree of moisture absorption during prepreg storage before molding. It becomes possible to manufacture a laminate with good uniformity and product yield.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図(a)(b)(c)(d)は、この発明の製造方
法の一例を示した工程図である。第2図は、積層板の板
厚の測定部位を示した積層板断面図である。 1・・・プリプレグ、2・・・恒温恒湿室、3・・・真
空室、  4・・・金属箔、 5・・・積層体。 代理人 弁理士  西  澤  利  失笑  1  
図 (C) 0000マ
FIGS. 1(a), (b), (c), and (d) are process diagrams showing an example of the manufacturing method of the present invention. FIG. 2 is a cross-sectional view of the laminate showing a portion where the thickness of the laminate is measured. DESCRIPTION OF SYMBOLS 1... Prepreg, 2... Constant temperature and humidity chamber, 3... Vacuum chamber, 4... Metal foil, 5... Laminated body. Agent Patent Attorney Toshi Nishizawa Smile 1
Figure (C) 0000ma

Claims (1)

【特許請求の範囲】[Claims] (1)30〜50Torrの減圧下において、50±2
℃の温度で1〜2時間処理したプリプレグを所要枚数重
ね、上面および/または下面に金属箔を配設した積層体
を加熱加圧成形することを特徴とする積層板の製造方法
(1) Under reduced pressure of 30 to 50 Torr, 50 ± 2
1. A method for manufacturing a laminate, which comprises stacking a required number of prepregs treated at a temperature of 1 to 2 hours at a temperature of .degree.
JP62269945A 1987-10-26 1987-10-26 Laminated board manufacturing method Expired - Fee Related JP2543099B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62269945A JP2543099B2 (en) 1987-10-26 1987-10-26 Laminated board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62269945A JP2543099B2 (en) 1987-10-26 1987-10-26 Laminated board manufacturing method

Publications (2)

Publication Number Publication Date
JPH01110946A true JPH01110946A (en) 1989-04-27
JP2543099B2 JP2543099B2 (en) 1996-10-16

Family

ID=17479395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62269945A Expired - Fee Related JP2543099B2 (en) 1987-10-26 1987-10-26 Laminated board manufacturing method

Country Status (1)

Country Link
JP (1) JP2543099B2 (en)

Also Published As

Publication number Publication date
JP2543099B2 (en) 1996-10-16

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