JP2543099B2 - Laminated board manufacturing method - Google Patents

Laminated board manufacturing method

Info

Publication number
JP2543099B2
JP2543099B2 JP62269945A JP26994587A JP2543099B2 JP 2543099 B2 JP2543099 B2 JP 2543099B2 JP 62269945 A JP62269945 A JP 62269945A JP 26994587 A JP26994587 A JP 26994587A JP 2543099 B2 JP2543099 B2 JP 2543099B2
Authority
JP
Japan
Prior art keywords
resin
prepreg
laminated
present
laminated board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP62269945A
Other languages
Japanese (ja)
Other versions
JPH01110946A (en
Inventor
哲朗 成瀬
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Electric Works Co Ltd
Original Assignee
Matsushita Electric Works Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Works Ltd filed Critical Matsushita Electric Works Ltd
Priority to JP62269945A priority Critical patent/JP2543099B2/en
Publication of JPH01110946A publication Critical patent/JPH01110946A/en
Application granted granted Critical
Publication of JP2543099B2 publication Critical patent/JP2543099B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/02Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Laminated Bodies (AREA)
  • Insulating Bodies (AREA)

Description

【発明の詳細な説明】 (技術分野) この発明は積層板の製造方法に関するものである。さ
らに詳しくは、この発明は、プリプレグの樹脂流れの変
化による板厚偏差や外観異常を抑制したプリント配線板
用積層板の製造方法に関するものである。
TECHNICAL FIELD The present invention relates to a method for manufacturing a laminate. More specifically, the present invention relates to a method for manufacturing a laminated board for a printed wiring board, which suppresses a thickness deviation and an abnormal appearance due to a change in resin flow of a prepreg.

(背景技術) 従来、プリント配線板用積層板の製造においては、ガ
ラス布,ガラスシート,紙等の基材にエポキシ樹脂,フ
ェノール樹脂,ポリイミド樹脂等の樹脂を含浸させたプ
リプレグを、20℃〜25℃の温度、30〜40%RH以下の条件
で恒温恒湿室に保管したものを取出して積層板の成形に
用いるのが一般的であった。
(Background Art) Conventionally, in the manufacture of a laminate for a printed wiring board, a prepreg obtained by impregnating a resin such as an epoxy resin, a phenol resin or a polyimide resin into a substrate such as a glass cloth, a glass sheet or paper is used at 20 ° C to It was common to take out what was stored in a constant temperature and humidity chamber at a temperature of 25 ° C and a temperature of 30 to 40% RH or less and use it for forming a laminated plate.

この恒温恒湿室への保管は、積層板の製造プロセスの
稼働の定常化と品質の均一化のために欠かせないもので
あるが、一方では、この保管時間の相違により吸湿や乾
燥によって積層板の樹脂の流れに差が生じて積層板の外
観異常が発生したり、板厚偏差が大きくなるという問題
が避けられなかった。
This storage in a constant temperature and humidity chamber is essential for steady operation of the laminated plate manufacturing process and for uniform quality, but on the other hand, due to this difference in storage time, lamination due to moisture absorption and drying. There is an unavoidable problem that a difference in the flow of resin between the plates causes an abnormal appearance of the laminated plate and a large thickness deviation.

このような外観不良や寸法安定性の欠如は、積層板の
品質の均一性を低下させ、製品歩留りを悪くする原因と
なっていた。このため、プリプレグの保管にともなう積
層板成形時の外観不良や板厚偏差を抑制することのでき
る改善された積層板の製造方法の実現が強く望まれてい
た。
Such poor appearance and lack of dimensional stability have been a cause of deteriorating the uniformity of the quality of the laminate and lowering the product yield. Therefore, it has been strongly desired to realize an improved method for manufacturing a laminated board capable of suppressing the appearance defect and the plate thickness deviation during the molding of the laminated board due to the storage of the prepreg.

(発明の目的) この発明は、以上の通りの事情に鑑みてなされたもの
であり、従来方法の欠点を改善し、樹脂流れの相違と、
それによる外観不良や板厚偏差の拡大を抑制した、改良
された積層板の製造方法を提供することを目的としてい
る。
(Object of the Invention) The present invention has been made in view of the circumstances as described above, and improves the drawbacks of the conventional methods, and the difference in the resin flow,
It is an object of the present invention to provide an improved method for manufacturing a laminated plate, in which the appearance failure and the increase in the plate thickness deviation due to it are suppressed.

(発明の開示) この発明の積層板の製造方法は、上記の目的を実現す
るために、30〜50Torrの減圧下において、50±2℃の温
度で1〜2時間処理したプリプレグを所要枚数重ね、そ
の上面および/または下面に金属箔を配設した積層体を
加熱加圧成形することを特徴としている。
DISCLOSURE OF THE INVENTION In order to achieve the above-mentioned object, the method for producing a laminated plate of the present invention, in order to achieve the above object, stacks a required number of prepregs that have been treated at a temperature of 50 ± 2 ° C. for 1 to 2 hours under a reduced pressure of 30 to 50 Torr. It is characterized in that a laminated body in which a metal foil is arranged on the upper surface and / or the lower surface thereof is formed by heating and pressing.

添付した図面に沿ってこの発明の積層板の製造方法に
ついて説明する。
A method for manufacturing a laminated board of the present invention will be described with reference to the accompanying drawings.

第1図は、この発明の製造方法の一例を工程フローと
して示したものである。この例に示したように、この発
明の製造方法においては、 (a)たとえば従来と同様の20℃、40%RH以下、あるい
は25℃、30%RH以下の条件でプリプレグ(1)を恒温恒
湿室(2)に所定時間保管し、また保管することなく、 (b)半硬化状態に乾燥したプリプレグ(1)を真空
槽,真空タンク等の真空室(3)に入れ、30〜50Torrの
減圧条件下において、プリプレグ(1)を50±2℃の温
度で1〜2時間処理する。
FIG. 1 shows an example of the manufacturing method of the present invention as a process flow. As shown in this example, in the manufacturing method of the present invention, (a) for example, the prepreg (1) is thermostatted under the same conditions of 20 ° C. and 40% RH or less, or 25 ° C. and 30% RH as in the conventional case. Stored in the wet chamber (2) for a predetermined time, or without storing (b) the semi-cured dried prepreg (1) is placed in a vacuum chamber (3) such as a vacuum tank or a vacuum tank, and stored at 30 to 50 Torr. The prepreg (1) is treated under a reduced pressure condition at a temperature of 50 ± 2 ° C. for 1 to 2 hours.

(c)次いで、この脱湿処理したプリプレグ(1)の所
要枚数と、その上面および/または下面に配設する金属
白(4)を重ね、 (d)得られた積層体(5)を加熱加圧成形する。
(C) Next, the required number of dehumidified prepregs (1) and the metal white (4) to be disposed on the upper surface and / or the lower surface thereof are overlaid, and (d) the obtained laminated body (5) is heated. Press molding.

この発明の製造方法に用いるプリプレグとしては、そ
の種類は格別に限定的なものではなく、フェノール樹
脂、エポキシ樹脂、不飽和ポリエステル樹脂、メラミン
樹脂、ポリイミド樹脂、弗素樹脂等の合成樹脂の液状物
を、ガラス布、ポリエステル布、ポリアミド布、アラミ
ド繊維布、紙等の基材に含浸させたものを、たとえば例
示することができる。
The type of prepreg used in the production method of the present invention is not particularly limited, and a liquid material of a synthetic resin such as a phenol resin, an epoxy resin, an unsaturated polyester resin, a melamine resin, a polyimide resin, or a fluorine resin is used. Examples include those impregnated with a base material such as glass cloth, polyester cloth, polyamide cloth, aramid fiber cloth, and paper.

この樹脂含浸については、乾燥後の樹脂等が40〜60重
量%になるように含浸することが好ましく、また使用す
る樹脂の液状物はほとんどはワニスであるが、弗素樹脂
についてはエマルジョンの状態で使用することになる。
For this resin impregnation, it is preferable to impregnate the resin etc. after drying to 40 to 60% by weight.Although most of the liquid material of the resin used is varnish, the fluororesin is in the emulsion state. Will be used.

さらに、含浸は一種類の樹脂ばかりでなく、複数種の
ものを用いてもよい。たとえば、メラミン樹脂によって
一次含浸を行い、含浸性と難燃性を向上させた後に、フ
ェノール樹脂によって二次含浸することも可能である。
樹脂は、最初から配合品を用いてもよいし、あるいは桐
油変性フェノール樹脂、エポキシ変性ポリイミド樹脂の
ように変性樹脂を用いてもよい。
Further, the impregnation may use not only one type of resin but also a plurality of types. For example, it is also possible to carry out primary impregnation with a melamine resin, improve impregnation properties and flame retardancy, and then carry out secondary impregnation with a phenol resin.
As the resin, a compounded product may be used from the beginning, or a modified resin such as tung oil-modified phenol resin or epoxy-modified polyimide resin may be used.

基材としては、一般的には、その幅が1mまたは2m、厚
さ0.03〜0.3mm品を用いる。もちろんこの方法におい
て、この範囲は限定的ではない。基材として用いるガラ
スまたは樹脂の布は、織布または不織布のいずれのもの
でもよく、紙には、クラフト紙、ソンター紙、ガラスペ
ーパー等も含まれる。
As the base material, a product having a width of 1 m or 2 m and a thickness of 0.03 to 0.3 mm is generally used. Of course, in this method, this range is not limiting. The glass or resin cloth used as the substrate may be either woven cloth or non-woven cloth, and the paper includes kraft paper, Sonter paper, glass paper and the like.

所要枚数のプリプレグの上面および/または下面に配
設する金属箔としては、その厚みが、およそ0.018〜0.0
7mmの銅、アルミニウム、鉄、亜鉛、ニッケル等の金
属、またはそれらの合金、さらには亜鉛コート鉄のよう
な複合材の箔を用いることができる。これらの金属箔の
配設にあたっては、必要に応じて金属箔の片面に接着剤
層を設けて接着力を向上させてもよい。
The thickness of the metal foil to be arranged on the upper surface and / or the lower surface of the required number of prepregs is about 0.018 to 0.0
Metals such as 7 mm of copper, aluminum, iron, zinc, nickel, etc., or alloys thereof, as well as composite foils such as zinc-coated iron can be used. When disposing these metal foils, an adhesive layer may be provided on one surface of the metal foil to improve the adhesive force, if necessary.

30〜50Torrの真空減圧条件下、50±2℃の温度での1
〜2時間のプリプレグの処理は、この発明の方法の最も
重要な要件であって、減圧条件が、30Torr未満、48℃未
満、さらには1時間未満の場合には脱湿等の処理効果が
不十分となり、50Torr、52℃、2時間を超えると、逆に
積層成形時の樹脂の流動性が著しく低下し、成形品にカ
スレが発生するため好ましくない。
1 at a temperature of 50 ± 2 ℃ under vacuum decompression condition of 30 to 50 Torr
The treatment of the prepreg for 2 hours is the most important requirement of the method of the present invention, and when the reduced pressure condition is less than 30 Torr, less than 48 ° C., and less than 1 hour, the treatment effect such as dehumidification is unsatisfactory. If it exceeds 50 Torr and 52 ° C. for 2 hours, on the contrary, the fluidity of the resin at the time of laminating and molding remarkably lowers, and scrapes occur in the molded product, which is not preferable.

30〜50Torr、50±2℃の温度および1〜2時間という
制御された条件での処理がこのため必要となる。この処
理において、積層板の外観不良や板厚偏差の抑制効果は
大きく向上する。
This requires treatment at controlled conditions of 30-50 Torr, 50 ± 2 ° C. and 1-2 hours. In this process, the effect of suppressing the appearance defect of the laminated plate and the plate thickness deviation is greatly improved.

次に実施例を示して、さらに詳しくこの発明の製造方
法について説明する。もちろん、この発明は以下の実施
例によって限定されるものではない。
Next, the production method of the present invention will be described in more detail with reference to examples. Of course, the present invention is not limited to the examples below.

実施例 厚さ0.2mmのクラフト紙(1m×1m)に、乾燥後樹脂量
が50重量%となるように、樹脂含有量50重量%のフェノ
ール樹脂ワニスを含浸させ、乾燥してプリプレグを得
た。
Example A kraft paper (1 m x 1 m) having a thickness of 0.2 mm was impregnated with a phenol resin varnish having a resin content of 50% by weight so that the resin amount after drying was 50% by weight, and dried to obtain a prepreg. .

このプリプレグ8枚を重ね、この上下の面に厚さ0.03
5mmの片面接着剤付銅箔を配設した。得られた積層体を1
00Kg/cm2の圧力、160℃の温度で60分間加熱加圧成形し
た。厚さ1.6mmの両面銅張積層板を得た。この積層板の
成形において、重ね合わせたプリプレグとしては、真空
タンク中で、40Torrの減圧下に、52℃の温度で90分間処
理したものを用いた。
8 pieces of this prepreg are piled up, and the thickness of 0.03
A 5 mm single-sided adhesive-attached copper foil was arranged. 1 for the obtained laminated body
The mixture was heated and pressed at a pressure of 00 Kg / cm 2 and a temperature of 160 ° C. for 60 minutes. A 1.6 mm thick double-sided copper-clad laminate was obtained. In the formation of this laminated plate, the prepregs that were superposed were those that were treated in a vacuum tank under a reduced pressure of 40 Torr at a temperature of 52 ° C. for 90 minutes.

得られた積層板について、第2図に示した中央部
(A)および端線から5cmの位置(B)における積層成
形にともなう板厚偏差を測定した。板厚は、 中央部(A) 1.60mm 端 部(B) 1.55mm であった。次に述べる比較例に比べて、その差異は極め
て小さなものであった。板厚偏差が効果的に抑制されて
いることがわかる。
With respect to the obtained laminated plate, the plate thickness deviation due to the lamination molding was measured at the central portion (A) and the position (B) 5 cm from the end line shown in FIG. The plate thickness was 1.60 mm at the center (A) and 1.55 mm at the end (B). The difference was extremely small as compared with the comparative example described below. It can be seen that the plate thickness deviation is effectively suppressed.

なお、第2図において、l=1m,t=1.6mmである。ま
た、外観の不良もほとんど認められなかった。
In FIG. 2, l = 1 m and t = 1.6 mm. In addition, almost no defective appearance was observed.

比較例 プリプレグの減圧下での処理を行うことなく、実施例
と同様にして両面銅張積層板を得た。
Comparative Example A double-sided copper-clad laminate was obtained in the same manner as in Example without performing treatment of the prepreg under reduced pressure.

板厚を測定したところ 中央部(A) 1.60mm 端 部(B) 1.50mm と、両者の差は極めて大きかった。 When the plate thickness was measured, the center part (A) was 1.60 mm and the end part (B) was 1.50 mm, and the difference between the two was extremely large.

(発明の効果) この発明により、以上詳しく説明した通り、プリプレ
グの成形までの保管の間の吸湿等の程度の差によって発
生する積層成形にともなう外観異常や板厚偏差の拡大を
抑制した、品質の均一性および製品歩留りの良好な積層
板の製造が可能となる。
(Effects of the Invention) As described in detail above, according to the present invention, it is possible to suppress the appearance abnormality and the increase in the thickness deviation caused by the lamination molding caused by the difference in the degree of moisture absorption during the storage until the molding of the prepreg. It is possible to manufacture a laminated plate having good uniformity and product yield.

【図面の簡単な説明】[Brief description of drawings]

第1図(a)(b)(c)(d)は、この発明の製造方
法の一例を示した工程図である。第2図は、積層板の板
厚の測定部位を示した積層板断面図である。 1……プリプレグ、2……恒温恒湿室、3……真空室、
4……金属箔、5……積層体。
1 (a), (b), (c), and (d) are process drawings showing an example of the manufacturing method of the present invention. FIG. 2 is a cross-sectional view of the laminated plate showing a portion for measuring the plate thickness of the laminated plate. 1 ... prepreg, 2 ... constant temperature and humidity chamber, 3 ... vacuum chamber,
4 ... Metal foil, 5 ... Laminated body.

Claims (1)

(57)【特許請求の範囲】(57) [Claims] 【請求項1】30〜50Torrの減圧下において、50±2℃の
温度で1〜2時間処理したプリプレグを所要枚数重ね、
上面および/または下面に金属箔を配設した積層体を加
熱加圧成形することを特徴とする積層板の製造方法。
1. A required number of prepregs which have been treated under a reduced pressure of 30 to 50 Torr at a temperature of 50 ± 2 ° C. for 1 to 2 hours,
A method for producing a laminated plate, comprising heating and pressurizing a laminated body in which a metal foil is provided on the upper surface and / or the lower surface.
JP62269945A 1987-10-26 1987-10-26 Laminated board manufacturing method Expired - Fee Related JP2543099B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP62269945A JP2543099B2 (en) 1987-10-26 1987-10-26 Laminated board manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP62269945A JP2543099B2 (en) 1987-10-26 1987-10-26 Laminated board manufacturing method

Publications (2)

Publication Number Publication Date
JPH01110946A JPH01110946A (en) 1989-04-27
JP2543099B2 true JP2543099B2 (en) 1996-10-16

Family

ID=17479395

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62269945A Expired - Fee Related JP2543099B2 (en) 1987-10-26 1987-10-26 Laminated board manufacturing method

Country Status (1)

Country Link
JP (1) JP2543099B2 (en)

Also Published As

Publication number Publication date
JPH01110946A (en) 1989-04-27

Similar Documents

Publication Publication Date Title
JPH08267664A (en) Manufacture of laminate
JP2543099B2 (en) Laminated board manufacturing method
JP2543098B2 (en) Laminated board manufacturing method
JPS6217532B2 (en)
JP2543100B2 (en) Laminated board manufacturing method
US4738890A (en) Resin-impregnated base and method of manufacturing same
JP3151402B2 (en) Prepreg for manufacturing metal foil-clad laminates
JPH08198982A (en) Production of laminate
JPS6120425B2 (en)
JPH09239898A (en) Prepreg for manufacturing metal foil-plated laminated board
JPS6363369B2 (en)
JPH01157821A (en) Manufacture of laminated sheet
JPS63233810A (en) Manufacture of laminated sheet
JPS595026A (en) Impregnation of varnish into laminated sheet base
JPS60165213A (en) Manufacture of prepreg for laminated board
JPH0771839B2 (en) Laminated board manufacturing method
JPH1134273A (en) Manufacture of laminate
JPS634935A (en) Preparation of multilayer circuit board
JPS6114945B2 (en)
JPH0757494B2 (en) Laminated board manufacturing method
JPH048515A (en) Manufacture of laminated plate
JPH04142338A (en) Preparation of laminated sheet
JPH04131240A (en) Continuous manufacture of laminated sheet
JPH03126545A (en) Manufacture of laminated board
JPS647519B2 (en)

Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees