JPH01109370U - - Google Patents
Info
- Publication number
- JPH01109370U JPH01109370U JP522088U JP522088U JPH01109370U JP H01109370 U JPH01109370 U JP H01109370U JP 522088 U JP522088 U JP 522088U JP 522088 U JP522088 U JP 522088U JP H01109370 U JPH01109370 U JP H01109370U
- Authority
- JP
- Japan
- Prior art keywords
- shielding plate
- light shielding
- light
- light beam
- electronic components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
第１図、第２図は本考案実施例の構成を示す側
面図、および平面図、第３図は第２図における遮
光板の組合せ状態図、第４図ははんだ付け状態で
の電子部品と光ビームと相対関係図、第５図、第
６図は従来における光ビームはんだ付け装置の側
面図、および平面図である。各図において、
１：光源ユニツト、１―ｘ１，１―ｘ２：Ｘ軸
側の光電ユニツト対、１―ｙ１，１―ｙ２：Ｙ軸
側の光電ユニツト対、２：基台、３：移動テーブ
ル、６：プリント基板、７：電子部品、７ａ：リ
ード、８：光ビーム、９―ｘ１，９―ｘ２，９―
ｙ１，９―ｙ２：遮光板、９ａ：照射窓、Ａ：光
ビーム間隔、Ｂ：光ビーム長。
1 and 2 are a side view and a plan view showing the configuration of an embodiment of the present invention, FIG. 3 is a diagram of the combination of the light shielding plate in FIG. 2, and FIG. 4 is a diagram showing electronic components in a soldered state. 5 and 6 are a side view and a plan view of a conventional light beam soldering apparatus. In each figure, 1: light source unit, 1-x1, 1-x2: photoelectric unit pair on the X-axis side, 1-y1, 1-y2: photoelectric unit pair on the Y-axis side, 2: base, 3: moving table , 6: Printed circuit board, 7: Electronic component, 7a: Lead, 8: Light beam, 9-x1, 9-x2, 9-
y1, 9-y2: light shielding plate, 9a: irradiation window, A: light beam interval, B: light beam length.
Claims (1)
該電子部品のパツケージ周面より側方に引出した
各リード列へ同時に光ビームを照射してはんだ付
けを行う電子部品の光ビームはんだ付け装置であ
り、電子部品のパツケージを取り囲んでその周囲
上方に分散配備した各対が互いに直交するＸ，Ｙ
軸方向に移動調節可能な２対、合計４基の光源ユ
ニツトを備えたものにおいて、各基の光源ユニツ
ト毎に光ビーム照射窓を開口した遮光板を光路途
上に張出して取付けるとともに、Ｘ軸側の遮光板
とＹ軸側の遮光板とが互いに相手側の照射窓内に
突出してラツプし合うように各遮光板を井桁状に
組合せて配置したことを特徴とする電子部品の光
ビームはんだ付け装置。 For electronic components mounted on printed circuit boards,
This is a light beam soldering device for electronic components that performs soldering by simultaneously irradiating a light beam to each lead row pulled out laterally from the peripheral surface of the package of the electronic component. X, Y where each distributed pair is orthogonal to each other
In a system equipped with two pairs of light source units that can be adjusted in the axial direction, a total of four light source units, a light shielding plate with a light beam irradiation window opened in the middle of the optical path is attached to each light source unit, and a light shielding plate is installed in the middle of the optical path. Light beam soldering of electronic components, characterized in that each light shielding plate is arranged in a cross-shaped pattern so that the light shielding plate on the Y-axis side and the light shielding plate on the Y-axis side protrude into the irradiation window of the other side and overlap each other. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP522088U JPH01109370U (en) | 1988-01-19 | 1988-01-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP522088U JPH01109370U (en) | 1988-01-19 | 1988-01-19 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01109370U true JPH01109370U (en) | 1989-07-24 |
Family
ID=31208410
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP522088U Pending JPH01109370U (en) | 1988-01-19 | 1988-01-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01109370U (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515963A (en) * | 1978-07-21 | 1980-02-04 | Mitsubishi Metal Corp | Tough* abrasion resistant sintered material |
| JPS611313A (en) * | 1984-06-13 | 1986-01-07 | 井関農機株式会社 | Seedling feeder of seedling planter |
-
1988
- 1988-01-19 JP JP522088U patent/JPH01109370U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5515963A (en) * | 1978-07-21 | 1980-02-04 | Mitsubishi Metal Corp | Tough* abrasion resistant sintered material |
| JPS611313A (en) * | 1984-06-13 | 1986-01-07 | 井関農機株式会社 | Seedling feeder of seedling planter |
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