JPH01104027U - - Google Patents
Info
- Publication number
- JPH01104027U JPH01104027U JP1987199352U JP19935287U JPH01104027U JP H01104027 U JPH01104027 U JP H01104027U JP 1987199352 U JP1987199352 U JP 1987199352U JP 19935287 U JP19935287 U JP 19935287U JP H01104027 U JPH01104027 U JP H01104027U
- Authority
- JP
- Japan
- Prior art keywords
- copper plate
- solder
- semiconductor chip
- fixed
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H10W72/5445—
-
- H10W72/884—
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- H10W90/759—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987199352U JPH01104027U (enExample) | 1987-12-28 | 1987-12-28 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1987199352U JPH01104027U (enExample) | 1987-12-28 | 1987-12-28 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH01104027U true JPH01104027U (enExample) | 1989-07-13 |
Family
ID=31489804
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1987199352U Pending JPH01104027U (enExample) | 1987-12-28 | 1987-12-28 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH01104027U (enExample) |
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1987
- 1987-12-28 JP JP1987199352U patent/JPH01104027U/ja active Pending