JPH01100175U - - Google Patents

Info

Publication number
JPH01100175U
JPH01100175U JP1987196302U JP19630287U JPH01100175U JP H01100175 U JPH01100175 U JP H01100175U JP 1987196302 U JP1987196302 U JP 1987196302U JP 19630287 U JP19630287 U JP 19630287U JP H01100175 U JPH01100175 U JP H01100175U
Authority
JP
Japan
Prior art keywords
wiring board
control circuit
pattern
wiring
dot matrix
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1987196302U
Other languages
English (en)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1987196302U priority Critical patent/JPH01100175U/ja
Publication of JPH01100175U publication Critical patent/JPH01100175U/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Description

【図面の簡単な説明】
第１図は本考案に係るドツトマトリクス表示装
置の一実施例を示す断面図、第２図は同実施例の
作業工程の順序を示す流れ図、第３図は従来例を
示す断面図である。 １……メタルコア配線板、１Ａ……メタルコア
基板、１Ｂ……チツプ搭載用配線パターン、１Ｃ
……制御回路パターン、１Ｄ……スルーホール部
、２……ＬＥＤチツプ、３……Ａｕ線、４……ハ
ウジング、５……透明樹脂、６……制御回路部品
、７……サポート部材。

Claims (1)

    【実用新案登録請求の範囲】
  1. ドツトマトリクス表示用の配線パターンが一面
    に、制御回路パターンが他面にそれぞれ形成され
    、両面のパターンがスルーホール部に結線された
    メタルコア配線板と、この配線板の配線パターン
    のチツプ搭載面にボンデイングされた多数のＬＥ
    Ｄチツプと、前記配線板の一面に取付けられたハ
    ウジングと、このハウジングのＬＥＤチツプ収納
    部にモールドされた拡散剤入り透明樹脂と、前記
    配線板の制御回路パターンに搭載された制御回路
    部品とを備えてなることを特徴とするドツトマト
    リクス表示装置。
JP1987196302U 1987-12-24 1987-12-24 Pending JPH01100175U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1987196302U JPH01100175U (ja) 1987-12-24 1987-12-24

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1987196302U JPH01100175U (ja) 1987-12-24 1987-12-24

Publications (1)

Publication Number Publication Date
JPH01100175U true JPH01100175U (ja) 1989-07-05

Family

ID=31486926

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1987196302U Pending JPH01100175U (ja) 1987-12-24 1987-12-24

Country Status (1)

Country Link
JP (1) JPH01100175U (ja)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2004296882A (ja) * 2003-03-27 2004-10-21 Sanken Electric Co Ltd 半導体発光装置
JP2005108544A (ja) * 2003-09-29 2005-04-21 Matsumura Denki Seisakusho:Kk Ｌｅｄ照明装置
KR100462990B1 (ko) * 1996-02-19 2005-06-16 로무 가부시키가이샤 표시장치
JP2007317573A (ja) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Ｌｅｄ点灯ユニット及びそれを用いた照明器具
JP2012089870A (ja) * 2004-10-25 2012-05-10 Cree Inc 固体金属ブロック半導体発光デバイス実装基板ならびにキャビティおよびヒートシンクを含むパッケージ、ならびにそれらをパッケージングする方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61218198A (ja) * 1985-03-25 1986-09-27 株式会社日立製作所 表示装置付制御基板
JPS6222497A (ja) * 1985-07-22 1987-01-30 東洋通信機株式会社 メタルコア配線基板

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61218198A (ja) * 1985-03-25 1986-09-27 株式会社日立製作所 表示装置付制御基板
JPS6222497A (ja) * 1985-07-22 1987-01-30 東洋通信機株式会社 メタルコア配線基板

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100462990B1 (ko) * 1996-02-19 2005-06-16 로무 가부시키가이샤 표시장치
JP2004296882A (ja) * 2003-03-27 2004-10-21 Sanken Electric Co Ltd 半導体発光装置
JP2005108544A (ja) * 2003-09-29 2005-04-21 Matsumura Denki Seisakusho:Kk Ｌｅｄ照明装置
JP2012089870A (ja) * 2004-10-25 2012-05-10 Cree Inc 固体金属ブロック半導体発光デバイス実装基板ならびにキャビティおよびヒートシンクを含むパッケージ、ならびにそれらをパッケージングする方法
JP2007317573A (ja) * 2006-05-26 2007-12-06 Matsushita Electric Works Ltd Ｌｅｄ点灯ユニット及びそれを用いた照明器具
JP4552897B2 (ja) * 2006-05-26 2010-09-29 パナソニック電工株式会社 Ｌｅｄ点灯ユニット及びそれを用いた照明器具

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