JP7887885B2 - Ledデバイス及びledデバイスの製造方法 - Google Patents
Ledデバイス及びledデバイスの製造方法Info
- Publication number
- JP7887885B2 JP7887885B2 JP2023507871A JP2023507871A JP7887885B2 JP 7887885 B2 JP7887885 B2 JP 7887885B2 JP 2023507871 A JP2023507871 A JP 2023507871A JP 2023507871 A JP2023507871 A JP 2023507871A JP 7887885 B2 JP7887885 B2 JP 7887885B2
- Authority
- JP
- Japan
- Prior art keywords
- led structure
- led
- porous
- porous region
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
- H10H29/142—Two-dimensional arrangements, e.g. asymmetric LED layout
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0133—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials
- H10H20/01335—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials with a substrate not being Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/01—Manufacture or treatment
- H10H20/011—Manufacture or treatment of bodies, e.g. forming semiconductor layers
- H10H20/013—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials
- H10H20/0137—Manufacture or treatment of bodies, e.g. forming semiconductor layers having light-emitting regions comprising only Group III-V materials the light-emitting regions comprising nitride materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/811—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions
- H10H20/812—Bodies having quantum effect structures or superlattices, e.g. tunnel junctions within the light-emitting regions, e.g. having quantum confinement structures
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/817—Bodies characterised by the crystal structures or orientations, e.g. polycrystalline, amorphous or porous
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/81—Bodies
- H10H20/822—Materials of the light-emitting regions
- H10H20/824—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP
- H10H20/825—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN
- H10H20/8252—Materials of the light-emitting regions comprising only Group III-V materials, e.g. GaP containing nitrogen, e.g. GaN characterised by the dopants
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H29/00—Integrated devices, or assemblies of multiple devices, comprising at least one light-emitting semiconductor element covered by group H10H20/00
- H10H29/10—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00
- H10H29/14—Integrated devices comprising at least one light-emitting semiconductor component covered by group H10H20/00 comprising multiple light-emitting semiconductor components
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Led Devices (AREA)
- Led Device Packages (AREA)
Applications Claiming Priority (25)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| GB2012103.4 | 2020-08-04 | ||
| GBGB2012110.9A GB202012110D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GBGB2012108.3A GB202012108D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GBGB2012103.4A GB202012103D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GBGB2012098.6A GB202012098D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GB2012098.6 | 2020-08-04 | ||
| GB2012110.9 | 2020-08-04 | ||
| GBGB2012105.9A GB202012105D0 (en) | 2020-08-04 | 2020-08-04 | Semiconductor structure |
| GB2012105.9 | 2020-08-04 | ||
| GB2012108.3 | 2020-08-04 | ||
| GB2018016.2 | 2020-11-16 | ||
| GBGB2018016.2A GB202018016D0 (en) | 2020-11-16 | 2020-11-16 | Red led and method of manufacture |
| GBPCT/GB2021/050147 | 2021-01-22 | ||
| PCT/GB2021/050158 WO2021148813A1 (en) | 2020-01-22 | 2021-01-22 | Semiconductor structure and method of manufacture |
| GBPCT/GB2021/050158 | 2021-01-22 | ||
| GBPCT/GB2021/050152 | 2021-01-22 | ||
| PCT/GB2021/050147 WO2021148803A1 (en) | 2020-01-22 | 2021-01-22 | Micro-led and manufacturing method thereof |
| PCT/GB2021/050152 WO2021148808A1 (en) | 2020-01-22 | 2021-01-22 | Red led and method of manufacture |
| GB2102012.8 | 2021-02-12 | ||
| GB2102021.9 | 2021-02-12 | ||
| GBGB2102017.7A GB202102017D0 (en) | 2021-02-12 | 2021-02-12 | LED Device and method manufacture |
| GBGB2102012.8A GB202102012D0 (en) | 2021-02-12 | 2021-02-12 | LED Device and method of manufacture |
| GB2102017.7 | 2021-02-12 | ||
| GBGB2102021.9A GB202102021D0 (en) | 2021-02-12 | 2021-02-12 | Led device and method of manufacture |
| PCT/GB2021/052019 WO2022029433A1 (en) | 2020-08-04 | 2021-08-04 | Led device and method of manufacturing an led device |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2023536360A JP2023536360A (ja) | 2023-08-24 |
| JP2023536360A5 JP2023536360A5 (enExample) | 2024-08-14 |
| JP7887885B2 true JP7887885B2 (ja) | 2026-07-10 |
Family
ID=80120106
Family Applications (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023507871A Active JP7887885B2 (ja) | 2020-08-04 | 2021-08-04 | Ledデバイス及びledデバイスの製造方法 |
| JP2023507874A Active JP7835731B2 (ja) | 2020-08-04 | 2021-08-04 | Ledデバイス及びledデバイスの製造方法 |
| JP2023507873A Pending JP2023536362A (ja) | 2020-08-04 | 2021-08-04 | Ledデバイス及びledデバイスの製造方法 |
Family Applications After (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023507874A Active JP7835731B2 (ja) | 2020-08-04 | 2021-08-04 | Ledデバイス及びledデバイスの製造方法 |
| JP2023507873A Pending JP2023536362A (ja) | 2020-08-04 | 2021-08-04 | Ledデバイス及びledデバイスの製造方法 |
Country Status (7)
| Country | Link |
|---|---|
| US (3) | US12701846B2 (enExample) |
| EP (3) | EP4193391A1 (enExample) |
| JP (3) | JP7887885B2 (enExample) |
| KR (3) | KR20230058639A (enExample) |
| CN (3) | CN116325189A (enExample) |
| TW (3) | TW202211498A (enExample) |
| WO (3) | WO2022029436A1 (enExample) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| FR3124313B1 (fr) * | 2021-06-16 | 2023-06-30 | Commissariat Energie Atomique | Procede de fabrication d’une matrice a emission native |
| KR20240030349A (ko) | 2022-08-30 | 2024-03-07 | 삼성전자주식회사 | 다중 파장 발광 소자 및 그 제조 방법 |
| GB202216889D0 (en) * | 2022-11-11 | 2022-12-28 | Poro Tech Ltd | Opto-electronic device and method of manufacturing |
| FR3144485B1 (fr) * | 2022-12-21 | 2024-12-13 | Commissariat Energie Atomique | Procédé de fabrication d’un substrat de croissance comportant des mésas de différentes deformabilites, par gravure et porosification électrochimique |
| JP2025026068A (ja) * | 2023-08-10 | 2025-02-21 | 豊田合成株式会社 | 発光素子 |
| FR3164057A1 (fr) * | 2024-06-27 | 2026-01-02 | Commissariat A L' Energie Atomique Et Aux Energies Alternatives | Procédé de porosification de mésas |
Citations (9)
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|---|---|---|---|---|
| JP2006121037A (ja) | 2004-10-20 | 2006-05-11 | Genesys Photonics Inc | 多孔質発光層を有する発光素子 |
| JP2007335879A (ja) | 2006-06-09 | 2007-12-27 | Philips Lumileds Lightng Co Llc | 多孔質層を含む半導体発光デバイス |
| US20090001416A1 (en) | 2007-06-28 | 2009-01-01 | National University Of Singapore | Growth of indium gallium nitride (InGaN) on porous gallium nitride (GaN) template by metal-organic chemical vapor deposition (MOCVD) |
| US20090140274A1 (en) | 2007-12-04 | 2009-06-04 | Philips Lumileds Lighting Company, Llc | III-Nitride Light Emitting Device Including Porous Semiconductor Layer |
| KR101136063B1 (ko) | 2010-11-10 | 2012-04-18 | 전북대학교산학협력단 | 발광소자 및 그 제조방법 |
| JP2018502436A (ja) | 2014-09-30 | 2018-01-25 | イェール ユニバーシティーYale University | GaN垂直微小共振器面発光レーザ(VCSEL)のための方法 |
| WO2019063957A1 (en) | 2017-09-27 | 2019-04-04 | Cambridge Enterprise Ltd | METHOD FOR MAKING POROUS MATERIAL AND SEMICONDUCTOR STRUCTURE |
| US20190123235A1 (en) | 2017-10-20 | 2019-04-25 | Korea Advanced Institute Of Science And Technology | Micro light emitting diode (led) structure, method for manufacturing the same and display including the same |
| WO2019145728A1 (en) | 2018-01-26 | 2019-08-01 | Cambridge Enterprise Ltd | Method for electrochemically etching a semiconductor structure |
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| JP3122644B2 (ja) | 1998-09-10 | 2001-01-09 | シャープ株式会社 | 半導体発光素子の製造方法 |
| JP2004079933A (ja) | 2002-08-22 | 2004-03-11 | Ishikawajima Harima Heavy Ind Co Ltd | Ledディスプレイとその製造方法 |
| EP1583139A1 (en) * | 2004-04-02 | 2005-10-05 | Interuniversitaire Microelectronica Centrum vzw ( IMEC) | Method for depositing a group III-nitride material on a silicon substrate and device therefor |
| JP4525500B2 (ja) | 2005-07-14 | 2010-08-18 | パナソニック電工株式会社 | 半導体発光素子およびそれを用いる照明装置ならびに半導体発光素子の製造方法 |
| JP2009021361A (ja) | 2007-07-11 | 2009-01-29 | Sumitomo Electric Ind Ltd | 窒化物系半導体発光素子、および窒化物系半導体発光素子を作製する方法 |
| WO2009038324A2 (en) | 2007-09-18 | 2009-03-26 | Chungbuk National University Industry-Academic Cooperation Foundation | Porous pattern semiconductor structure and semiconductor device and manufacturing method thereof |
| US8058669B2 (en) | 2008-08-28 | 2011-11-15 | Taiwan Semiconductor Manufacturing Company, Ltd. | Light-emitting diode integration scheme |
| TWI392118B (zh) | 2008-12-04 | 2013-04-01 | 廣鎵光電股份有限公司 | 發光二極體之製造方法及發光二極體 |
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| KR101452801B1 (ko) | 2014-03-25 | 2014-10-22 | 광주과학기술원 | 발광다이오드 및 이의 제조방법 |
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| KR20180133436A (ko) | 2016-05-04 | 2018-12-14 | 글로 에이비 | 상이한 색상의 led를 포함하는 일체형 다색 직시형 디스플레이와 이의 제조 방법 |
| WO2018063391A1 (en) * | 2016-09-30 | 2018-04-05 | Intel Corporation | High performance light emitting diode and monolithic multi-color pixel |
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| CN109768135B (zh) | 2018-12-27 | 2020-06-19 | 武汉大学 | 全色堆栈式倒装RGB Micro-LED芯片阵列及其制备方法 |
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| WO2022099500A1 (zh) * | 2020-11-11 | 2022-05-19 | 苏州晶湛半导体有限公司 | 一种发光结构及其制备方法 |
-
2021
- 2021-08-03 TW TW110128573A patent/TW202211498A/zh unknown
- 2021-08-03 TW TW110128567A patent/TWI912341B/zh active
- 2021-08-03 TW TW110128568A patent/TWI905240B/zh active
- 2021-08-04 KR KR1020237007771A patent/KR20230058639A/ko not_active Withdrawn
- 2021-08-04 US US18/040,529 patent/US12701846B2/en active Active
- 2021-08-04 KR KR1020237007768A patent/KR20230058637A/ko active Pending
- 2021-08-04 CN CN202180067476.5A patent/CN116325189A/zh active Pending
- 2021-08-04 EP EP21752134.3A patent/EP4193391A1/en active Pending
- 2021-08-04 WO PCT/GB2021/052022 patent/WO2022029436A1/en not_active Ceased
- 2021-08-04 CN CN202180067477.XA patent/CN116325190A/zh active Pending
- 2021-08-04 US US18/040,534 patent/US20240014348A1/en active Pending
- 2021-08-04 EP EP21752137.6A patent/EP4193394A1/en active Pending
- 2021-08-04 JP JP2023507871A patent/JP7887885B2/ja active Active
- 2021-08-04 JP JP2023507874A patent/JP7835731B2/ja active Active
- 2021-08-04 KR KR1020237007770A patent/KR20230060507A/ko active Pending
- 2021-08-04 US US18/040,524 patent/US20230378237A1/en active Pending
- 2021-08-04 JP JP2023507873A patent/JP2023536362A/ja active Pending
- 2021-08-04 EP EP21752136.8A patent/EP4193393A1/en active Pending
- 2021-08-04 CN CN202180066636.4A patent/CN116210091A/zh active Pending
- 2021-08-04 WO PCT/GB2021/052019 patent/WO2022029433A1/en not_active Ceased
- 2021-08-04 WO PCT/GB2021/052023 patent/WO2022029437A1/en not_active Ceased
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006121037A (ja) | 2004-10-20 | 2006-05-11 | Genesys Photonics Inc | 多孔質発光層を有する発光素子 |
| JP2007335879A (ja) | 2006-06-09 | 2007-12-27 | Philips Lumileds Lightng Co Llc | 多孔質層を含む半導体発光デバイス |
| US20090001416A1 (en) | 2007-06-28 | 2009-01-01 | National University Of Singapore | Growth of indium gallium nitride (InGaN) on porous gallium nitride (GaN) template by metal-organic chemical vapor deposition (MOCVD) |
| US20090140274A1 (en) | 2007-12-04 | 2009-06-04 | Philips Lumileds Lighting Company, Llc | III-Nitride Light Emitting Device Including Porous Semiconductor Layer |
| KR101136063B1 (ko) | 2010-11-10 | 2012-04-18 | 전북대학교산학협력단 | 발광소자 및 그 제조방법 |
| JP2018502436A (ja) | 2014-09-30 | 2018-01-25 | イェール ユニバーシティーYale University | GaN垂直微小共振器面発光レーザ(VCSEL)のための方法 |
| WO2019063957A1 (en) | 2017-09-27 | 2019-04-04 | Cambridge Enterprise Ltd | METHOD FOR MAKING POROUS MATERIAL AND SEMICONDUCTOR STRUCTURE |
| US20190123235A1 (en) | 2017-10-20 | 2019-04-25 | Korea Advanced Institute Of Science And Technology | Micro light emitting diode (led) structure, method for manufacturing the same and display including the same |
| WO2019145728A1 (en) | 2018-01-26 | 2019-08-01 | Cambridge Enterprise Ltd | Method for electrochemically etching a semiconductor structure |
Non-Patent Citations (1)
| Title |
|---|
| PASAYAT, Shubhra S. et al.,"Growth of strain-relaxed InGaN on micrometer-sized patterned compliant GaN pseudo-substrates",Applied Physics Letters,2020年03月16日,Vol. 116,No. 11,p. 1-5,DOI: 10.1063/5.0001480 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN116325189A (zh) | 2023-06-23 |
| US20230378237A1 (en) | 2023-11-23 |
| TWI905240B (zh) | 2025-11-21 |
| CN116210091A (zh) | 2023-06-02 |
| KR20230058639A (ko) | 2023-05-03 |
| EP4193394A1 (en) | 2023-06-14 |
| WO2022029433A1 (en) | 2022-02-10 |
| WO2022029437A1 (en) | 2022-02-10 |
| US12701846B2 (en) | 2026-08-04 |
| US20230290806A1 (en) | 2023-09-14 |
| KR20230058637A (ko) | 2023-05-03 |
| TW202224205A (zh) | 2022-06-16 |
| JP7835731B2 (ja) | 2026-03-25 |
| CN116325190A (zh) | 2023-06-23 |
| TW202211498A (zh) | 2022-03-16 |
| WO2022029436A1 (en) | 2022-02-10 |
| EP4193391A1 (en) | 2023-06-14 |
| TWI912341B (zh) | 2026-01-21 |
| JP2023536363A (ja) | 2023-08-24 |
| KR20230060507A (ko) | 2023-05-04 |
| TW202221937A (zh) | 2022-06-01 |
| JP2023536362A (ja) | 2023-08-24 |
| US20240014348A1 (en) | 2024-01-11 |
| EP4193393A1 (en) | 2023-06-14 |
| JP2023536360A (ja) | 2023-08-24 |
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