JP7829817B2 - 電子機器 - Google Patents

電子機器

Info

Publication number
JP7829817B2
JP7829817B2 JP2025542269A JP2025542269A JP7829817B2 JP 7829817 B2 JP7829817 B2 JP 7829817B2 JP 2025542269 A JP2025542269 A JP 2025542269A JP 2025542269 A JP2025542269 A JP 2025542269A JP 7829817 B2 JP7829817 B2 JP 7829817B2
Authority
JP
Japan
Prior art keywords
guide member
air guide
air
gap
electronic device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025542269A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025046663A5 (https=
JPWO2025046663A1 (https=
Inventor
孝弘 増山
翔太 佐藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of JPWO2025046663A1 publication Critical patent/JPWO2025046663A1/ja
Publication of JPWO2025046663A5 publication Critical patent/JPWO2025046663A5/ja
Application granted granted Critical
Publication of JP7829817B2 publication Critical patent/JP7829817B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2025542269A 2023-08-25 2023-08-25 電子機器 Active JP7829817B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/030764 WO2025046663A1 (ja) 2023-08-25 2023-08-25 電子機器

Publications (3)

Publication Number Publication Date
JPWO2025046663A1 JPWO2025046663A1 (https=) 2025-03-06
JPWO2025046663A5 JPWO2025046663A5 (https=) 2025-09-18
JP7829817B2 true JP7829817B2 (ja) 2026-03-13

Family

ID=94818366

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025542269A Active JP7829817B2 (ja) 2023-08-25 2023-08-25 電子機器

Country Status (2)

Country Link
JP (1) JP7829817B2 (https=)
WO (1) WO2025046663A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050150634A1 (en) 2004-01-14 2005-07-14 Howard Scott D. System for cooling environmentally sealed enclosures
JP2012099784A (ja) 2010-08-02 2012-05-24 Fuji Electric Co Ltd 電子機器
WO2019111755A1 (ja) 2017-12-07 2019-06-13 三菱電機株式会社 半導体装置
JP2020120033A (ja) 2019-01-25 2020-08-06 株式会社Ｊｖｃケンウッド 排熱構造および電子機器

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH062315Y2 (ja) * 1986-01-23 1994-01-19 富士電機株式会社 インバ−タ装置
JP2005110428A (ja) * 2003-09-30 2005-04-21 Toshiba Elevator Co Ltd 電力変換素子冷却装置
JP2009231701A (ja) * 2008-03-25 2009-10-08 Fujikura Ltd 電子機器用冷却装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050150634A1 (en) 2004-01-14 2005-07-14 Howard Scott D. System for cooling environmentally sealed enclosures
JP2012099784A (ja) 2010-08-02 2012-05-24 Fuji Electric Co Ltd 電子機器
WO2019111755A1 (ja) 2017-12-07 2019-06-13 三菱電機株式会社 半導体装置
JP2020120033A (ja) 2019-01-25 2020-08-06 株式会社Ｊｖｃケンウッド 排熱構造および電子機器

Also Published As

Publication number Publication date
WO2025046663A1 (ja) 2025-03-06
JPWO2025046663A1 (https=) 2025-03-06

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