JP7828288B2 - 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス - Google Patents

硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

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Publication number
JP7828288B2
JP7828288B2 JP2022557294A JP2022557294A JP7828288B2 JP 7828288 B2 JP7828288 B2 JP 7828288B2 JP 2022557294 A JP2022557294 A JP 2022557294A JP 2022557294 A JP2022557294 A JP 2022557294A JP 7828288 B2 JP7828288 B2 JP 7828288B2
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group
compound
groups
epoxy
thermally conductive
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JPWO2022080078A1 (https=
Inventor
誠一 人見
大介 林
慶太 高橋
輝樹 新居
信 小澤
明希 中道
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Fujifilm Corp
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Fujifilm Corp
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/62—Alcohols or phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G65/00—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule
    • C08G65/34—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives
    • C08G65/38—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols
    • C08G65/40—Macromolecular compounds obtained by reactions forming an ether link in the main chain of the macromolecule from hydroxy compounds or their metallic derivatives derived from phenols from phenols (I) and other compounds (II), e.g. OH-Ar-OH + X-Ar-X, where X is halogen atom, i.e. leaving group
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G73/00—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups C08G12/00 - C08G71/00
    • C08G73/06—Polycondensates having nitrogen-containing heterocyclic rings in the main chain of the macromolecule
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/18—Manufacture of films or sheets
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/50—Phosphorus bound to carbon only
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L71/00—Compositions of polyethers obtained by reactions forming an ether link in the main chain; Compositions of derivatives of such polymers
    • C08L71/08—Polyethers derived from hydroxy compounds or from their metallic derivatives
    • C08L71/10—Polyethers derived from hydroxy compounds or from their metallic derivatives from phenols
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
    • C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/10—Arrangements for heating

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Materials Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP2022557294A 2020-10-16 2021-09-15 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス Active JP7828288B2 (ja)

Applications Claiming Priority (9)

Application Number Priority Date Filing Date Title
JP2020174891 2020-10-16
JP2020174891 2020-10-16
JP2020203648 2020-12-08
JP2020203648 2020-12-08
JP2021024526 2021-02-18
JP2021024526 2021-02-18
JP2021039854 2021-03-12
JP2021039854 2021-03-12
PCT/JP2021/033948 WO2022080078A1 (ja) 2020-10-16 2021-09-15 硬化性組成物、熱伝導材料、熱伝導シート、熱伝導層付きデバイス

Publications (2)

Publication Number Publication Date
JPWO2022080078A1 JPWO2022080078A1 (https=) 2022-04-21
JP7828288B2 true JP7828288B2 (ja) 2026-03-11

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Country Status (3)

Country Link
JP (1) JP7828288B2 (https=)
TW (1) TW202229505A (https=)
WO (1) WO2022080078A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026014460A1 (ja) * 2024-07-11 2026-01-15 三菱瓦斯化学株式会社 樹脂組成物、樹脂シート、多層体、および、半導体素子

Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089641A (ja) 2003-09-18 2005-04-07 Denki Kagaku Kogyo Kk 硬化性複合材料とそれを用いた回路基板
JP2013006893A (ja) 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
WO2013089100A1 (ja) 2011-12-16 2013-06-20 株式会社スリーボンド 硬化性樹脂組成物
JP2014005359A (ja) 2012-06-25 2014-01-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2014196403A (ja) 2013-03-29 2014-10-16 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール
JP2015093975A (ja) 2013-11-14 2015-05-18 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
JP2016044211A (ja) 2014-08-20 2016-04-04 日立化成株式会社 モールドアンダーフィル用樹脂組成物及び電子部品装置
WO2018025933A1 (ja) 2016-08-02 2018-02-08 デンカ株式会社 電気回路装置の放熱構造
JP2019108517A (ja) 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、積層板、金属ベース基板およびパワーモジュール
JP2019196433A (ja) 2018-05-09 2019-11-14 住友ベークライト株式会社 高熱伝導性硬化性樹脂組成物、当該組成物の硬化物、当該組成物により設けられた樹脂層を含む積層体および当該積層体を備えるパワーモジュール
JP2020140964A (ja) 2019-02-27 2020-09-03 三ツ星ベルト株式会社 導電性ペースト及び導電性積層体

Patent Citations (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005089641A (ja) 2003-09-18 2005-04-07 Denki Kagaku Kogyo Kk 硬化性複合材料とそれを用いた回路基板
JP2013006893A (ja) 2011-06-22 2013-01-10 Hitachi Chemical Co Ltd 高熱伝導樹脂組成物、高熱伝導性硬化物、接着フィルム、封止用フィルム、及びこれらを用いた半導体装置
WO2013089100A1 (ja) 2011-12-16 2013-06-20 株式会社スリーボンド 硬化性樹脂組成物
JP2014005359A (ja) 2012-06-25 2014-01-16 Sumitomo Bakelite Co Ltd エポキシ樹脂組成物及び電子部品装置
JP2014196403A (ja) 2013-03-29 2014-10-16 三菱電機株式会社 熱硬化性樹脂組成物、熱伝導性樹脂シート及びその製造方法、並びにパワーモジュール
JP2015093975A (ja) 2013-11-14 2015-05-18 住友ベークライト株式会社 金属張積層板、プリント配線基板、および半導体装置
JP2016044211A (ja) 2014-08-20 2016-04-04 日立化成株式会社 モールドアンダーフィル用樹脂組成物及び電子部品装置
WO2018025933A1 (ja) 2016-08-02 2018-02-08 デンカ株式会社 電気回路装置の放熱構造
JP2019108517A (ja) 2017-12-15 2019-07-04 住友ベークライト株式会社 熱硬化性樹脂組成物、その硬化物、積層板、金属ベース基板およびパワーモジュール
JP2019196433A (ja) 2018-05-09 2019-11-14 住友ベークライト株式会社 高熱伝導性硬化性樹脂組成物、当該組成物の硬化物、当該組成物により設けられた樹脂層を含む積層体および当該積層体を備えるパワーモジュール
JP2020140964A (ja) 2019-02-27 2020-09-03 三ツ星ベルト株式会社 導電性ペースト及び導電性積層体

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TW202229505A (zh) 2022-08-01
JPWO2022080078A1 (https=) 2022-04-21

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