JP7816361B2 - 撮像素子および撮像装置 - Google Patents
撮像素子および撮像装置Info
- Publication number
- JP7816361B2 JP7816361B2 JP2023543976A JP2023543976A JP7816361B2 JP 7816361 B2 JP7816361 B2 JP 7816361B2 JP 2023543976 A JP2023543976 A JP 2023543976A JP 2023543976 A JP2023543976 A JP 2023543976A JP 7816361 B2 JP7816361 B2 JP 7816361B2
- Authority
- JP
- Japan
- Prior art keywords
- unit
- pixel
- signal
- control
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Classifications
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
- H04N25/533—Control of the integration time by using differing integration times for different sensor regions
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/50—Control of the SSIS exposure
- H04N25/53—Control of the integration time
- H04N25/533—Control of the integration time by using differing integration times for different sensor regions
- H04N25/535—Control of the integration time by using differing integration times for different sensor regions by dynamic region selection
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/766—Addressed sensors, e.g. MOS or CMOS sensors comprising control or output lines used for a plurality of functions, e.g. for pixel output, driving, reset or power
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/77—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components
- H04N25/772—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters
- H04N25/773—Pixel circuitry, e.g. memories, A/D converters, pixel amplifiers, shared circuits or shared components comprising A/D, V/T, V/F, I/T or I/F converters comprising photon counting circuits, e.g. single photon detection [SPD] or single photon avalanche diodes [SPAD]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/76—Addressed sensors, e.g. MOS or CMOS sensors
- H04N25/78—Readout circuits for addressed sensors, e.g. output amplifiers or A/D converters
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N25/00—Circuitry of solid-state image sensors [SSIS]; Control thereof
- H04N25/70—SSIS architectures; Circuits associated therewith
- H04N25/79—Arrangements of circuitry being divided between different or multiple substrates, chips or circuit boards, e.g. stacked image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/10—Integrated devices
- H10F39/12—Image sensors
- H10F39/199—Back-illuminated image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/809—Constructional details of image sensors of hybrid image sensors
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
- H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
- H10F39/80—Constructional details of image sensors
- H10F39/811—Interconnections
Landscapes
- Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2026015662A JP2026063489A (ja) | 2021-08-25 | 2026-02-02 | 撮像素子 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2021137343 | 2021-08-25 | ||
| JP2021137343 | 2021-08-25 | ||
| PCT/JP2022/032036 WO2023027143A1 (ja) | 2021-08-25 | 2022-08-25 | 撮像素子および撮像装置 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026015662A Division JP2026063489A (ja) | 2021-08-25 | 2026-02-02 | 撮像素子 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2023027143A1 JPWO2023027143A1 (https=) | 2023-03-02 |
| JPWO2023027143A5 JPWO2023027143A5 (https=) | 2024-05-22 |
| JP7816361B2 true JP7816361B2 (ja) | 2026-02-18 |
Family
ID=85322910
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2023543976A Active JP7816361B2 (ja) | 2021-08-25 | 2022-08-25 | 撮像素子および撮像装置 |
| JP2026015662A Pending JP2026063489A (ja) | 2021-08-25 | 2026-02-02 | 撮像素子 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2026015662A Pending JP2026063489A (ja) | 2021-08-25 | 2026-02-02 | 撮像素子 |
Country Status (5)
| Country | Link |
|---|---|
| US (1) | US20240381005A1 (https=) |
| EP (1) | EP4395359A4 (https=) |
| JP (2) | JP7816361B2 (https=) |
| CN (1) | CN118120253A (https=) |
| WO (1) | WO2023027143A1 (https=) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW202441974A (zh) * | 2023-03-24 | 2024-10-16 | 日商索尼半導體解決方案公司 | 光檢測裝置及電子機器 |
| WO2025134915A1 (ja) * | 2023-12-18 | 2025-06-26 | 株式会社ニコン | 撮像素子および撮像装置 |
| WO2025197629A1 (ja) * | 2024-03-19 | 2025-09-25 | 株式会社ニコン | 撮像素子および撮像装置 |
| WO2026074406A1 (ja) * | 2024-10-03 | 2026-04-09 | 株式会社半導体エネルギー研究所 | 撮像装置 |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006197192A (ja) | 2005-01-13 | 2006-07-27 | Sony Corp | 撮像装置及び撮像結果の処理方法 |
| JP2014075767A (ja) | 2012-10-05 | 2014-04-24 | Canon Inc | 固体撮像装置 |
| JP2016171455A (ja) | 2015-03-12 | 2016-09-23 | 株式会社東芝 | 固体撮像装置 |
| WO2017018188A1 (ja) | 2015-07-24 | 2017-02-02 | ソニーセミコンダクタソリューションズ株式会社 | イメージセンサ、及び、電子機器 |
| WO2017169216A1 (ja) | 2016-03-31 | 2017-10-05 | ソニー株式会社 | 固体撮像素子、固体撮像素子の駆動方法、及び、電子機器 |
| JP2019068405A (ja) | 2017-09-29 | 2019-04-25 | キヤノン株式会社 | 撮像装置、撮像システム、移動体 |
| JP2021027488A (ja) | 2019-08-06 | 2021-02-22 | キヤノン株式会社 | 撮像素子及びその制御方法、撮像装置 |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7245016B2 (ja) * | 2018-09-21 | 2023-03-23 | キヤノン株式会社 | 光電変換装置および撮像システム |
| JP2021137343A (ja) | 2020-03-05 | 2021-09-16 | 株式会社大神 | ドラム型回転加熱調理装置 |
-
2022
- 2022-08-25 JP JP2023543976A patent/JP7816361B2/ja active Active
- 2022-08-25 US US18/685,633 patent/US20240381005A1/en active Pending
- 2022-08-25 CN CN202280069889.1A patent/CN118120253A/zh active Pending
- 2022-08-25 EP EP22861431.9A patent/EP4395359A4/en active Pending
- 2022-08-25 WO PCT/JP2022/032036 patent/WO2023027143A1/ja not_active Ceased
-
2026
- 2026-02-02 JP JP2026015662A patent/JP2026063489A/ja active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006197192A (ja) | 2005-01-13 | 2006-07-27 | Sony Corp | 撮像装置及び撮像結果の処理方法 |
| JP2014075767A (ja) | 2012-10-05 | 2014-04-24 | Canon Inc | 固体撮像装置 |
| JP2016171455A (ja) | 2015-03-12 | 2016-09-23 | 株式会社東芝 | 固体撮像装置 |
| WO2017018188A1 (ja) | 2015-07-24 | 2017-02-02 | ソニーセミコンダクタソリューションズ株式会社 | イメージセンサ、及び、電子機器 |
| WO2017169216A1 (ja) | 2016-03-31 | 2017-10-05 | ソニー株式会社 | 固体撮像素子、固体撮像素子の駆動方法、及び、電子機器 |
| JP2019068405A (ja) | 2017-09-29 | 2019-04-25 | キヤノン株式会社 | 撮像装置、撮像システム、移動体 |
| JP2021027488A (ja) | 2019-08-06 | 2021-02-22 | キヤノン株式会社 | 撮像素子及びその制御方法、撮像装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| EP4395359A1 (en) | 2024-07-03 |
| US20240381005A1 (en) | 2024-11-14 |
| JPWO2023027143A1 (https=) | 2023-03-02 |
| JP2026063489A (ja) | 2026-04-10 |
| EP4395359A4 (en) | 2025-07-09 |
| CN118120253A (zh) | 2024-05-31 |
| WO2023027143A1 (ja) | 2023-03-02 |
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