JP7808242B2 - 導電性粒子、導電材料及び接続構造体 - Google Patents

導電性粒子、導電材料及び接続構造体

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Publication number
JP7808242B2
JP7808242B2 JP2025561989A JP2025561989A JP7808242B2 JP 7808242 B2 JP7808242 B2 JP 7808242B2 JP 2025561989 A JP2025561989 A JP 2025561989A JP 2025561989 A JP2025561989 A JP 2025561989A JP 7808242 B2 JP7808242 B2 JP 7808242B2
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JP
Japan
Prior art keywords
conductive
particles
conductive particles
less
particle
Prior art date
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Application number
JP2025561989A
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English (en)
Japanese (ja)
Other versions
JPWO2025170017A5 (https=
JPWO2025170017A1 (https=
Inventor
豪 湯川
理 杉本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sekisui Chemical Co Ltd
Original Assignee
Sekisui Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sekisui Chemical Co Ltd filed Critical Sekisui Chemical Co Ltd
Publication of JPWO2025170017A1 publication Critical patent/JPWO2025170017A1/ja
Publication of JPWO2025170017A5 publication Critical patent/JPWO2025170017A5/ja
Application granted granted Critical
Publication of JP7808242B2 publication Critical patent/JP7808242B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/08—Macromolecular additives
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J201/00—Adhesives based on unspecified macromolecular compounds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C09J9/02—Electrically-conducting adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Dispersion Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Non-Insulated Conductors (AREA)
JP2025561989A 2024-02-08 2025-02-07 導電性粒子、導電材料及び接続構造体 Active JP7808242B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2024017880 2024-02-08
JP2024017880 2024-02-08
PCT/JP2025/004048 WO2025170017A1 (ja) 2024-02-08 2025-02-07 導電性粒子、導電材料及び接続構造体

Publications (3)

Publication Number Publication Date
JPWO2025170017A1 JPWO2025170017A1 (https=) 2025-08-14
JPWO2025170017A5 JPWO2025170017A5 (https=) 2026-01-15
JP7808242B2 true JP7808242B2 (ja) 2026-01-28

Family

ID=96700089

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025561989A Active JP7808242B2 (ja) 2024-02-08 2025-02-07 導電性粒子、導電材料及び接続構造体

Country Status (2)

Country Link
JP (1) JP7808242B2 (https=)
WO (1) WO2025170017A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185918A (ja) 2011-03-03 2012-09-27 Nippon Shokubai Co Ltd 導電性微粒子及びそれを用いた異方性導電材料
WO2021235434A1 (ja) 2020-05-20 2021-11-25 日本化学工業株式会社 導電性粒子、それを用いた導電性材料及び接続構造体
WO2022239799A1 (ja) 2021-05-12 2022-11-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2023145664A1 (ja) 2022-01-27 2023-08-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012185918A (ja) 2011-03-03 2012-09-27 Nippon Shokubai Co Ltd 導電性微粒子及びそれを用いた異方性導電材料
WO2021235434A1 (ja) 2020-05-20 2021-11-25 日本化学工業株式会社 導電性粒子、それを用いた導電性材料及び接続構造体
WO2022239799A1 (ja) 2021-05-12 2022-11-17 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体
WO2023145664A1 (ja) 2022-01-27 2023-08-03 積水化学工業株式会社 導電性粒子、導電材料及び接続構造体

Also Published As

Publication number Publication date
JPWO2025170017A1 (https=) 2025-08-14
WO2025170017A1 (ja) 2025-08-14

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