JP7803463B2 - 伸縮性デバイス - Google Patents

伸縮性デバイス

Info

Publication number
JP7803463B2
JP7803463B2 JP2025518024A JP2025518024A JP7803463B2 JP 7803463 B2 JP7803463 B2 JP 7803463B2 JP 2025518024 A JP2025518024 A JP 2025518024A JP 2025518024 A JP2025518024 A JP 2025518024A JP 7803463 B2 JP7803463 B2 JP 7803463B2
Authority
JP
Japan
Prior art keywords
stretchable
wiring
substrate
ratio
modulus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2025518024A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024252979A1 (https=
JPWO2024252979A5 (https=
Inventor
俊文 飛鳥井
勇人 勝
孝義 小幡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Murata Manufacturing Co Ltd
Original Assignee
Murata Manufacturing Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Murata Manufacturing Co Ltd filed Critical Murata Manufacturing Co Ltd
Publication of JPWO2024252979A1 publication Critical patent/JPWO2024252979A1/ja
Publication of JPWO2024252979A5 publication Critical patent/JPWO2024252979A5/ja
Application granted granted Critical
Publication of JP7803463B2 publication Critical patent/JP7803463B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0104—Properties and characteristics in general
    • H05K2201/0133—Elastomeric or compliant polymer

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
JP2025518024A 2023-06-06 2024-05-28 伸縮性デバイス Active JP7803463B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023093163 2023-06-06
JP2023093163 2023-06-06
PCT/JP2024/019490 WO2024252979A1 (ja) 2023-06-06 2024-05-28 伸縮性デバイス

Publications (3)

Publication Number Publication Date
JPWO2024252979A1 JPWO2024252979A1 (https=) 2024-12-12
JPWO2024252979A5 JPWO2024252979A5 (https=) 2025-06-24
JP7803463B2 true JP7803463B2 (ja) 2026-01-21

Family

ID=93795973

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025518024A Active JP7803463B2 (ja) 2023-06-06 2024-05-28 伸縮性デバイス

Country Status (4)

Country Link
US (1) US20250301569A1 (https=)
JP (1) JP7803463B2 (https=)
CN (1) CN120323089A (https=)
WO (1) WO2024252979A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008243989A (ja) 2007-03-26 2008-10-09 Arisawa Mfg Co Ltd フレキシブルプリント配線板及び該フレキシブルプリント配線板を用いたスライド式携帯電話端末
CN109439231A (zh) 2018-11-09 2019-03-08 吉林大学 一种基于碳材料/杂多酸/氨基酸的复合水基导电胶及其制备方法
WO2020189790A1 (ja) 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2022004504A1 (ja) 2020-06-30 2022-01-06 株式会社村田製作所 積層基板

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3904100B2 (ja) * 1997-07-18 2007-04-11 日立化成工業株式会社 多層配線板

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008243989A (ja) 2007-03-26 2008-10-09 Arisawa Mfg Co Ltd フレキシブルプリント配線板及び該フレキシブルプリント配線板を用いたスライド式携帯電話端末
CN109439231A (zh) 2018-11-09 2019-03-08 吉林大学 一种基于碳材料/杂多酸/氨基酸的复合水基导电胶及其制备方法
WO2020189790A1 (ja) 2019-03-20 2020-09-24 大日本印刷株式会社 配線基板及び配線基板の製造方法
WO2022004504A1 (ja) 2020-06-30 2022-01-06 株式会社村田製作所 積層基板

Also Published As

Publication number Publication date
JPWO2024252979A1 (https=) 2024-12-12
US20250301569A1 (en) 2025-09-25
WO2024252979A1 (ja) 2024-12-12
CN120323089A (zh) 2025-07-15

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