CN120323089A - 伸缩性设备 - Google Patents
伸缩性设备Info
- Publication number
- CN120323089A CN120323089A CN202480005236.6A CN202480005236A CN120323089A CN 120323089 A CN120323089 A CN 120323089A CN 202480005236 A CN202480005236 A CN 202480005236A CN 120323089 A CN120323089 A CN 120323089A
- Authority
- CN
- China
- Prior art keywords
- stretchable
- elastic modulus
- wiring
- base material
- ratio
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0283—Stretchable printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/09—Use of materials for the conductive, e.g. metallic pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0104—Properties and characteristics in general
- H05K2201/0133—Elastomeric or compliant polymer
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023-093163 | 2023-06-06 | ||
| JP2023093163 | 2023-06-06 | ||
| PCT/JP2024/019490 WO2024252979A1 (ja) | 2023-06-06 | 2024-05-28 | 伸縮性デバイス |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN120323089A true CN120323089A (zh) | 2025-07-15 |
Family
ID=93795973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202480005236.6A Pending CN120323089A (zh) | 2023-06-06 | 2024-05-28 | 伸缩性设备 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250301569A1 (https=) |
| JP (1) | JP7803463B2 (https=) |
| CN (1) | CN120323089A (https=) |
| WO (1) | WO2024252979A1 (https=) |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3904100B2 (ja) * | 1997-07-18 | 2007-04-11 | 日立化成工業株式会社 | 多層配線板 |
| JP4340301B2 (ja) * | 2007-03-26 | 2009-10-07 | 株式会社有沢製作所 | フレキシブルプリント配線板及び該フレキシブルプリント配線板を用いたスライド式携帯電話端末 |
| CN109439231B (zh) * | 2018-11-09 | 2020-10-30 | 吉林大学 | 一种基于碳材料/杂多酸/氨基酸的复合水基导电胶及其制备方法 |
| WO2020189790A1 (ja) * | 2019-03-20 | 2020-09-24 | 大日本印刷株式会社 | 配線基板及び配線基板の製造方法 |
| JPWO2022004504A1 (https=) * | 2020-06-30 | 2022-01-06 |
-
2024
- 2024-05-28 CN CN202480005236.6A patent/CN120323089A/zh active Pending
- 2024-05-28 JP JP2025518024A patent/JP7803463B2/ja active Active
- 2024-05-28 WO PCT/JP2024/019490 patent/WO2024252979A1/ja not_active Ceased
-
2025
- 2025-06-04 US US19/227,713 patent/US20250301569A1/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JPWO2024252979A1 (https=) | 2024-12-12 |
| US20250301569A1 (en) | 2025-09-25 |
| JP7803463B2 (ja) | 2026-01-21 |
| WO2024252979A1 (ja) | 2024-12-12 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination |