JP7792897B2 - 基板処理装置 - Google Patents

基板処理装置

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Publication number
JP7792897B2
JP7792897B2 JP2022516755A JP2022516755A JP7792897B2 JP 7792897 B2 JP7792897 B2 JP 7792897B2 JP 2022516755 A JP2022516755 A JP 2022516755A JP 2022516755 A JP2022516755 A JP 2022516755A JP 7792897 B2 JP7792897 B2 JP 7792897B2
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JP
Japan
Prior art keywords
transport
cassette
chamber
transport carrier
interchangeable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022516755A
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English (en)
Japanese (ja)
Other versions
JP2022551815A5 (https=
JP2022551815A (ja
Inventor
クルピシェフ、アレクサンダー
シャーロック、リー
バッブス、ダニエル
メイ、ロバート
Original Assignee
ブルックス オートメーション ユーエス、エルエルシー
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Application filed by ブルックス オートメーション ユーエス、エルエルシー filed Critical ブルックス オートメーション ユーエス、エルエルシー
Publication of JP2022551815A publication Critical patent/JP2022551815A/ja
Publication of JP2022551815A5 publication Critical patent/JP2022551815A5/ja
Application granted granted Critical
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Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
JP2022516755A 2019-06-14 2020-06-15 基板処理装置 Active JP7792897B2 (ja)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US201962861543P 2019-06-14 2019-06-14
US62/861,543 2019-06-14
US16/899,151 US20200395232A1 (en) 2019-06-14 2020-06-11 Substrate process apparatus
US16/899,151 2020-06-11
PCT/US2020/037788 WO2020252476A2 (en) 2019-06-14 2020-06-15 Substrate process apparatus

Publications (3)

Publication Number Publication Date
JP2022551815A JP2022551815A (ja) 2022-12-14
JP2022551815A5 JP2022551815A5 (https=) 2023-02-10
JP7792897B2 true JP7792897B2 (ja) 2025-12-26

Family

ID=73745656

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022516755A Active JP7792897B2 (ja) 2019-06-14 2020-06-15 基板処理装置

Country Status (5)

Country Link
US (1) US20200395232A1 (https=)
EP (1) EP3984061A4 (https=)
JP (1) JP7792897B2 (https=)
TW (1) TWI881983B (https=)
WO (1) WO2020252476A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024511280A (ja) 2021-02-22 2024-03-13 エヴァテック・アーゲー 真空処理装置および真空処理された基板を製造する方法
KR102305139B1 (ko) * 2021-02-24 2021-09-28 피에스케이 주식회사 로드락 챔버 및 기판 처리 장치
US11794314B2 (en) 2021-08-30 2023-10-24 Kla Corporation Quick swap chuck with vacuum holding interchangeable top plate
TWI814434B (zh) * 2022-04-01 2023-09-01 友達光電股份有限公司 發光二極體陣列基板
CN114823426B (zh) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 半导体工艺设备
TWI909307B (zh) * 2024-01-11 2025-12-21 大陸商江蘇智芯達科技有限公司 基板蒸鍍系統
CN120727607A (zh) * 2024-03-29 2025-09-30 盛美半导体设备(上海)股份有限公司 装载腔及半导体设备

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093956A (ja) 1999-09-20 2001-04-06 Hitachi Ltd 試料搬送装置
JP2005093807A (ja) 2003-09-18 2005-04-07 Hitachi Kokusai Electric Inc 半導体製造装置
JP2006501632A (ja) 2001-12-04 2006-01-12 ブルックス オートメーション インコーポレイテッド 独立して変更可能な一体的なロードロックを有する基板処理装置
JP2011054933A (ja) 2009-08-07 2011-03-17 Tokyo Electron Ltd 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
JP2012216614A (ja) 2011-03-31 2012-11-08 Tokyo Electron Ltd 基板処理装置
JP2016525281A (ja) 2013-07-08 2016-08-22 ブルックス オートメーション インコーポレイテッド オンザフライ基板センタリングを含む処理装置
JP2017028158A (ja) 2015-07-24 2017-02-02 東京エレクトロン株式会社 ロードロック装置、及び基板処理システム
JP2017098540A (ja) 2015-10-22 2017-06-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 正面開口式リングポッド
JP2019012834A (ja) 2007-05-18 2019-01-24 ブルックス オートメーション インコーポレイテッド 半導体処理ツール
US20190105770A1 (en) 2017-10-05 2019-04-11 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
JP3676983B2 (ja) * 2000-03-29 2005-07-27 株式会社日立国際電気 半導体製造方法、基板処理方法、及び半導体製造装置
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
KR20070044310A (ko) * 2005-10-24 2007-04-27 삼성전자주식회사 반도체 소자 제조 설비
KR100702844B1 (ko) * 2005-11-14 2007-04-03 삼성전자주식회사 로드락 챔버 및 그를 이용한 반도체 제조설비
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
US20080276867A1 (en) * 2007-05-09 2008-11-13 Jason Schaller Transfer chamber with vacuum extension for shutter disks
JP5543336B2 (ja) * 2007-05-18 2014-07-09 ブルックス オートメーション インコーポレイテッド 高速スワップロボット付コンパクト基板搬送システム
WO2013033289A1 (en) * 2011-09-02 2013-03-07 Brooks Automation, Inc. Time-optimal trajectories for robotic transfer devices
JP2015076458A (ja) * 2013-10-08 2015-04-20 株式会社日立ハイテクノロジーズ 真空処理装置
JP6454201B2 (ja) * 2015-03-26 2019-01-16 東京エレクトロン株式会社 基板搬送方法及び基板処理装置

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093956A (ja) 1999-09-20 2001-04-06 Hitachi Ltd 試料搬送装置
JP2006501632A (ja) 2001-12-04 2006-01-12 ブルックス オートメーション インコーポレイテッド 独立して変更可能な一体的なロードロックを有する基板処理装置
JP2005093807A (ja) 2003-09-18 2005-04-07 Hitachi Kokusai Electric Inc 半導体製造装置
JP2019012834A (ja) 2007-05-18 2019-01-24 ブルックス オートメーション インコーポレイテッド 半導体処理ツール
JP2011054933A (ja) 2009-08-07 2011-03-17 Tokyo Electron Ltd 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
JP2012216614A (ja) 2011-03-31 2012-11-08 Tokyo Electron Ltd 基板処理装置
JP2016525281A (ja) 2013-07-08 2016-08-22 ブルックス オートメーション インコーポレイテッド オンザフライ基板センタリングを含む処理装置
JP2017028158A (ja) 2015-07-24 2017-02-02 東京エレクトロン株式会社 ロードロック装置、及び基板処理システム
JP2017098540A (ja) 2015-10-22 2017-06-01 ラム リサーチ コーポレーションＬａｍ Ｒｅｓｅａｒｃｈ Ｃｏｒｐｏｒａｔｉｏｎ 正面開口式リングポッド
US20190105770A1 (en) 2017-10-05 2019-04-11 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough

Also Published As

Publication number Publication date
WO2020252476A3 (en) 2021-02-04
EP3984061A2 (en) 2022-04-20
EP3984061A4 (en) 2023-08-16
JP2022551815A (ja) 2022-12-14
WO2020252476A2 (en) 2020-12-17
US20200395232A1 (en) 2020-12-17
TWI881983B (zh) 2025-05-01
TW202114027A (zh) 2021-04-01

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