TWI881983B - 基板處理裝置 - Google Patents

基板處理裝置 Download PDF

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Publication number
TWI881983B
TWI881983B TW109119899A TW109119899A TWI881983B TW I881983 B TWI881983 B TW I881983B TW 109119899 A TW109119899 A TW 109119899A TW 109119899 A TW109119899 A TW 109119899A TW I881983 B TWI881983 B TW I881983B
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TW
Taiwan
Prior art keywords
interchangeable
processing
chamber
transport
transport carrier
Prior art date
Application number
TW109119899A
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English (en)
Chinese (zh)
Other versions
TW202114027A (zh
Inventor
亞力山大 庫魯比雪
里夫 沙拉克
丹尼爾 巴比斯
羅伯特 梅
Original Assignee
美商布魯克斯自動機械美國公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Application filed by 美商布魯克斯自動機械美國公司 filed Critical 美商布魯克斯自動機械美國公司
Publication of TW202114027A publication Critical patent/TW202114027A/zh
Application granted granted Critical
Publication of TWI881983B publication Critical patent/TWI881983B/zh

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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0466—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0441—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0452—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the layout of the process chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0462—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the construction of the processing chambers, e.g. modular processing chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/33—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations into and out of processing chamber
    • H10P72/3302—Mechanical parts of transfer devices

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Engineering & Computer Science (AREA)
  • Robotics (AREA)
TW109119899A 2019-06-14 2020-06-12 基板處理裝置 TWI881983B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US201962861543P 2019-06-14 2019-06-14
US62/861,543 2019-06-14

Publications (2)

Publication Number Publication Date
TW202114027A TW202114027A (zh) 2021-04-01
TWI881983B true TWI881983B (zh) 2025-05-01

Family

ID=73745656

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109119899A TWI881983B (zh) 2019-06-14 2020-06-12 基板處理裝置

Country Status (5)

Country Link
US (1) US20200395232A1 (https=)
EP (1) EP3984061A4 (https=)
JP (1) JP7792897B2 (https=)
TW (1) TWI881983B (https=)
WO (1) WO2020252476A2 (https=)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024511280A (ja) 2021-02-22 2024-03-13 エヴァテック・アーゲー 真空処理装置および真空処理された基板を製造する方法
KR102305139B1 (ko) * 2021-02-24 2021-09-28 피에스케이 주식회사 로드락 챔버 및 기판 처리 장치
US11794314B2 (en) 2021-08-30 2023-10-24 Kla Corporation Quick swap chuck with vacuum holding interchangeable top plate
TWI814434B (zh) * 2022-04-01 2023-09-01 友達光電股份有限公司 發光二極體陣列基板
CN114823426B (zh) * 2022-05-26 2023-04-14 北京北方华创微电子装备有限公司 半导体工艺设备
TWI909307B (zh) * 2024-01-11 2025-12-21 大陸商江蘇智芯達科技有限公司 基板蒸鍍系統
CN120727607A (zh) * 2024-03-29 2025-09-30 盛美半导体设备(上海)股份有限公司 装载腔及半导体设备

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070107598A1 (en) * 2005-11-14 2007-05-17 Jin-Goo Lee Load-lock and semiconductor device manufacturing equipment comprising the same
US20170025290A1 (en) * 2015-07-24 2017-01-26 Tokyo Electron Limited Load lock apparatus and substrate processing system

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001093956A (ja) * 1999-09-20 2001-04-06 Hitachi Ltd 試料搬送装置
US6949143B1 (en) * 1999-12-15 2005-09-27 Applied Materials, Inc. Dual substrate loadlock process equipment
JP3676983B2 (ja) * 2000-03-29 2005-07-27 株式会社日立国際電気 半導体製造方法、基板処理方法、及び半導体製造装置
US6719517B2 (en) * 2001-12-04 2004-04-13 Brooks Automation Substrate processing apparatus with independently configurable integral load locks
US7959395B2 (en) * 2002-07-22 2011-06-14 Brooks Automation, Inc. Substrate processing apparatus
JP2005093807A (ja) * 2003-09-18 2005-04-07 Hitachi Kokusai Electric Inc 半導体製造装置
US7458763B2 (en) * 2003-11-10 2008-12-02 Blueshift Technologies, Inc. Mid-entry load lock for semiconductor handling system
KR20070044310A (ko) * 2005-10-24 2007-04-27 삼성전자주식회사 반도체 소자 제조 설비
US8398355B2 (en) * 2006-05-26 2013-03-19 Brooks Automation, Inc. Linearly distributed semiconductor workpiece processing tool
US20080276867A1 (en) * 2007-05-09 2008-11-13 Jason Schaller Transfer chamber with vacuum extension for shutter disks
JP5543336B2 (ja) * 2007-05-18 2014-07-09 ブルックス オートメーション インコーポレイテッド 高速スワップロボット付コンパクト基板搬送システム
US8272825B2 (en) * 2007-05-18 2012-09-25 Brooks Automation, Inc. Load lock fast pump vent
JP5650935B2 (ja) * 2009-08-07 2015-01-07 東京エレクトロン株式会社 基板処理装置及び位置決め方法並びにフォーカスリング配置方法
JP6003011B2 (ja) * 2011-03-31 2016-10-05 東京エレクトロン株式会社 基板処理装置
WO2013033289A1 (en) * 2011-09-02 2013-03-07 Brooks Automation, Inc. Time-optimal trajectories for robotic transfer devices
TWI623994B (zh) * 2013-07-08 2018-05-11 布魯克斯自動機械公司 具有即時基板定心的處理裝置
JP2015076458A (ja) * 2013-10-08 2015-04-20 株式会社日立ハイテクノロジーズ 真空処理装置
JP6454201B2 (ja) * 2015-03-26 2019-01-16 東京エレクトロン株式会社 基板搬送方法及び基板処理装置
US9881820B2 (en) * 2015-10-22 2018-01-30 Lam Research Corporation Front opening ring pod
US11020852B2 (en) * 2017-10-05 2021-06-01 Brooks Automation, Inc. Substrate transport apparatus with independent accessory feedthrough

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20070107598A1 (en) * 2005-11-14 2007-05-17 Jin-Goo Lee Load-lock and semiconductor device manufacturing equipment comprising the same
US20170025290A1 (en) * 2015-07-24 2017-01-26 Tokyo Electron Limited Load lock apparatus and substrate processing system

Also Published As

Publication number Publication date
WO2020252476A3 (en) 2021-02-04
JP7792897B2 (ja) 2025-12-26
EP3984061A2 (en) 2022-04-20
EP3984061A4 (en) 2023-08-16
JP2022551815A (ja) 2022-12-14
WO2020252476A2 (en) 2020-12-17
US20200395232A1 (en) 2020-12-17
TW202114027A (zh) 2021-04-01

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