JP7789752B2 - 電磁波ノイズ抑制シートの製造方法 - Google Patents

電磁波ノイズ抑制シートの製造方法

Info

Publication number
JP7789752B2
JP7789752B2 JP2023506682A JP2023506682A JP7789752B2 JP 7789752 B2 JP7789752 B2 JP 7789752B2 JP 2023506682 A JP2023506682 A JP 2023506682A JP 2023506682 A JP2023506682 A JP 2023506682A JP 7789752 B2 JP7789752 B2 JP 7789752B2
Authority
JP
Japan
Prior art keywords
noise suppression
electromagnetic noise
layer
dispersion
cnt
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023506682A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022195867A1 (https=
JPWO2022195867A5 (https=
Inventor
英秋 込山
篤 田村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hokuetsu Corp
Original Assignee
Hokuetsu Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hokuetsu Corp filed Critical Hokuetsu Corp
Publication of JPWO2022195867A1 publication Critical patent/JPWO2022195867A1/ja
Publication of JPWO2022195867A5 publication Critical patent/JPWO2022195867A5/ja
Application granted granted Critical
Publication of JP7789752B2 publication Critical patent/JP7789752B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073—Shielding materials
    • H05K9/0081—Electromagnetic shielding materials, e.g. EMI, RFI shielding
    • H05K9/009—Electromagnetic shielding materials, e.g. EMI, RFI shielding comprising electro-conductive fibres, e.g. metal fibres, carbon fibres, metallised textile fibres, electro-conductive mesh, woven, non-woven mat, fleece, cross-linked
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B32/00—Carbon; Compounds thereof
    • C01B32/15—Nano-sized carbon materials
    • C01B32/158—Carbon nanotubes
    • C01B32/168—After-treatment
    • C01B32/174—Derivatisation; Solubilisation; Dispersion in solvents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
    • H05K7/20472—Sheet interfaces
    • H05K7/20481—Sheet interfaces characterised by the material composition exhibiting specific thermal properties
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B2202/00—Structure or properties of carbon nanotubes
    • C01B2202/06—Multi-walled nanotubes

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Nanotechnology (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Inorganic Chemistry (AREA)
  • Textile Engineering (AREA)
  • Thermal Sciences (AREA)
  • Laminated Bodies (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
JP2023506682A 2021-03-19 2021-03-19 電磁波ノイズ抑制シートの製造方法 Active JP7789752B2 (ja)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/011466 WO2022195867A1 (ja) 2021-03-19 2021-03-19 電磁波ノイズ抑制シートおよびその製造方法

Publications (3)

Publication Number Publication Date
JPWO2022195867A1 JPWO2022195867A1 (https=) 2022-09-22
JPWO2022195867A5 JPWO2022195867A5 (https=) 2024-01-16
JP7789752B2 true JP7789752B2 (ja) 2025-12-22

Family

ID=83322105

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2023506682A Active JP7789752B2 (ja) 2021-03-19 2021-03-19 電磁波ノイズ抑制シートの製造方法

Country Status (7)

Country Link
US (1) US20240306357A1 (https=)
EP (1) EP4311385A4 (https=)
JP (1) JP7789752B2 (https=)
KR (1) KR20230154059A (https=)
CN (1) CN116982419A (https=)
TW (1) TWI793561B (https=)
WO (1) WO2022195867A1 (https=)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189901A (ja) 2007-01-11 2008-08-21 Honda Motor Co Ltd 熱輸送流体およびその製造方法
JP2013199419A (ja) 2012-02-23 2013-10-03 Toray Ind Inc カーボンナノチューブ分散液
WO2016136428A1 (ja) 2015-02-25 2016-09-01 東レ株式会社 カーボンナノチューブ分散液および導電性フィルムの製造方法
WO2018180350A1 (ja) 2017-03-31 2018-10-04 日本ゼオン株式会社 繊維状炭素ナノ構造体分散液の製造方法および繊維状炭素ナノ構造体分散液

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101487273B1 (ko) * 2007-09-28 2015-01-28 도레이 카부시키가이샤 도전성 필름 및 그 제조 방법
TWI515165B (zh) * 2010-10-29 2016-01-01 東麗股份有限公司 碳奈米管集合體分散液之製造方法
JP2012174833A (ja) 2011-02-21 2012-09-10 Kj Specialty Paper Co Ltd 電磁波吸収シート
CN103858183A (zh) * 2011-09-29 2014-06-11 国立大学法人九州大学 透明导电体及其制造方法
RU2572840C2 (ru) * 2014-05-22 2016-01-20 Мсд Текнолоджис Частная Компания С Ограниченной Ответственностью Металлическая фольга с проводящим слоем и способ ее изготовления
US11235560B2 (en) * 2015-12-25 2022-02-01 Zeon Corporation Electromagnetic wave absorption material and electromagnetic wave absorber

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2008189901A (ja) 2007-01-11 2008-08-21 Honda Motor Co Ltd 熱輸送流体およびその製造方法
JP2013199419A (ja) 2012-02-23 2013-10-03 Toray Ind Inc カーボンナノチューブ分散液
WO2016136428A1 (ja) 2015-02-25 2016-09-01 東レ株式会社 カーボンナノチューブ分散液および導電性フィルムの製造方法
WO2018180350A1 (ja) 2017-03-31 2018-10-04 日本ゼオン株式会社 繊維状炭素ナノ構造体分散液の製造方法および繊維状炭素ナノ構造体分散液

Also Published As

Publication number Publication date
TW202237713A (zh) 2022-10-01
WO2022195867A1 (ja) 2022-09-22
CN116982419A (zh) 2023-10-31
TWI793561B (zh) 2023-02-21
US20240306357A1 (en) 2024-09-12
EP4311385A4 (en) 2025-01-01
KR20230154059A (ko) 2023-11-07
EP4311385A1 (en) 2024-01-24
JPWO2022195867A1 (https=) 2022-09-22

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