JP7775285B2 - 冷却装置、および電子機器システム - Google Patents

冷却装置、および電子機器システム

Info

Publication number
JP7775285B2
JP7775285B2 JP2023508739A JP2023508739A JP7775285B2 JP 7775285 B2 JP7775285 B2 JP 7775285B2 JP 2023508739 A JP2023508739 A JP 2023508739A JP 2023508739 A JP2023508739 A JP 2023508739A JP 7775285 B2 JP7775285 B2 JP 7775285B2
Authority
JP
Japan
Prior art keywords
cooling device
electronic device
cooling
mounting surface
fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023508739A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022201883A1 (https=
JPWO2022201883A5 (https=
Inventor
優太 渡邉
美宏 林
信陽 鈴木
亘平 粟津
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujifilm Corp
Original Assignee
Fujifilm Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujifilm Corp filed Critical Fujifilm Corp
Publication of JPWO2022201883A1 publication Critical patent/JPWO2022201883A1/ja
Publication of JPWO2022201883A5 publication Critical patent/JPWO2022201883A5/ja
Priority to JP2025187325A priority Critical patent/JP2026016766A/ja
Application granted granted Critical
Publication of JP7775285B2 publication Critical patent/JP7775285B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/55—Details of cameras or camera bodies; Accessories therefor with provision for heating or cooling, e.g. in aircraft
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03B—APPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00—Details of cameras or camera bodies; Accessories therefor
    • G03B17/56—Accessories
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/52—Elements optimising image sensor operation, e.g. for electromagnetic interference [EMI] protection or temperature control by heat transfer or cooling elements
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/50—Constructional details
    • H04N23/53—Constructional details of electronic viewfinders, e.g. rotatable or detachable
    • H04N23/531—Constructional details of electronic viewfinders, e.g. rotatable or detachable being rotatable or detachable
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57—Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20154—Heat dissipaters coupled to components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/40—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids
    • H10W40/43—Arrangements for thermal protection or thermal control involving heat exchange by flowing fluids by flowing gases, e.g. forced air cooling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/202—Air circulating in closed loop within enclosure wherein heat is removed through heat-exchangers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Signal Processing (AREA)
  • Multimedia (AREA)
  • General Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Thermal Sciences (AREA)
  • Electromagnetism (AREA)
  • Aviation & Aerospace Engineering (AREA)
  • Studio Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Indication In Cameras, And Counting Of Exposures (AREA)
  • Accessories Of Cameras (AREA)
JP2023508739A 2021-03-25 2022-02-01 冷却装置、および電子機器システム Active JP7775285B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025187325A JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2021051662 2021-03-25
JP2021051662 2021-03-25
PCT/JP2022/003879 WO2022201883A1 (ja) 2021-03-25 2022-02-01 冷却装置、および電子機器システム

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025187325A Division JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Publications (3)

Publication Number Publication Date
JPWO2022201883A1 JPWO2022201883A1 (https=) 2022-09-29
JPWO2022201883A5 JPWO2022201883A5 (https=) 2023-12-21
JP7775285B2 true JP7775285B2 (ja) 2025-11-25

Family

ID=83396813

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023508739A Active JP7775285B2 (ja) 2021-03-25 2022-02-01 冷却装置、および電子機器システム
JP2025187325A Pending JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025187325A Pending JP2026016766A (ja) 2021-03-25 2025-11-06 冷却装置、および電子機器システム

Country Status (3)

Country Link
US (2) US12449721B2 (https=)
JP (2) JP7775285B2 (https=)
WO (1) WO2022201883A1 (https=)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2024090237A (ja) 2022-12-22 2024-07-04 キヤノン株式会社 制御装置、撮像装置、制御方法及びプログラム
JP2025051187A (ja) * 2023-09-25 2025-04-04 パナソニックＩｐマネジメント株式会社 撮像装置および放熱ユニット
JP2025159544A (ja) * 2024-04-08 2025-10-21 キヤノン株式会社 電子機器、冷却装置、および電子機器システム

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180706A (ja) 2005-12-27 2007-07-12 Sony Corp 撮像装置
JP2008277355A (ja) 2007-04-25 2008-11-13 Toshiba Corp 冷却装置および電子機器
JP2012173591A (ja) 2011-02-23 2012-09-10 Nikon Corp 電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2749506B2 (ja) 1994-01-20 1998-05-13 山洋電気株式会社 電子部品冷却装置
JP3255260B2 (ja) * 1994-12-01 2002-02-12 株式会社ピーエフユー ファン付きヒートシンク
JP3149847B2 (ja) * 1998-04-20 2001-03-26 富士通株式会社 ヒートシンク
JP2019114893A (ja) 2017-12-22 2019-07-11 キヤノン株式会社 撮像装置
JP2019219493A (ja) * 2018-06-19 2019-12-26 キヤノン株式会社 電子機器
US11190671B2 (en) * 2019-04-23 2021-11-30 Panasonic Intellectual Property Management Co., Ltd. Imaging apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180706A (ja) 2005-12-27 2007-07-12 Sony Corp 撮像装置
JP2008277355A (ja) 2007-04-25 2008-11-13 Toshiba Corp 冷却装置および電子機器
JP2012173591A (ja) 2011-02-23 2012-09-10 Nikon Corp 電子機器

Also Published As

Publication number Publication date
WO2022201883A1 (ja) 2022-09-29
JP2026016766A (ja) 2026-02-03
US20230418137A1 (en) 2023-12-28
JPWO2022201883A1 (https=) 2022-09-29
US12449721B2 (en) 2025-10-21
US20260010058A1 (en) 2026-01-08

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