JP7768127B2 - はんだ粒子、はんだ粒子の製造方法及びはんだ粒子付き基体 - Google Patents

はんだ粒子、はんだ粒子の製造方法及びはんだ粒子付き基体

Info

Publication number
JP7768127B2
JP7768127B2 JP2022514090A JP2022514090A JP7768127B2 JP 7768127 B2 JP7768127 B2 JP 7768127B2 JP 2022514090 A JP2022514090 A JP 2022514090A JP 2022514090 A JP2022514090 A JP 2022514090A JP 7768127 B2 JP7768127 B2 JP 7768127B2
Authority
JP
Japan
Prior art keywords
solder
solder particles
solder layer
protrusions
alloy
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022514090A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2021206096A1 (https=
Inventor
勝将 宮地
芳則 江尻
邦彦 赤井
純一 欠畑
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Showa Denko Materials Co Ltd
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd, Showa Denko Materials Co Ltd, Resonac Corp filed Critical Hitachi Chemical Co Ltd
Publication of JPWO2021206096A1 publication Critical patent/JPWO2021206096A1/ja
Application granted granted Critical
Publication of JP7768127B2 publication Critical patent/JP7768127B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
JP2022514090A 2020-04-06 2021-04-06 はんだ粒子、はんだ粒子の製造方法及びはんだ粒子付き基体 Active JP7768127B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068390 2020-04-06
JP2020068390 2020-04-06
PCT/JP2021/014656 WO2021206096A1 (ja) 2020-04-06 2021-04-06 はんだ粒子、はんだ粒子の製造方法及びはんだ粒子付き基体

Publications (2)

Publication Number Publication Date
JPWO2021206096A1 JPWO2021206096A1 (https=) 2021-10-14
JP7768127B2 true JP7768127B2 (ja) 2025-11-12

Family

ID=78023564

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022514090A Active JP7768127B2 (ja) 2020-04-06 2021-04-06 はんだ粒子、はんだ粒子の製造方法及びはんだ粒子付き基体

Country Status (3)

Country Link
JP (1) JP7768127B2 (https=)
CN (1) CN115362044B (https=)
WO (1) WO2021206096A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116900542B (zh) * 2023-04-27 2024-07-19 深圳市朝日电子材料有限公司 一种复合型无铅锡条及其制备方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001526001A (ja) 1997-05-23 2001-12-11 ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー パターン成形された半田バンプアレイの製造方法
US20020192936A1 (en) 1999-02-24 2002-12-19 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
JP2004526309A (ja) 2001-02-08 2004-08-26 インターナショナル・ビジネス・マシーンズ・コーポレーション 電子構造体の形成方法
JP2011088198A (ja) 2009-09-01 2011-05-06 Dowa Holdings Co Ltd はんだ粉及びはんだ粉の製造方法
WO2012066664A1 (ja) 2010-11-18 2012-05-24 Ｄｏｗａホールディングス株式会社 はんだ粉及びはんだ粉の製造方法
WO2020004511A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 はんだ粒子及びはんだ粒子の製造方法
WO2020004510A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411602A (en) * 1994-02-17 1995-05-02 Microfab Technologies, Inc. Solder compositions and methods of making same
US5960307A (en) * 1996-11-27 1999-09-28 Texas Instruments Incorporated Method of forming ball grid array contacts
JP4949281B2 (ja) * 2007-01-24 2012-06-06 日本特殊陶業株式会社 部品付き配線基板の製造方法
JP2012104807A (ja) * 2010-10-12 2012-05-31 Yaskawa Electric Corp 電子装置及び電子部品
US9330998B2 (en) * 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001526001A (ja) 1997-05-23 2001-12-11 ミネソタ・マイニング・アンド・マニュファクチャリング・カンパニー パターン成形された半田バンプアレイの製造方法
US20020192936A1 (en) 1999-02-24 2002-12-19 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
JP2004526309A (ja) 2001-02-08 2004-08-26 インターナショナル・ビジネス・マシーンズ・コーポレーション 電子構造体の形成方法
JP2011088198A (ja) 2009-09-01 2011-05-06 Dowa Holdings Co Ltd はんだ粉及びはんだ粉の製造方法
WO2012066664A1 (ja) 2010-11-18 2012-05-24 Ｄｏｗａホールディングス株式会社 はんだ粉及びはんだ粉の製造方法
WO2020004511A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 はんだ粒子及びはんだ粒子の製造方法
WO2020004510A1 (ja) 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法

Also Published As

Publication number Publication date
TW202146679A (zh) 2021-12-16
WO2021206096A1 (ja) 2021-10-14
CN115362044A (zh) 2022-11-18
CN115362044B (zh) 2025-10-28
JPWO2021206096A1 (https=) 2021-10-14

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