CN115362044B - 焊料粒子、焊料粒子的制造方法及带焊料粒子的基体 - Google Patents

焊料粒子、焊料粒子的制造方法及带焊料粒子的基体

Info

Publication number
CN115362044B
CN115362044B CN202180026545.8A CN202180026545A CN115362044B CN 115362044 B CN115362044 B CN 115362044B CN 202180026545 A CN202180026545 A CN 202180026545A CN 115362044 B CN115362044 B CN 115362044B
Authority
CN
China
Prior art keywords
solder
solder particles
alloy
solder layer
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202180026545.8A
Other languages
English (en)
Chinese (zh)
Other versions
CN115362044A (zh
Inventor
宫地胜将
江尻芳则
赤井邦彦
欠畑纯一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Holdings Corp
Resonac Corp
Original Assignee
Showa Denko KK
Resonac Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Showa Denko KK, Resonac Corp filed Critical Showa Denko KK
Publication of CN115362044A publication Critical patent/CN115362044A/zh
Application granted granted Critical
Publication of CN115362044B publication Critical patent/CN115362044B/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/06—Making metallic powder or suspensions thereof using physical processes starting from liquid material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/30—Selection of soldering or welding materials proper with the principal constituent melting at less than 1550°C
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/40—Making wire or rods for soldering or welding
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C12/00—Alloys based on antimony or bismuth
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C28/00—Alloys based on a metal not provided for in groups C22C5/00 - C22C27/00
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C5/00—Alloys based on noble metals
    • C22C5/02—Alloys based on gold

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Powder Metallurgy (AREA)
CN202180026545.8A 2020-04-06 2021-04-06 焊料粒子、焊料粒子的制造方法及带焊料粒子的基体 Active CN115362044B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020068390 2020-04-06
JP2020-068390 2020-04-06
PCT/JP2021/014656 WO2021206096A1 (ja) 2020-04-06 2021-04-06 はんだ粒子、はんだ粒子の製造方法及びはんだ粒子付き基体

Publications (2)

Publication Number Publication Date
CN115362044A CN115362044A (zh) 2022-11-18
CN115362044B true CN115362044B (zh) 2025-10-28

Family

ID=78023564

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202180026545.8A Active CN115362044B (zh) 2020-04-06 2021-04-06 焊料粒子、焊料粒子的制造方法及带焊料粒子的基体

Country Status (3)

Country Link
JP (1) JP7768127B2 (https=)
CN (1) CN115362044B (https=)
WO (1) WO2021206096A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116900542B (zh) * 2023-04-27 2024-07-19 深圳市朝日电子材料有限公司 一种复合型无铅锡条及其制备方法

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276760A (zh) * 2007-01-24 2008-10-01 日本特殊陶业株式会社 具有焊料突起的布线基板的制造方法、布线基板
WO2020004510A1 (ja) * 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5411602A (en) * 1994-02-17 1995-05-02 Microfab Technologies, Inc. Solder compositions and methods of making same
US5960307A (en) * 1996-11-27 1999-09-28 Texas Instruments Incorporated Method of forming ball grid array contacts
US6000603A (en) * 1997-05-23 1999-12-14 3M Innovative Properties Company Patterned array of metal balls and methods of making
US6426564B1 (en) * 1999-02-24 2002-07-30 Micron Technology, Inc. Recessed tape and method for forming a BGA assembly
US6784086B2 (en) * 2001-02-08 2004-08-31 International Business Machines Corporation Lead-free solder structure and method for high fatigue life
JP5478193B2 (ja) * 2009-09-01 2014-04-23 Ｄｏｗａホールディングス株式会社 はんだ粉の製造方法
JP2012104807A (ja) * 2010-10-12 2012-05-31 Yaskawa Electric Corp 電子装置及び電子部品
EP2641676B1 (en) * 2010-11-18 2019-02-27 Dowa Holdings Co., Ltd. Process for producing solder powder
US9330998B2 (en) * 2014-04-18 2016-05-03 Laird Technologies, Inc. Thermal interface material assemblies and related methods
TWI886097B (zh) * 2018-06-26 2025-06-11 日商力森諾科股份有限公司 焊料粒及焊料粒的製造方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101276760A (zh) * 2007-01-24 2008-10-01 日本特殊陶业株式会社 具有焊料突起的布线基板的制造方法、布线基板
WO2020004510A1 (ja) * 2018-06-26 2020-01-02 日立化成株式会社 異方性導電フィルム及びその製造方法並びに接続構造体の製造方法

Also Published As

Publication number Publication date
TW202146679A (zh) 2021-12-16
WO2021206096A1 (ja) 2021-10-14
CN115362044A (zh) 2022-11-18
JP7768127B2 (ja) 2025-11-12
JPWO2021206096A1 (https=) 2021-10-14

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Address after: Tokyo, Japan

Applicant after: Lishennoco Co.,Ltd.

Address before: Tokyo, Japan

Applicant before: Showa electrical materials Co.,Ltd.

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