JP7756109B2 - 表示装置の製造装置 - Google Patents

表示装置の製造装置

Info

Publication number
JP7756109B2
JP7756109B2 JP2022570762A JP2022570762A JP7756109B2 JP 7756109 B2 JP7756109 B2 JP 7756109B2 JP 2022570762 A JP2022570762 A JP 2022570762A JP 2022570762 A JP2022570762 A JP 2022570762A JP 7756109 B2 JP7756109 B2 JP 7756109B2
Authority
JP
Japan
Prior art keywords
cluster
substrate
light
equipment
load lock
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022570762A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2022137022A1 (https=
JPWO2022137022A5 (https=
Inventor
晋吾 江口
広樹 安達
健一 岡崎
靖正 山根
直人 楠本
健輔 吉住
舜平 山崎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Semiconductor Energy Laboratory Co Ltd
Original Assignee
Semiconductor Energy Laboratory Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Semiconductor Energy Laboratory Co Ltd filed Critical Semiconductor Energy Laboratory Co Ltd
Publication of JPWO2022137022A1 publication Critical patent/JPWO2022137022A1/ja
Publication of JPWO2022137022A5 publication Critical patent/JPWO2022137022A5/ja
Priority to JP2025168616A priority Critical patent/JP2025188123A/ja
Application granted granted Critical
Publication of JP7756109B2 publication Critical patent/JP7756109B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022570762A 2020-12-25 2021-12-15 表示装置の製造装置 Active JP7756109B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025168616A JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020216021 2020-12-25
JP2020216021 2020-12-25
PCT/IB2021/061730 WO2022137022A1 (ja) 2020-12-25 2021-12-15 表示装置の製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025168616A Division JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Publications (3)

Publication Number Publication Date
JPWO2022137022A1 JPWO2022137022A1 (https=) 2022-06-30
JPWO2022137022A5 JPWO2022137022A5 (https=) 2024-12-20
JP7756109B2 true JP7756109B2 (ja) 2025-10-17

Family

ID=82158882

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022570762A Active JP7756109B2 (ja) 2020-12-25 2021-12-15 表示装置の製造装置
JP2025168616A Pending JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025168616A Pending JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Country Status (3)

Country Link
US (1) US20240057462A1 (https=)
JP (2) JP7756109B2 (https=)
WO (1) WO2022137022A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102170A (ja) 1999-07-23 2001-04-13 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置の作製方法及び薄膜形成装置
JP2002158090A (ja) 2000-09-08 2002-05-31 Semiconductor Energy Lab Co Ltd 発光装置とその作製方法及び薄膜形成装置
JP2005285576A (ja) 2004-03-30 2005-10-13 Mitsubishi-Hitachi Metals Machinery Inc インライン式有機エレクトロルミネセンス製造装置
JP2017220410A (ja) 2016-06-10 2017-12-14 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
JP2018022619A (ja) 2016-08-04 2018-02-08 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
US9325007B2 (en) * 2009-10-27 2016-04-26 Applied Materials, Inc. Shadow mask alignment and management system
KR102141205B1 (ko) * 2013-08-16 2020-08-05 삼성디스플레이 주식회사 박막 봉지 제조 장치 및 이를 이용한 표시 장치의 제조 방법
KR102648517B1 (ko) * 2018-03-20 2024-03-15 도쿄엘렉트론가부시키가이샤 통합형 반도체 공정 모듈을 포함하는 자기 인식 및 보정 이종 플랫폼, 및 이를 사용하기 위한 방법
WO2022123381A1 (ja) * 2020-12-07 2022-06-16 株式会社半導体エネルギー研究所 発光デバイスの製造装置
US11860528B2 (en) * 2020-12-21 2024-01-02 Applied Materials, Inc. Multi-chamber substrate processing platform

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102170A (ja) 1999-07-23 2001-04-13 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置の作製方法及び薄膜形成装置
JP2002158090A (ja) 2000-09-08 2002-05-31 Semiconductor Energy Lab Co Ltd 発光装置とその作製方法及び薄膜形成装置
JP2005285576A (ja) 2004-03-30 2005-10-13 Mitsubishi-Hitachi Metals Machinery Inc インライン式有機エレクトロルミネセンス製造装置
JP2017220410A (ja) 2016-06-10 2017-12-14 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
JP2018022619A (ja) 2016-08-04 2018-02-08 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法

Also Published As

Publication number Publication date
US20240057462A1 (en) 2024-02-15
WO2022137022A1 (ja) 2022-06-30
JP2025188123A (ja) 2025-12-25
JPWO2022137022A1 (https=) 2022-06-30

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