JPWO2022137022A1 - - Google Patents

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Publication number
JPWO2022137022A1
JPWO2022137022A1 JP2022570762A JP2022570762A JPWO2022137022A1 JP WO2022137022 A1 JPWO2022137022 A1 JP WO2022137022A1 JP 2022570762 A JP2022570762 A JP 2022570762A JP 2022570762 A JP2022570762 A JP 2022570762A JP WO2022137022 A1 JPWO2022137022 A1 JP WO2022137022A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2022570762A
Other languages
Japanese (ja)
Other versions
JP7756109B2 (ja
JPWO2022137022A5 (https=
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2022137022A1 publication Critical patent/JPWO2022137022A1/ja
Publication of JPWO2022137022A5 publication Critical patent/JPWO2022137022A5/ja
Priority to JP2025168616A priority Critical patent/JP2025188123A/ja
Application granted granted Critical
Publication of JP7756109B2 publication Critical patent/JP7756109B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0005—Production of optical devices or components in so far as characterised by the lithographic processes or materials used therefor
    • G03F7/0007—Filters, e.g. additive colour filters; Components for display devices
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/54—Apparatus specially adapted for continuous coating
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
    • H05B33/00—Electroluminescent light sources
    • H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/10—Deposition of organic active material
    • H10K71/16—Deposition of organic active material using physical vapour deposition [PVD], e.g. vacuum deposition or sputtering
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
    • H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0451—Apparatus for manufacturing or treating in a plurality of work-stations
    • H10P72/0461—Apparatus for manufacturing or treating in a plurality of work-stations characterised by the presence of two or more transfer chambers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/30—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations
    • H10P72/32—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for conveying, e.g. between different workstations between different workstations
    • H10P72/3202—Mechanical details, e.g. rollers or belts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations
    • H10K59/873—Encapsulations

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Theoretical Computer Science (AREA)
  • Electroluminescent Light Sources (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2022570762A 2020-12-25 2021-12-15 表示装置の製造装置 Active JP7756109B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025168616A JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2020216021 2020-12-25
JP2020216021 2020-12-25
PCT/IB2021/061730 WO2022137022A1 (ja) 2020-12-25 2021-12-15 表示装置の製造装置

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025168616A Division JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Publications (3)

Publication Number Publication Date
JPWO2022137022A1 true JPWO2022137022A1 (https=) 2022-06-30
JPWO2022137022A5 JPWO2022137022A5 (https=) 2024-12-20
JP7756109B2 JP7756109B2 (ja) 2025-10-17

Family

ID=82158882

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2022570762A Active JP7756109B2 (ja) 2020-12-25 2021-12-15 表示装置の製造装置
JP2025168616A Pending JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025168616A Pending JP2025188123A (ja) 2020-12-25 2025-10-06 表示装置の製造装置

Country Status (3)

Country Link
US (1) US20240057462A1 (https=)
JP (2) JP7756109B2 (https=)
WO (1) WO2022137022A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102170A (ja) * 1999-07-23 2001-04-13 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置の作製方法及び薄膜形成装置
JP2002158090A (ja) * 2000-09-08 2002-05-31 Semiconductor Energy Lab Co Ltd 発光装置とその作製方法及び薄膜形成装置
JP2005285576A (ja) * 2004-03-30 2005-10-13 Mitsubishi-Hitachi Metals Machinery Inc インライン式有機エレクトロルミネセンス製造装置
JP2017220410A (ja) * 2016-06-10 2017-12-14 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
JP2018022619A (ja) * 2016-08-04 2018-02-08 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3654597B2 (ja) * 1993-07-15 2005-06-02 株式会社ルネサステクノロジ 製造システムおよび製造方法
US6017820A (en) * 1998-07-17 2000-01-25 Cutek Research, Inc. Integrated vacuum and plating cluster system
US9325007B2 (en) * 2009-10-27 2016-04-26 Applied Materials, Inc. Shadow mask alignment and management system
KR102141205B1 (ko) * 2013-08-16 2020-08-05 삼성디스플레이 주식회사 박막 봉지 제조 장치 및 이를 이용한 표시 장치의 제조 방법
KR102648517B1 (ko) * 2018-03-20 2024-03-15 도쿄엘렉트론가부시키가이샤 통합형 반도체 공정 모듈을 포함하는 자기 인식 및 보정 이종 플랫폼, 및 이를 사용하기 위한 방법
WO2022123381A1 (ja) * 2020-12-07 2022-06-16 株式会社半導体エネルギー研究所 発光デバイスの製造装置
US11860528B2 (en) * 2020-12-21 2024-01-02 Applied Materials, Inc. Multi-chamber substrate processing platform

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2001102170A (ja) * 1999-07-23 2001-04-13 Semiconductor Energy Lab Co Ltd Ｅｌ表示装置の作製方法及び薄膜形成装置
JP2002158090A (ja) * 2000-09-08 2002-05-31 Semiconductor Energy Lab Co Ltd 発光装置とその作製方法及び薄膜形成装置
JP2005285576A (ja) * 2004-03-30 2005-10-13 Mitsubishi-Hitachi Metals Machinery Inc インライン式有機エレクトロルミネセンス製造装置
JP2017220410A (ja) * 2016-06-10 2017-12-14 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法
JP2018022619A (ja) * 2016-08-04 2018-02-08 株式会社ジャパンディスプレイ 積層膜の製造装置、及び積層膜の製造方法

Also Published As

Publication number Publication date
JP7756109B2 (ja) 2025-10-17
US20240057462A1 (en) 2024-02-15
WO2022137022A1 (ja) 2022-06-30
JP2025188123A (ja) 2025-12-25

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