JP7753556B1 - 半導体製造装置用部材 - Google Patents

半導体製造装置用部材

Info

Publication number
JP7753556B1
JP7753556B1 JP2024541275A JP2024541275A JP7753556B1 JP 7753556 B1 JP7753556 B1 JP 7753556B1 JP 2024541275 A JP2024541275 A JP 2024541275A JP 2024541275 A JP2024541275 A JP 2024541275A JP 7753556 B1 JP7753556 B1 JP 7753556B1
Authority
JP
Japan
Prior art keywords
plug
gas flow
flow path
semiconductor manufacturing
manufacturing equipment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2024541275A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025177564A5 (https=
JPWO2025177564A1 (https=
Inventor
征樹 石川
達也 久野
太朗 宇佐美
夏樹 平田
裕佑 小木曽
英明 橋本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NGK Insulators Ltd
Original Assignee
NGK Insulators Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NGK Insulators Ltd filed Critical NGK Insulators Ltd
Publication of JPWO2025177564A1 publication Critical patent/JPWO2025177564A1/ja
Priority to JP2025165768A priority Critical patent/JP2025178461A/ja
Application granted granted Critical
Publication of JP7753556B1 publication Critical patent/JP7753556B1/ja
Publication of JPWO2025177564A5 publication Critical patent/JPWO2025177564A5/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/04—Apparatus for manufacture or treatment
    • H10P72/0431—Apparatus for thermal treatment
    • H10P72/0434—Apparatus for thermal treatment mainly by convection
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
    • H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
    • H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material

Landscapes

  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2024541275A 2024-02-22 2024-02-22 半導体製造装置用部材 Active JP7753556B1 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025165768A JP2025178461A (ja) 2024-02-22 2025-10-01 半導体製造装置用部材

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2024/006631 WO2025177564A1 (ja) 2024-02-22 2024-02-22 半導体製造装置用部材

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025165768A Division JP2025178461A (ja) 2024-02-22 2025-10-01 半導体製造装置用部材

Publications (3)

Publication Number Publication Date
JPWO2025177564A1 JPWO2025177564A1 (https=) 2025-08-28
JP7753556B1 true JP7753556B1 (ja) 2025-10-14
JPWO2025177564A5 JPWO2025177564A5 (https=) 2026-01-28

Family

ID=96810904

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2024541275A Active JP7753556B1 (ja) 2024-02-22 2024-02-22 半導体製造装置用部材
JP2025165768A Pending JP2025178461A (ja) 2024-02-22 2025-10-01 半導体製造装置用部材

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025165768A Pending JP2025178461A (ja) 2024-02-22 2025-10-01 半導体製造装置用部材

Country Status (4)

Country Link
US (1) US20250273507A1 (https=)
JP (2) JP7753556B1 (https=)
TW (1) TW202601888A (https=)
WO (1) WO2025177564A1 (https=)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2020057786A (ja) * 2018-09-28 2020-04-09 日本碍子株式会社 半導体製造装置用部材
JP2020150255A (ja) * 2019-03-05 2020-09-17 Toto株式会社 静電チャック、および処理装置
JP2022119338A (ja) * 2021-02-04 2022-08-17 日本碍子株式会社 半導体製造装置用部材及びプラグ
JP2023056156A (ja) * 2021-10-07 2023-04-19 日本碍子株式会社 半導体製造装置用部材
JP2023106928A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材
JP2023542270A (ja) * 2021-02-17 2023-10-06 アプライド マテリアルズ インコーポレイテッド 多孔性プラグ結合

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6490145B1 (en) * 2001-07-18 2002-12-03 Applied Materials, Inc. Substrate support pedestal
JP2020057786A (ja) * 2018-09-28 2020-04-09 日本碍子株式会社 半導体製造装置用部材
JP2020150255A (ja) * 2019-03-05 2020-09-17 Toto株式会社 静電チャック、および処理装置
JP2022119338A (ja) * 2021-02-04 2022-08-17 日本碍子株式会社 半導体製造装置用部材及びプラグ
JP2023542270A (ja) * 2021-02-17 2023-10-06 アプライド マテリアルズ インコーポレイテッド 多孔性プラグ結合
JP2023056156A (ja) * 2021-10-07 2023-04-19 日本碍子株式会社 半導体製造装置用部材
JP2023106928A (ja) * 2022-01-21 2023-08-02 日本碍子株式会社 半導体製造装置用部材
WO2023153021A1 (ja) * 2022-02-09 2023-08-17 日本碍子株式会社 半導体製造装置用部材

Also Published As

Publication number Publication date
JP2025178461A (ja) 2025-12-05
WO2025177564A1 (ja) 2025-08-28
US20250273507A1 (en) 2025-08-28
TW202601888A (zh) 2026-01-01
JPWO2025177564A1 (https=) 2025-08-28

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