JPWO2025177564A1 - - Google Patents
Info
- Publication number
- JPWO2025177564A1 JPWO2025177564A1 JP2024541275A JP2024541275A JPWO2025177564A1 JP WO2025177564 A1 JPWO2025177564 A1 JP WO2025177564A1 JP 2024541275 A JP2024541275 A JP 2024541275A JP 2024541275 A JP2024541275 A JP 2024541275A JP WO2025177564 A1 JPWO2025177564 A1 JP WO2025177564A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/04—Apparatus for manufacture or treatment
- H10P72/0431—Apparatus for thermal treatment
- H10P72/0434—Apparatus for thermal treatment mainly by convection
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7624—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/72—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using electrostatic chucks
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7614—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of individual support members, e.g. support posts or protrusions
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
- H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
- H10P72/76—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches
- H10P72/7604—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support
- H10P72/7616—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using mechanical means, e.g. clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a coating, a hardness or a material
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2025165768A JP2025178461A (ja) | 2024-02-22 | 2025-10-01 | 半導体製造装置用部材 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2024/006631 WO2025177564A1 (ja) | 2024-02-22 | 2024-02-22 | 半導体製造装置用部材 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025165768A Division JP2025178461A (ja) | 2024-02-22 | 2025-10-01 | 半導体製造装置用部材 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025177564A1 true JPWO2025177564A1 (https=) | 2025-08-28 |
| JP7753556B1 JP7753556B1 (ja) | 2025-10-14 |
| JPWO2025177564A5 JPWO2025177564A5 (https=) | 2026-01-28 |
Family
ID=96810904
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024541275A Active JP7753556B1 (ja) | 2024-02-22 | 2024-02-22 | 半導体製造装置用部材 |
| JP2025165768A Pending JP2025178461A (ja) | 2024-02-22 | 2025-10-01 | 半導体製造装置用部材 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025165768A Pending JP2025178461A (ja) | 2024-02-22 | 2025-10-01 | 半導体製造装置用部材 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US20250273507A1 (https=) |
| JP (2) | JP7753556B1 (https=) |
| TW (1) | TW202601888A (https=) |
| WO (1) | WO2025177564A1 (https=) |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6490145B1 (en) * | 2001-07-18 | 2002-12-03 | Applied Materials, Inc. | Substrate support pedestal |
| US11715652B2 (en) * | 2018-09-28 | 2023-08-01 | Ngk Insulators, Ltd. | Member for semiconductor manufacturing apparatus |
| JP7441402B2 (ja) * | 2019-03-05 | 2024-03-01 | Toto株式会社 | 静電チャック、および処理装置 |
| JP7382978B2 (ja) * | 2021-02-04 | 2023-11-17 | 日本碍子株式会社 | 半導体製造装置用部材及びプラグ |
| KR102779855B1 (ko) * | 2021-02-17 | 2025-03-10 | 어플라이드 머티어리얼스, 인코포레이티드 | 다공성 플러그 본딩 |
| JP7569772B2 (ja) * | 2021-10-07 | 2024-10-18 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7569342B2 (ja) * | 2022-01-21 | 2024-10-17 | 日本碍子株式会社 | 半導体製造装置用部材 |
| JP7483121B2 (ja) * | 2022-02-09 | 2024-05-14 | 日本碍子株式会社 | 半導体製造装置用部材 |
-
2024
- 2024-02-22 WO PCT/JP2024/006631 patent/WO2025177564A1/ja active Pending
- 2024-02-22 JP JP2024541275A patent/JP7753556B1/ja active Active
- 2024-08-26 US US18/814,783 patent/US20250273507A1/en active Pending
- 2024-12-27 TW TW113151119A patent/TW202601888A/zh unknown
-
2025
- 2025-10-01 JP JP2025165768A patent/JP2025178461A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| JP7753556B1 (ja) | 2025-10-14 |
| JP2025178461A (ja) | 2025-12-05 |
| WO2025177564A1 (ja) | 2025-08-28 |
| US20250273507A1 (en) | 2025-08-28 |
| TW202601888A (zh) | 2026-01-01 |
Similar Documents
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