JP7738560B2 - シム処理接着剤 - Google Patents

シム処理接着剤

Info

Publication number
JP7738560B2
JP7738560B2 JP2022537307A JP2022537307A JP7738560B2 JP 7738560 B2 JP7738560 B2 JP 7738560B2 JP 2022537307 A JP2022537307 A JP 2022537307A JP 2022537307 A JP2022537307 A JP 2022537307A JP 7738560 B2 JP7738560 B2 JP 7738560B2
Authority
JP
Japan
Prior art keywords
shim
epoxy resin
adhesive
percent
part curable
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2022537307A
Other languages
English (en)
Japanese (ja)
Other versions
JP2023507404A5 (https=
JP2023507404A (ja
Inventor
エルギミアビ，ソハイブ
スピーカーマン，ステファン
チェン，ライアンヅォウ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of JP2023507404A publication Critical patent/JP2023507404A/ja
Publication of JP2023507404A5 publication Critical patent/JP2023507404A5/ja
Application granted granted Critical
Publication of JP7738560B2 publication Critical patent/JP7738560B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/32—Epoxy compounds containing three or more epoxy groups
    • C08G59/38—Epoxy compounds containing three or more epoxy groups together with di-epoxy compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4246—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof polymers with carboxylic terminal groups
    • C08G59/4253—Rubbers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/50—Amines
    • C08G59/504—Amines containing an atom other than nitrogen belonging to the amine group, carbon and hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/01—Use of inorganic substances as compounding ingredients characterized by their specific function
    • C08K3/013—Fillers, pigments or reinforcing additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C08K3/36—Silica
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00—Use of organic ingredients
    • C08K5/49—Phosphorus-containing compounds
    • C08K5/51—Phosphorus bound to oxygen
    • C08K5/52—Phosphorus bound to oxygen only
    • C08K5/521—Esters of phosphoric acids, e.g. of H3PO4

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Epoxy Resins (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP2022537307A 2019-12-19 2020-12-11 シム処理接着剤 Active JP7738560B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201962950437P 2019-12-19 2019-12-19
US62/950,437 2019-12-19
PCT/IB2020/061832 WO2021124049A1 (en) 2019-12-19 2020-12-11 Shimming adhesive

Publications (3)

Publication Number Publication Date
JP2023507404A JP2023507404A (ja) 2023-02-22
JP2023507404A5 JP2023507404A5 (https=) 2023-12-18
JP7738560B2 true JP7738560B2 (ja) 2025-09-12

Family

ID=74141602

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2022537307A Active JP7738560B2 (ja) 2019-12-19 2020-12-11 シム処理接着剤

Country Status (5)

Country Link
US (1) US12486437B2 (https=)
EP (1) EP4077461A1 (https=)
JP (1) JP7738560B2 (https=)
CN (1) CN114829445B (https=)
WO (1) WO2021124049A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20230066560A1 (en) * 2020-12-11 2023-03-02 The Boeing Company Aircraft with structural gap filler

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012236416A (ja) 2011-05-12 2012-12-06 E I Du Pont De Nemours & Co 印刷版およびビスフェノールベースのエポキシ樹脂を有する硬化性組成物を用いて印刷版を製造するための方法
JP2016523313A (ja) 2013-06-28 2016-08-08 スリーエム イノベイティブ プロパティズ カンパニー シム処理用途のための高弾性率エポキシ接着剤
WO2019036211A1 (en) 2017-08-15 2019-02-21 Dow Global Technologies Llc CURABLE EPOXY CURABLE ADHESIVES WITH TWO-COMPONENT AMBIENT TEMPERATURE
WO2019078044A1 (ja) 2017-10-18 2019-04-25 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5676444B2 (ja) * 2008-07-23 2015-02-25 スリーエム イノベイティブ プロパティズ カンパニー 二液型エポキシ系構造接着剤
US20120024477A1 (en) * 2009-02-06 2012-02-02 Kropp Michael A Room temperature curing epoxy adhesive
CN102307923A (zh) 2009-02-09 2012-01-04 3M创新有限公司 两组分液体垫片组合物
GB201005444D0 (en) 2010-03-31 2010-05-19 3M Innovative Properties Co Epoxy adhesive compositions comprising an adhesion promoter
WO2016137791A1 (en) * 2015-02-27 2016-09-01 3M Innovative Properties Company Two-part structural adhesive
CN107406576B (zh) * 2015-02-27 2019-04-26 3M创新有限公司 包含增韧的固化剂的双组分粘合剂
EP3275913B1 (en) * 2016-07-28 2021-11-10 3M Innovative Properties Company High performance epoxy adhesive compositions
CN110832003B (zh) 2017-06-29 2023-06-20 3M创新有限公司 可固化组合物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012236416A (ja) 2011-05-12 2012-12-06 E I Du Pont De Nemours & Co 印刷版およびビスフェノールベースのエポキシ樹脂を有する硬化性組成物を用いて印刷版を製造するための方法
JP2016523313A (ja) 2013-06-28 2016-08-08 スリーエム イノベイティブ プロパティズ カンパニー シム処理用途のための高弾性率エポキシ接着剤
WO2019036211A1 (en) 2017-08-15 2019-02-21 Dow Global Technologies Llc CURABLE EPOXY CURABLE ADHESIVES WITH TWO-COMPONENT AMBIENT TEMPERATURE
WO2019078044A1 (ja) 2017-10-18 2019-04-25 株式会社スリーボンド 熱伝導性樹脂組成物、硬化物および放熱方法

Also Published As

Publication number Publication date
WO2021124049A1 (en) 2021-06-24
CN114829445B (zh) 2025-06-10
EP4077461A1 (en) 2022-10-26
JP2023507404A (ja) 2023-02-22
US12486437B2 (en) 2025-12-02
US20230002652A1 (en) 2023-01-05
CN114829445A (zh) 2022-07-29

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