JP7734754B2 - 加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法 - Google Patents

加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法

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Publication number
JP7734754B2
JP7734754B2 JP2023553895A JP2023553895A JP7734754B2 JP 7734754 B2 JP7734754 B2 JP 7734754B2 JP 2023553895 A JP2023553895 A JP 2023553895A JP 2023553895 A JP2023553895 A JP 2023553895A JP 7734754 B2 JP7734754 B2 JP 7734754B2
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JP
Japan
Prior art keywords
substrate
mask
processing
laser beam
irradiation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2023553895A
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English (en)
Japanese (ja)
Other versions
JPWO2023062842A1 (https=
JPWO2023062842A5 (https=
Inventor
義和 大谷
裕 山岡
昌実 倉田
健人 宇佐美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Engineering Co Ltd
Original Assignee
Shin Etsu Engineering Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Engineering Co Ltd filed Critical Shin Etsu Engineering Co Ltd
Publication of JPWO2023062842A1 publication Critical patent/JPWO2023062842A1/ja
Publication of JPWO2023062842A5 publication Critical patent/JPWO2023062842A5/ja
Priority to JP2025097131A priority Critical patent/JP2025131795A/ja
Application granted granted Critical
Publication of JP7734754B2 publication Critical patent/JP7734754B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, i.e. roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
JP2023553895A 2021-10-15 2021-10-15 加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法 Active JP7734754B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025097131A JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/038319 WO2023062842A1 (ja) 2021-10-15 2021-10-15 加工装置、加工方法及び基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025097131A Division JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023062842A1 JPWO2023062842A1 (https=) 2023-04-20
JPWO2023062842A5 JPWO2023062842A5 (https=) 2024-07-24
JP7734754B2 true JP7734754B2 (ja) 2025-09-05

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JP2023553895A Active JP7734754B2 (ja) 2021-10-15 2021-10-15 加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法
JP2025097131A Pending JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Family Applications After (1)

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JP2025097131A Pending JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Country Status (8)

Country Link
US (1) US20240399497A1 (https=)
EP (1) EP4417356A4 (https=)
JP (2) JP7734754B2 (https=)
KR (1) KR20240089635A (https=)
CN (1) CN118104402A (https=)
IL (1) IL312023A (https=)
TW (1) TW202317297A (https=)
WO (1) WO2023062842A1 (https=)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223382A (ja) 1998-11-25 2000-08-11 Komatsu Ltd レ―ザビ―ムによる微小ドットマ―ク形態、そのマ―キング方法
JP2015534903A (ja) 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3209641B2 (ja) * 1994-06-02 2001-09-17 三菱電機株式会社 光加工装置及び方法
JPH0866781A (ja) * 1994-08-30 1996-03-12 Mitsubishi Electric Corp エキシマレーザビーム照射装置
JP3259156B2 (ja) * 1995-02-01 2002-02-25 松下電工株式会社 回路基板の表面処理方法
JP3745225B2 (ja) * 1997-12-26 2006-02-15 三菱電機株式会社 レーザ加工装置
JP2001038483A (ja) * 1999-07-27 2001-02-13 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
WO2001023131A1 (en) * 1999-09-28 2001-04-05 Sumitomo Heavy Industries, Ltd. Laser drilling method and laser drilling device
JP2013107125A (ja) * 2011-11-24 2013-06-06 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法及びレーザ加工装置
WO2013094025A1 (ja) * 2011-12-20 2013-06-27 三菱電機株式会社 レーザ加工方法
JP7393087B2 (ja) 2019-09-26 2023-12-06 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000223382A (ja) 1998-11-25 2000-08-11 Komatsu Ltd レ―ザビ―ムによる微小ドットマ―ク形態、そのマ―キング方法
JP2015534903A (ja) 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置

Also Published As

Publication number Publication date
JP2025131795A (ja) 2025-09-09
US20240399497A1 (en) 2024-12-05
EP4417356A1 (en) 2024-08-21
JPWO2023062842A1 (https=) 2023-04-20
IL312023A (en) 2024-06-01
WO2023062842A1 (ja) 2023-04-20
EP4417356A4 (en) 2025-08-20
KR20240089635A (ko) 2024-06-20
CN118104402A (zh) 2024-05-28
TW202317297A (zh) 2023-05-01

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