JPWO2023062842A1 - - Google Patents

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Publication number
JPWO2023062842A1
JPWO2023062842A1 JP2023553895A JP2023553895A JPWO2023062842A1 JP WO2023062842 A1 JPWO2023062842 A1 JP WO2023062842A1 JP 2023553895 A JP2023553895 A JP 2023553895A JP 2023553895 A JP2023553895 A JP 2023553895A JP WO2023062842 A1 JPWO2023062842 A1 JP WO2023062842A1
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JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2023553895A
Other languages
Japanese (ja)
Other versions
JPWO2023062842A5 (https=
JP7734754B2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed filed Critical
Publication of JPWO2023062842A1 publication Critical patent/JPWO2023062842A1/ja
Publication of JPWO2023062842A5 publication Critical patent/JPWO2023062842A5/ja
Priority to JP2025097131A priority Critical patent/JP2025131795A/ja
Application granted granted Critical
Publication of JP7734754B2 publication Critical patent/JP7734754B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/066—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms by using masks
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/03—Observing, e.g. monitoring, the workpiece
    • B23K26/032—Observing, e.g. monitoring, the workpiece using optical means
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
    • B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/073—Shaping the laser spot
    • B23K26/0732—Shaping the laser spot into a rectangular shape
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/08—Devices involving relative movement between laser beam and workpiece
    • B23K26/083—Devices involving movement of the workpiece in at least one axial direction
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/355—Texturing
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
    • B23K26/3568—Modifying rugosity
    • B23K26/3584—Increasing rugosity, i.e. roughening
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/362—Laser etching
    • B23K26/364—Laser etching for making a groove or trench, e.g. for scribing a break initiation groove
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/70—Auxiliary operations or equipment
    • B23K26/702—Auxiliary equipment
    • B23K26/703—Cooling arrangements
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic materials other than metals or composite materials
    • B23K2103/56—Inorganic materials other than metals or composite materials being semiconducting

Landscapes

  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Laser Beam Processing (AREA)
  • Surface Treatment Of Glass (AREA)
JP2023553895A 2021-10-15 2021-10-15 加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法 Active JP7734754B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2025097131A JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2021/038319 WO2023062842A1 (ja) 2021-10-15 2021-10-15 加工装置、加工方法及び基板の製造方法

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2025097131A Division JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Publications (3)

Publication Number Publication Date
JPWO2023062842A1 true JPWO2023062842A1 (https=) 2023-04-20
JPWO2023062842A5 JPWO2023062842A5 (https=) 2024-07-24
JP7734754B2 JP7734754B2 (ja) 2025-09-05

Family

ID=85988186

Family Applications (2)

Application Number Title Priority Date Filing Date
JP2023553895A Active JP7734754B2 (ja) 2021-10-15 2021-10-15 加工装置、加工方法、基板の製造方法、及び半導体パッケージの製造方法
JP2025097131A Pending JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2025097131A Pending JP2025131795A (ja) 2021-10-15 2025-06-10 加工装置、加工方法、基板の製造方法、半導体パッケージの製造方法、及び配線の製造方法

Country Status (8)

Country Link
US (1) US20240399497A1 (https=)
EP (1) EP4417356A4 (https=)
JP (2) JP7734754B2 (https=)
KR (1) KR20240089635A (https=)
CN (1) CN118104402A (https=)
IL (1) IL312023A (https=)
TW (1) TW202317297A (https=)
WO (1) WO2023062842A1 (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0847790A (ja) * 1994-06-02 1996-02-20 Mitsubishi Electric Corp 光加工装置及び方法
JPH08213740A (ja) * 1995-02-01 1996-08-20 Matsushita Electric Works Ltd 回路基板の表面処理方法
WO1999033603A1 (fr) * 1997-12-26 1999-07-08 Mitsubishi Denki Kabushiki Kaisha Appareil d'usinage au laser
JP2000223382A (ja) * 1998-11-25 2000-08-11 Komatsu Ltd レ―ザビ―ムによる微小ドットマ―ク形態、そのマ―キング方法
JP2015534903A (ja) * 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0866781A (ja) * 1994-08-30 1996-03-12 Mitsubishi Electric Corp エキシマレーザビーム照射装置
JP2001038483A (ja) * 1999-07-27 2001-02-13 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
JP2001079678A (ja) 1999-09-13 2001-03-27 Sumitomo Heavy Ind Ltd レーザ穴あけ加工方法及び加工装置
WO2001023131A1 (en) * 1999-09-28 2001-04-05 Sumitomo Heavy Industries, Ltd. Laser drilling method and laser drilling device
JP2013107125A (ja) * 2011-11-24 2013-06-06 Mitsuboshi Diamond Industrial Co Ltd レーザ加工方法及びレーザ加工装置
WO2013094025A1 (ja) * 2011-12-20 2013-06-27 三菱電機株式会社 レーザ加工方法
JP7393087B2 (ja) 2019-09-26 2023-12-06 株式会社オーク製作所 アブレーション加工用の加工装置および加工方法

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0847790A (ja) * 1994-06-02 1996-02-20 Mitsubishi Electric Corp 光加工装置及び方法
JPH08213740A (ja) * 1995-02-01 1996-08-20 Matsushita Electric Works Ltd 回路基板の表面処理方法
WO1999033603A1 (fr) * 1997-12-26 1999-07-08 Mitsubishi Denki Kabushiki Kaisha Appareil d'usinage au laser
JP2000223382A (ja) * 1998-11-25 2000-08-11 Komatsu Ltd レ―ザビ―ムによる微小ドットマ―ク形態、そのマ―キング方法
JP2015534903A (ja) * 2012-11-02 2015-12-07 エム−ソルヴ・リミテッド 誘電体基板内に微細スケール構造を形成するための方法及び装置

Also Published As

Publication number Publication date
JP2025131795A (ja) 2025-09-09
US20240399497A1 (en) 2024-12-05
EP4417356A1 (en) 2024-08-21
IL312023A (en) 2024-06-01
WO2023062842A1 (ja) 2023-04-20
EP4417356A4 (en) 2025-08-20
KR20240089635A (ko) 2024-06-20
CN118104402A (zh) 2024-05-28
TW202317297A (zh) 2023-05-01
JP7734754B2 (ja) 2025-09-05

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