JP7733803B2 - 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材 - Google Patents

窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材

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Publication number
JP7733803B2
JP7733803B2 JP2024502948A JP2024502948A JP7733803B2 JP 7733803 B2 JP7733803 B2 JP 7733803B2 JP 2024502948 A JP2024502948 A JP 2024502948A JP 2024502948 A JP2024502948 A JP 2024502948A JP 7733803 B2 JP7733803 B2 JP 7733803B2
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Japan
Prior art keywords
mass
boron nitride
acid
boron
nitride powder
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JP2024502948A
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English (en)
Japanese (ja)
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JPWO2023162598A1 (https=
Inventor
豪 竹田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Denka Co Ltd
Original Assignee
Denka Co Ltd
Denki Kagaku Kogyo KK
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Publication of JPWO2023162598A1 publication Critical patent/JPWO2023162598A1/ja
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Classifications

    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
    • C01B21/00—Nitrogen; Compounds thereof
    • C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
    • C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/50—Agglomerated particles
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2004/00—Particle morphology
    • C01P2004/60—Particles characterised by their size
    • C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
    • C—CHEMISTRY; METALLURGY
    • C01—INORGANIC CHEMISTRY
    • C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
    • C01P2006/00—Physical properties of inorganic compounds
    • C01P2006/80—Compositional purity

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Inorganic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Engineering & Computer Science (AREA)
  • Ceramic Engineering (AREA)
JP2024502948A 2022-02-22 2023-01-31 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材 Active JP7733803B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2022025349 2022-02-22
JP2022025349 2022-02-22
PCT/JP2023/003085 WO2023162598A1 (ja) 2022-02-22 2023-01-31 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材

Publications (2)

Publication Number Publication Date
JPWO2023162598A1 JPWO2023162598A1 (https=) 2023-08-31
JP7733803B2 true JP7733803B2 (ja) 2025-09-03

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JP2024502948A Active JP7733803B2 (ja) 2022-02-22 2023-01-31 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材

Country Status (4)

Country Link
JP (1) JP7733803B2 (https=)
KR (1) KR20240146066A (https=)
CN (1) CN118647575A (https=)
WO (1) WO2023162598A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2025185559A (ja) * 2024-06-10 2025-12-22 株式会社トクヤマ 六方晶窒化ホウ素粉末。

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122379A1 (ja) 2014-02-12 2015-08-20 電気化学工業株式会社 球状窒化ホウ素微粒子およびその製造方法
WO2019073690A1 (ja) 2017-10-13 2019-04-18 デンカ株式会社 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材
WO2020004600A1 (ja) 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
JP2021116203A (ja) 2020-01-24 2021-08-10 デンカ株式会社 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法
JP2021116202A (ja) 2020-01-24 2021-08-10 デンカ株式会社 六方晶窒化ホウ素粉末、及び焼結体原料組成物
WO2021200966A1 (ja) 2020-03-31 2021-10-07 デンカ株式会社 窒化ホウ素焼結体及び複合体、並びに放熱部材

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6794613B2 (ja) 2014-02-05 2020-12-02 三菱ケミカル株式会社 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、及び成形体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015122379A1 (ja) 2014-02-12 2015-08-20 電気化学工業株式会社 球状窒化ホウ素微粒子およびその製造方法
WO2019073690A1 (ja) 2017-10-13 2019-04-18 デンカ株式会社 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材
WO2020004600A1 (ja) 2018-06-29 2020-01-02 デンカ株式会社 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材
JP2021116203A (ja) 2020-01-24 2021-08-10 デンカ株式会社 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法
JP2021116202A (ja) 2020-01-24 2021-08-10 デンカ株式会社 六方晶窒化ホウ素粉末、及び焼結体原料組成物
WO2021200966A1 (ja) 2020-03-31 2021-10-07 デンカ株式会社 窒化ホウ素焼結体及び複合体、並びに放熱部材

Also Published As

Publication number Publication date
CN118647575A (zh) 2024-09-13
WO2023162598A1 (ja) 2023-08-31
KR20240146066A (ko) 2024-10-07
JPWO2023162598A1 (https=) 2023-08-31

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