KR20240146066A - 질화붕소 분말의 제조 방법, 질화붕소 분말 및 수지 밀봉재 - Google Patents
질화붕소 분말의 제조 방법, 질화붕소 분말 및 수지 밀봉재 Download PDFInfo
- Publication number
- KR20240146066A KR20240146066A KR1020247030739A KR20247030739A KR20240146066A KR 20240146066 A KR20240146066 A KR 20240146066A KR 1020247030739 A KR1020247030739 A KR 1020247030739A KR 20247030739 A KR20247030739 A KR 20247030739A KR 20240146066 A KR20240146066 A KR 20240146066A
- Authority
- KR
- South Korea
- Prior art keywords
- mass
- boron nitride
- acid
- nitride powder
- boron
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
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- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H01L23/291—
-
- H01L23/373—
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/50—Agglomerated particles
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022025349 | 2022-02-22 | ||
| JPJP-P-2022-025349 | 2022-02-22 | ||
| PCT/JP2023/003085 WO2023162598A1 (ja) | 2022-02-22 | 2023-01-31 | 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| KR20240146066A true KR20240146066A (ko) | 2024-10-07 |
Family
ID=87765623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020247030739A Pending KR20240146066A (ko) | 2022-02-22 | 2023-01-31 | 질화붕소 분말의 제조 방법, 질화붕소 분말 및 수지 밀봉재 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7733803B2 (https=) |
| KR (1) | KR20240146066A (https=) |
| CN (1) | CN118647575A (https=) |
| WO (1) | WO2023162598A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025185559A (ja) * | 2024-06-10 | 2025-12-22 | 株式会社トクヤマ | 六方晶窒化ホウ素粉末。 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016135731A (ja) | 2014-02-05 | 2016-07-28 | 三菱化学株式会社 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、及び成形体 |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6467650B2 (ja) | 2014-02-12 | 2019-02-13 | デンカ株式会社 | 球状窒化ホウ素微粒子およびその製造方法 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| CN112334408B (zh) * | 2018-06-29 | 2023-10-10 | 电化株式会社 | 块状氮化硼粒子、氮化硼粉末、氮化硼粉末的制造方法、树脂组合物、及散热构件 |
| JP7356364B2 (ja) | 2020-01-24 | 2023-10-04 | デンカ株式会社 | 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法 |
| JP7317737B2 (ja) | 2020-01-24 | 2023-07-31 | デンカ株式会社 | 六方晶窒化ホウ素粉末、及び焼結体原料組成物 |
| JPWO2021200966A1 (https=) | 2020-03-31 | 2021-10-07 |
-
2023
- 2023-01-31 JP JP2024502948A patent/JP7733803B2/ja active Active
- 2023-01-31 KR KR1020247030739A patent/KR20240146066A/ko active Pending
- 2023-01-31 WO PCT/JP2023/003085 patent/WO2023162598A1/ja not_active Ceased
- 2023-01-31 CN CN202380020380.2A patent/CN118647575A/zh active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016135731A (ja) | 2014-02-05 | 2016-07-28 | 三菱化学株式会社 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、及び成形体 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118647575A (zh) | 2024-09-13 |
| WO2023162598A1 (ja) | 2023-08-31 |
| JP7733803B2 (ja) | 2025-09-03 |
| JPWO2023162598A1 (https=) | 2023-08-31 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PA0105 | International application |
St.27 status event code: A-0-1-A10-A15-nap-PA0105 |
|
| PA0201 | Request for examination |
St.27 status event code: A-1-2-D10-D11-exm-PA0201 |
|
| PG1501 | Laying open of application |
St.27 status event code: A-1-1-Q10-Q12-nap-PG1501 |
|
| P22-X000 | Classification modified |
St.27 status event code: A-2-2-P10-P22-nap-X000 |
|
| D21 | Rejection of application intended |
Free format text: ST27 STATUS EVENT CODE: A-1-2-D10-D21-EXM-PE0902 (AS PROVIDED BY THE NATIONAL OFFICE) |
|
| PE0902 | Notice of grounds for rejection |
St.27 status event code: A-1-2-D10-D21-exm-PE0902 |