JPWO2023162598A1 - - Google Patents
Info
- Publication number
- JPWO2023162598A1 JPWO2023162598A1 JP2024502948A JP2024502948A JPWO2023162598A1 JP WO2023162598 A1 JPWO2023162598 A1 JP WO2023162598A1 JP 2024502948 A JP2024502948 A JP 2024502948A JP 2024502948 A JP2024502948 A JP 2024502948A JP WO2023162598 A1 JPWO2023162598 A1 JP WO2023162598A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01B—NON-METALLIC ELEMENTS; COMPOUNDS THEREOF; METALLOIDS OR COMPOUNDS THEREOF NOT COVERED BY SUBCLASS C01C
- C01B21/00—Nitrogen; Compounds thereof
- C01B21/06—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron
- C01B21/064—Binary compounds of nitrogen with metals, with silicon, or with boron, or with carbon, i.e. nitrides; Compounds of nitrogen with more than one metal, silicon or boron with boron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/38—Boron-containing compounds
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/20—Arrangements for cooling
- H10W40/25—Arrangements for cooling characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W74/00—Encapsulations, e.g. protective coatings
- H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
- H10W74/43—Encapsulations, e.g. protective coatings characterised by their materials comprising oxides, nitrides or carbides, e.g. ceramics or glasses
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/50—Agglomerated particles
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/80—Compositional purity
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2022025349 | 2022-02-22 | ||
| JP2022025349 | 2022-02-22 | ||
| PCT/JP2023/003085 WO2023162598A1 (ja) | 2022-02-22 | 2023-01-31 | 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2023162598A1 true JPWO2023162598A1 (https=) | 2023-08-31 |
| JP7733803B2 JP7733803B2 (ja) | 2025-09-03 |
Family
ID=87765623
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2024502948A Active JP7733803B2 (ja) | 2022-02-22 | 2023-01-31 | 窒化ホウ素粉末の製造方法、窒化ホウ素粉末及び樹脂封止材 |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP7733803B2 (https=) |
| KR (1) | KR20240146066A (https=) |
| CN (1) | CN118647575A (https=) |
| WO (1) | WO2023162598A1 (https=) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2025185559A (ja) * | 2024-06-10 | 2025-12-22 | 株式会社トクヤマ | 六方晶窒化ホウ素粉末。 |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015122379A1 (ja) * | 2014-02-12 | 2015-08-20 | 電気化学工業株式会社 | 球状窒化ホウ素微粒子およびその製造方法 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
| JP2021116203A (ja) * | 2020-01-24 | 2021-08-10 | デンカ株式会社 | 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法 |
| JP2021116202A (ja) * | 2020-01-24 | 2021-08-10 | デンカ株式会社 | 六方晶窒化ホウ素粉末、及び焼結体原料組成物 |
| WO2021200966A1 (ja) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | 窒化ホウ素焼結体及び複合体、並びに放熱部材 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6794613B2 (ja) | 2014-02-05 | 2020-12-02 | 三菱ケミカル株式会社 | 窒化ホウ素凝集粒子、窒化ホウ素凝集粒子の製造方法、該窒化ホウ素凝集粒子含有樹脂組成物、及び成形体 |
-
2023
- 2023-01-31 JP JP2024502948A patent/JP7733803B2/ja active Active
- 2023-01-31 KR KR1020247030739A patent/KR20240146066A/ko active Pending
- 2023-01-31 WO PCT/JP2023/003085 patent/WO2023162598A1/ja not_active Ceased
- 2023-01-31 CN CN202380020380.2A patent/CN118647575A/zh active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2015122379A1 (ja) * | 2014-02-12 | 2015-08-20 | 電気化学工業株式会社 | 球状窒化ホウ素微粒子およびその製造方法 |
| WO2019073690A1 (ja) * | 2017-10-13 | 2019-04-18 | デンカ株式会社 | 窒化ホウ素粉末、その製造方法及びそれを用いた放熱部材 |
| WO2020004600A1 (ja) * | 2018-06-29 | 2020-01-02 | デンカ株式会社 | 塊状窒化ホウ素粒子、窒化ホウ素粉末、窒化ホウ素粉末の製造方法、樹脂組成物、及び放熱部材 |
| JP2021116203A (ja) * | 2020-01-24 | 2021-08-10 | デンカ株式会社 | 六方晶窒化ホウ素粉末、及び六方晶窒化ホウ素粉末の製造方法 |
| JP2021116202A (ja) * | 2020-01-24 | 2021-08-10 | デンカ株式会社 | 六方晶窒化ホウ素粉末、及び焼結体原料組成物 |
| WO2021200966A1 (ja) * | 2020-03-31 | 2021-10-07 | デンカ株式会社 | 窒化ホウ素焼結体及び複合体、並びに放熱部材 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN118647575A (zh) | 2024-09-13 |
| WO2023162598A1 (ja) | 2023-08-31 |
| KR20240146066A (ko) | 2024-10-07 |
| JP7733803B2 (ja) | 2025-09-03 |
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